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XCKU025-1FFVA1156I

Name: XCKU025-1FFVA1156I
Rating: 4.7 (12 reviews)

IC FPGA 312 I/O 1156FCBGA

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Mfr。パート #XCKU025-1FFVA1156I
パッケージ 1156-BBGA, FCBGA
データシート
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仕様

Supplier	AMD Xilinx
Package	Bulk
Series	Kintex® UltraScale™
ProductStatus	Active
NumberofLABs/CLBs	18180
NumberofLogicElements/Cells	318150
TotalRAMBits	13004800
NumberofI/O	312
Voltage-Supply	0.922V ~ 0.979V
MountingType	Surface Mount
OperatingTemperature	-40°C ~ 100°C (TJ)
Package/Case	1156-BBGA, FCBGA

概要

Description

XCKU025-1FFVA1156I is a Xilinx Kintex UltraScale FPGA. It sits in the Kintex UltraScale family, offering a strong balance of performance, capacity, and power for mid-to-high end designs. It comes in an FFVA1156 1156-ball Fine-pitch BGA package with industrial temperature range (-I) and speed grade -1 (fastest). The device provides a large amount of logic (LUTs/FFs), DSP slices, Block RAM and UltraRAM, plus multi-gigabit transceivers and robust clocking resources. It supports diverse I/O banks and standards, high-speed serial interfaces (e.g., PCIe/SerDes, Ethernet), and memory interfaces. Vivado and Xilinx IP enable design entry, synthesis, placement & routing, and partial reconfiguration. Typical applications include high-throughput data paths, communications, DSP, and embedded control systems. For exact counts of LUTs, BRAM/UltraRAM, DSP blocks, and transceiver capabilities, refer to the XCKU025-1FFVA1156I datasheet and user guide.

Features

Concise features of XCKU025-1FFVA1156I:
- Family: Kintex UltraScale FPGA (KU series)
- Logic resources: ~25,000 logic cells (KU025)
- Speed grade: -1
- Package: FFVA1156I (1156-ball flip-chip BGA)
- Temp range: Industrial (-40°C to 100°C)
- High-speed I/O: multiple I/O banks with assorted standards (LVDS, CMOS, SSTL/HSTL, etc.)
- SERDES/transceivers: multi-Gbps high-speed transceivers (GT/GTH-like) per channel
- DSP: DSP slices for fast numeric processing
- Block RAM: substantial BRAM/memory resources for buffering and caches
- Clocking: rich PLLs and clocking resources for complex designs
- Applications: high-performance data processing, networking/telecom, RF, video, and DSP-heavy tasks
Note: exact counts for transceivers, BRAM, and DSP slices vary by device revision; the above reflects typical, core capabilities of XCKU025 in the FFVA1156I package.

Package

Package: FFVA1156 – Flip-Chip Ball Grid Array with 1156 balls; Industrial temperature variant (I).

Pinout

- Pin count: 1156 pins (FFVA1156 flip-chip BGA package).
- Function: Xilinx Kintex UltraScale FPGA (XCKU025) with about 25K logic cells, DSP, block RAM, and high-speed transceivers for programmable logic and high-performance digital designs (Industrial temperature grade, -I).

Manufacturer

Manufacturer: Xilinx, Inc. (now part of AMD as AMD Xilinx).
What kind of company: An American multinational semiconductor company that designs and manufactures programmable logic devices, notably FPGAs, CPLDs, and SoCs used in embedded, communications, and data-processing applications.

Application

XCKU025-1FFVA1156I is a mid-range Kintex UltraScale FPGA suitable for:
- High-speed networking (SERDES, 10/40/100G traditions)
- Data-center/compute accelerators (FPGA NICs, encryption, compression)
- Video, imaging and vision pipelines (real-time 4K/HD analytics)
- DSP-heavy applications (radar, SDR, beamforming)
- Industrial automation, test & measurement
- Prototyping and research (mixed-signal I/O, rapid iteration)
Supports PCIe endpoints and memory interfaces.