画像は参照用のみです。
XCZU9EG-1FFVB1156I
IC SOC CORTEX-A53 1156FCBGA
- メーカー
- Mfr。パート #XCZU9EG-1FFVB1156I
- パッケージ
- データシート
- 在庫中3572
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
RFQおよびもっと割引を得る
仕様
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |
| Base Product Number | XCZU9 |
概要
Description
The XCZU9EG-1FFVB1156I is a member of Xilinx's Zynq UltraScale+ MPSoC family, designed for high-performance applications requiring advanced processing capabilities. This device integrates a powerful ARM Cortex-A53 quad-core processor and a dual-core ARM Cortex-R5 real-time processor, alongside a programmable logic fabric featuring FPGA capabilities. It operates at a maximum clock frequency of 1.5 GHz.
With 9,000 logic cells and a rich set of I/O options, the XCZU9EG is ideal for applications in telecommunications, automotive, industrial automation, and machine learning. It supports various communication protocols and has extensive on-chip memory and high bandwidth memory interfaces.
The "1FFVB1156I" designation indicates its specific package and temperature range, where "FFVB" denotes a fine-pitch ball grid array (FBGA) package, and "I" signifies an industrial-grade temperature range. This device is suitable for applications needing robust performance, flexibility, and reliability in challenging environments.
With 9,000 logic cells and a rich set of I/O options, the XCZU9EG is ideal for applications in telecommunications, automotive, industrial automation, and machine learning. It supports various communication protocols and has extensive on-chip memory and high bandwidth memory interfaces.
The "1FFVB1156I" designation indicates its specific package and temperature range, where "FFVB" denotes a fine-pitch ball grid array (FBGA) package, and "I" signifies an industrial-grade temperature range. This device is suitable for applications needing robust performance, flexibility, and reliability in challenging environments.
Features
The XCZU9EG-1FFVB1156I is a member of the Xilinx Zynq UltraScale+ MPSoC family, designed for high-performance applications. Key features include:
1. Architecture: Combines a quad-core ARM Cortex-A53 processor with dual-core ARM Cortex-R5 real-time processors for robust processing capabilities.
2. FPGA Fabric: Integrates programmable logic with up to 504K logic cells, enabling customized hardware acceleration.
3. Memory Support: Features support for DDR4/3/2, providing high bandwidth for memory-intensive applications.
4. High-Speed I/O: Includes multiple high-speed transceivers (up to 28 Gbps) and various interface options like PCIe, USB, and Ethernet.
5. DSP Slices: Contains DSP slices for efficient processing of complex algorithms, ideal for applications in signal processing.
6. Power Management: Offers advanced power management features for energy-efficient operation.
7. Security Features: Includes built-in security mechanisms to protect designs and data integrity.
These attributes make the XCZU9EG-1FFVB1156I suitable for applications in telecommunications, automotive, industrial automation, and more.
1. Architecture: Combines a quad-core ARM Cortex-A53 processor with dual-core ARM Cortex-R5 real-time processors for robust processing capabilities.
2. FPGA Fabric: Integrates programmable logic with up to 504K logic cells, enabling customized hardware acceleration.
3. Memory Support: Features support for DDR4/3/2, providing high bandwidth for memory-intensive applications.
4. High-Speed I/O: Includes multiple high-speed transceivers (up to 28 Gbps) and various interface options like PCIe, USB, and Ethernet.
5. DSP Slices: Contains DSP slices for efficient processing of complex algorithms, ideal for applications in signal processing.
6. Power Management: Offers advanced power management features for energy-efficient operation.
7. Security Features: Includes built-in security mechanisms to protect designs and data integrity.
These attributes make the XCZU9EG-1FFVB1156I suitable for applications in telecommunications, automotive, industrial automation, and more.
Package
The XCZU9EG-1FFVB1156I is packaged in a FFG (Fine Pitch Ball Grid Array) package type, specifically a 1156-ball configuration. This design allows for efficient thermal management and high-density interconnections suitable for advanced applications.
