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XCZU7EV-2FBVB900E
IC SOC CORTEX-A53 900FCBGA
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- Mfr。パート #XCZU7EV-2FBVB900E
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仕様
| Series | Zynq® UltraScale+™ MPSoC EV |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| Base Product Number | XCZU7 |
概要
Description
The XCZU7EV-2FBVB900E is a member of Xilinx's Zynq UltraScale+ family, which integrates a powerful ARM-based processing system with programmable logic (FPGA). This specific variant features a dual-core ARM Cortex-A53 and a dual-core ARM Cortex-R5, providing a versatile computing platform suitable for a wide range of applications, including embedded systems, automotive, and industrial automation.
With 7 series architecture, it offers high performance and low power consumption. The “FBVB900” package indicates a ball grid array (BGA) configuration, which is suitable for high-density designs. The device supports various communication interfaces, including PCIe, Ethernet, and USB, making it ideal for complex data processing tasks.
The XCZU7EV-2FBVB900E is designed for high-bandwidth applications, with up to 500K logic cells and extensive DSP resources, enabling efficient handling of signal processing and intensive computational tasks. Its flexibility allows developers to implement custom hardware accelerators while leveraging the ARM cores for system control and high-level tasks. Overall, it provides a robust platform for developing advanced, heterogeneous computing solutions.
With 7 series architecture, it offers high performance and low power consumption. The “FBVB900” package indicates a ball grid array (BGA) configuration, which is suitable for high-density designs. The device supports various communication interfaces, including PCIe, Ethernet, and USB, making it ideal for complex data processing tasks.
The XCZU7EV-2FBVB900E is designed for high-bandwidth applications, with up to 500K logic cells and extensive DSP resources, enabling efficient handling of signal processing and intensive computational tasks. Its flexibility allows developers to implement custom hardware accelerators while leveraging the ARM cores for system control and high-level tasks. Overall, it provides a robust platform for developing advanced, heterogeneous computing solutions.
Features
The XCZU7EV-2FBVB900E is a member of Xilinx's Zynq UltraScale+ MPSoC family, combining a powerful ARM Cortex-A53 quad-core processor with a dual-core Cortex-R5 real-time processor and programmable FPGA fabric. Key features include:
1. Processing System: Quad-core ARM Cortex-A53 with up to 1.5 GHz, and dual-core ARM Cortex-R5 for real-time applications.
2. FPGA Fabric: Configurable logic with a significant number of programmable LUTs and DSP slices, ideal for custom hardware acceleration.
3. Memory Interface: Supports DDR4/DDR3 memory interfaces, enabling high-speed data processing.
4. I/O Capabilities: Multiple high-speed I/O interfaces including PCIe, USB, and Ethernet, allowing for versatile connectivity.
5. Power Efficiency: Optimized for performance-per-watt, making it suitable for embedded applications.
6. Security Features: Includes hardware security features for secure boot and data protection.
This device is widely used in applications such as automotive, industrial automation, and communications, providing a balance of processing power and flexibility.
1. Processing System: Quad-core ARM Cortex-A53 with up to 1.5 GHz, and dual-core ARM Cortex-R5 for real-time applications.
2. FPGA Fabric: Configurable logic with a significant number of programmable LUTs and DSP slices, ideal for custom hardware acceleration.
3. Memory Interface: Supports DDR4/DDR3 memory interfaces, enabling high-speed data processing.
4. I/O Capabilities: Multiple high-speed I/O interfaces including PCIe, USB, and Ethernet, allowing for versatile connectivity.
5. Power Efficiency: Optimized for performance-per-watt, making it suitable for embedded applications.
6. Security Features: Includes hardware security features for secure boot and data protection.
This device is widely used in applications such as automotive, industrial automation, and communications, providing a balance of processing power and flexibility.
Package
The XCZU7EV-2FBVB900E is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically a B900 package. This package type features a grid of solder balls on the underside for surface mounting on printed circuit boards, providing high-density interconnections.
Pinout
The XCZU7EV-2FBVB900E is a member of the Xilinx Zynq UltraScale+ MPSoC family. It features a pin count of 900 pins.
The device integrates a combination of programmable logic and ARM Cortex-A53 and Cortex-R5 processing systems. The main functions of the XCZU7EV include:
1. Programmable Logic: Configurable logic blocks for custom hardware implementations.
2. Processing System: Dual-core ARM Cortex-A53 for high-performance applications and dual-core ARM Cortex-R5 for real-time tasks.
3. Memory Interfaces: Supports various memory types, including DDR4 and LPDDR4.
4. High-Speed Connectivity: Includes multiple high-speed transceivers for communication protocols such as PCIe, Gigabit Ethernet, and others.
5. I/O: General-purpose I/O pins for interfacing with peripherals and external components.
Overall, the XCZU7EV-2FBVB900E is designed for high-performance embedded applications, offering a blend of processing capability and adaptable hardware resources.
The device integrates a combination of programmable logic and ARM Cortex-A53 and Cortex-R5 processing systems. The main functions of the XCZU7EV include:
1. Programmable Logic: Configurable logic blocks for custom hardware implementations.
2. Processing System: Dual-core ARM Cortex-A53 for high-performance applications and dual-core ARM Cortex-R5 for real-time tasks.
3. Memory Interfaces: Supports various memory types, including DDR4 and LPDDR4.
4. High-Speed Connectivity: Includes multiple high-speed transceivers for communication protocols such as PCIe, Gigabit Ethernet, and others.
5. I/O: General-purpose I/O pins for interfacing with peripherals and external components.
Overall, the XCZU7EV-2FBVB900E is designed for high-performance embedded applications, offering a blend of processing capability and adaptable hardware resources.
Manufacturer
The XCZU7EV-2FBVB900E is manufactured by Xilinx, Inc., which is now a part of AMD (Advanced Micro Devices, Inc.). Xilinx specializes in field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and adaptive computing solutions. The company is known for its innovative contributions to the semiconductor industry, particularly in enabling flexible hardware designs for various applications, including telecommunications, automotive, data centers, and industrial automation. Xilinx's products are widely used in sectors requiring high performance and customizable hardware solutions, and the company has a strong focus on advancing technologies such as AI and machine learning through its adaptive computing platforms.
Application
The XCZU7EV-2FBVB900E is a versatile FPGA from Xilinx's Zynq UltraScale+ family, commonly used in applications such as high-performance computing, data processing, machine learning, video and image processing, automotive systems, and industrial automation. Its integrated ARM processors enable efficient handling of complex tasks while the FPGA fabric allows for customizable hardware acceleration, making it suitable for edge computing, telecommunications, and IoT solutions.
Equivalent
The XCZU7EV-2FBVB900E chip is part of Xilinx's Zynq UltraScale+ MPSoC family. Equivalent products include the XCZU7EV-2FFVC1156E and XCZU7EV-2FFVC900E, which offer similar performance and features with minor variations in packaging and power consumption. Additionally, other members of the Zynq UltraScale+ series, like XCZU6 and XCZU9, may serve as alternatives depending on specific application requirements. Always consult the latest Xilinx documentation for detailed comparisons.
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出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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