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XCZU5EG-1FBVB900E

Name: XCZU5EG-1FBVB900E
Rating: 4.7 (12 reviews)

IC SOC CORTEX-A53 900FCBGA

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Mfr。パート #XCZU5EG-1FBVB900E
パッケージ 900-BBGA, FCBGA
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仕様

Supplier	AMD Xilinx
Package	Tray
Series	Zynq® UltraScale+™ MPSoC EG
ProductStatus	Active
Architecture	MCU, FPGA
CoreProcessor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAMSize	256KB
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed	500MHz, 600MHz, 1.2GHz
PrimaryAttributes	Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
OperatingTemperature	0°C ~ 100°C (TJ)
Package/Case	900-BBGA, FCBGA

概要

Description

XCZU5EG-1FBVB900E is a Xilinx Zynq UltraScale+ MPSoC FPGA. It combines a Processing System (ARM Cortex-A53 quad-core) with a Programmable Logic (PL) fabric on a single device, enabling software processing and hardware acceleration in one chip. The “ZU5EG” family targets mid-range embedded applications, with high-speed transceivers, multiple memory interfaces, DSP blocks, and hardened IP (PCIe, USB, Ethernet, etc.). It is delivered in a 900-ball FBVB (fine-pitch BGA) package, with speed grade -1 (high-performance variant). The trailing “E” usually denotes environmental/industrial-temperature options; verify exact temperature rating in the datasheet. This device is suitable for automotive, industrial, communications, and embedded systems requiring both processing power and custom hardware logic. For precise specifications (logic cells, BRAM, DSP slices, transceivers, and I/O), consult Xilinx’s official product page or the XCZU5EG data sheet.

Features

XCZU5EG-1FBVB900E is a Zynq UltraScale+ MPSoC device. Key features:
- Processing System (PS) and Programmable Logic (PL) in one chip
- 16nm FinFET fabrication
- Quad-core ARM Cortex-A53 CPU + Dual-core ARM Cortex-R5 real-time cores
- Large PL fabric for custom logic and accelerators
- Rich high-speed I/O and fabric interconnects (AXI-based)
- Memory interfaces: DDR4/LPDDR4/LPDDR3 with ECC options
- High-speed transceivers and I/O peripherals (PCIe, USB, Ethernet, display/video interfaces, SDIO, SATA options)
- Security features: Crypto engine, Secure Boot/TrustZone
- Industrial temperature range and 900-ball FBGA package (FBVB900)
- Target applications: automotive, industrial, communications, video/imaging, and embedded AI/vision workflows
Note: exact memory capacity, clock speeds, and peripheral counts vary by configuration and speed grade.

Package

900-ball FBGA package (FBVB900).

Pinout

Pin count: 900 pins (FBVB900 package, 900-ball BGA).
Function: Zynq UltraScale+ MPSoC device (XCZU5EG) – a heterogeneous SoC combining a processing system (ARM Cortex-A53 cores) with programmable logic (FPGA fabric) plus high-speed I/O, for applications requiring both CPU and FPGA capabilities.

Manufacturer

Manufacturer: Xilinx, Inc. (now a subsidiary of AMD).
What kind of company: Xilinx is a fabless American semiconductor company that designs programmable logic devices, mainly FPGAs and SoCs (e.g., Zynq UltraScale+), focusing on adaptive and programmable computing.

Application

XCZU5EG-1FBVB900E is a Zynq UltraScale+ MPSoC device (PS + FPGA fabric). Typical applications include:
- Industrial automation and edge processing
- Machine vision, smart cameras, 4K video
- Automotive (ADAS, gateways)
- Aerospace/defense rugged embedded systems
- Communications and network edge devices
- Medical imaging and instrumentation
- Robotics and motor control
- Edge AI inference and prototyping