Pinout
The XCZU9EG-1FFVB1156I is part of Xilinx's Zynq UltraScale+ MPSoC family. It features a pin count of 1156 pins.
This device integrates a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 processor, programmable logic (FPGA), and various peripherals. The I/O pins support multiple functions, including general-purpose I/O (GPIO), high-speed interfaces (e.g., PCIe, USB, SDIO), and various communication protocols (e.g., I²C, SPI, UART).
Additionally, the device provides dedicated pins for power, ground, and configuration, supporting versatile applications in areas like automotive, industrial, and telecommunications. The device is available in a fine-pitch ball grid array (FBGA) package, ensuring a compact design suitable for dense layouts.
This device integrates a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 processor, programmable logic (FPGA), and various peripherals. The I/O pins support multiple functions, including general-purpose I/O (GPIO), high-speed interfaces (e.g., PCIe, USB, SDIO), and various communication protocols (e.g., I²C, SPI, UART).
Additionally, the device provides dedicated pins for power, ground, and configuration, supporting versatile applications in areas like automotive, industrial, and telecommunications. The device is available in a fine-pitch ball grid array (FBGA) package, ensuring a compact design suitable for dense layouts.
Manufacturer
The XCZU9EG-1FFVB1156I is manufactured by Xilinx, Inc., which is a technology company specializing in programmable logic devices, including field-programmable gate arrays (FPGAs), system-on-chips (SoCs), and other integrated circuits. Founded in 1984 and headquartered in San Jose, California, Xilinx is known for its innovative solutions in the fields of data center, automotive, aerospace, and industrial applications. The company focuses on providing high-performance, adaptive computing technologies that enable engineers to design and implement complex digital systems more efficiently. In October 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further expanding AMD's capabilities in the semiconductor market.
Application
The XCZU9EG-1FFVB1156I is a versatile FPGA from Xilinx's Zynq UltraScale+ series, suitable for applications in advanced computing, data processing, and connectivity. Key areas include telecommunications, automotive systems, industrial automation, robotics, machine learning, and high-performance computing. Its integration of programmable logic and ARM processors facilitates edge computing, AI inference, and real-time data analysis in diverse embedded systems.
Equivalent
The XCZU9EG-1FFVB1156I is a Xilinx Zynq UltraScale+ MPSoC. Equivalent products include:
1. Intel (Altera) Cyclone 10 GX - for similar FPGA capabilities.
2. Lattice ECP5 - for lower power applications.
3. Microsemi (now part of Microchip) SmartFusion2 - for integrated ARM and FPGA solutions.
4. Xilinx Zynq 7000 series - for lower performance requirements.
However, exact equivalents may vary based on specific application needs, so it's advisable to consider performance specifications, resources, and features.
1. Intel (Altera) Cyclone 10 GX - for similar FPGA capabilities.
2. Lattice ECP5 - for lower power applications.
3. Microsemi (now part of Microchip) SmartFusion2 - for integrated ARM and FPGA solutions.
4. Xilinx Zynq 7000 series - for lower performance requirements.
However, exact equivalents may vary based on specific application needs, so it's advisable to consider performance specifications, resources, and features.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
支払い
Payment Methods
支払い期間は100%前払いです。
現在、下記の支払い方法のみを受け入れています。:
1. ペイパル
2. クレジット・デビットカード
3. ワイヤー 転送
類似
-
MX25L3233FZBI-08Q
Macronix
-
MX25L3233FM1I-08Q
Macronix
-
MX25V2033FM1I
Macronix
-
MX25V16066M2I02
Macronix
-
MX30LF2G28AD-TI
Macronix
-
MX25L8035EM2I-10G
Macronix
-
MX25R6435FBDIL0
Macronix
-
MX25L25673GMI-08G
Macronix
-
MX29GL512FHXFI-11..
Macronix
-
MX25V1635FM2I
Macronix
-
MX25L12833FZ2I-10..
Macronix
-
MX25L12833FZNI-10..
Macronix