XCZU4EG-2FBVB900I

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XCZU4EG-2FBVB900I

IC SOC CORTEX-A53 900FCBGA

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  • Mfr。パート #XCZU4EG-2FBVB900I
  • パッケージ FBGA-900
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仕様

Package Tray
Series Zynq® UltraScale+™ MPSoC EG
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAMSize 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
PrimaryAttributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 900-BBGA, FCBGA

概要

Description

The XCZU4EG-2FBVB900I is a member of Xilinx's Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) family, designed for high-performance applications. It integrates a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and programmable logic (FPGA) resources, providing a flexible architecture suitable for various applications, including telecommunications, automotive, and industrial automation.
Key features include:
- FPGA Fabric: A significant amount of programmable logic for custom hardware acceleration.
- ARM Cortex-A53: 64-bit application processing with high performance.
- Cortex-R5: Dedicated real-time processing for time-sensitive tasks.
- I/O Flexibility: Multiple I/O options for connecting with various peripherals.
- Memory Interfaces: Support for DDR4 and other memory types for enhanced data processing.
The XCZU4EG-2FBVB900I offers scalability, efficiency, and a combination of hardware and software programmability, making it ideal for developing complex systems that require both high computational power and real-time performance.

Features

The XCZU4EG-2FBVB900I is part of Xilinx's Zynq UltraScale+ MPSoC family. Key features include:
1. Architecture: Combines a multi-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, enabling both high-performance and real-time processing capabilities.
2. FPGA Fabric: Includes a significant amount of programmable logic (PL) resources, offering flexibility for custom hardware acceleration.
3. Processing System (PS): Supports advanced interfaces such as USB 3.0, PCIe Gen3, and Gigabit Ethernet, facilitating high-speed communication.
4. Memory Support: Equipped with DDR4 memory interfaces, supporting high bandwidth and low latency.
5. Power Efficiency: Designed for low power consumption while maintaining performance, suitable for embedded applications.
6. Security Features: Incorporates hardware-based security features to enhance system integrity.
Overall, the XCZU4EG-2FBVB900I is ideal for applications in automotive, industrial, and telecommunications that require a balance of processing power and programmable logic.

Package

The XCZU4EG-2FBVB900I is packaged in a 900-ball FCBGA (Fine Pitch Ball Grid Array) format, specifically designed for high-performance applications. This package type provides efficient thermal management and allows for a high density of connections.

Pinout

The XCZU4EG-2FBVB900I is a member of the Xilinx Zynq UltraScale+ family of SoCs. It features a pin count of 900 pins. This device combines a programmable logic (FPGA) with a processing system (PS) that includes dual ARM Cortex-A53 cores and a real-time Cortex-R5 core.
The functions of the pins include various I/O capabilities, power supply, ground connections, configuration interfaces, and dedicated pins for high-speed communication protocols such as PCIe, UART, I2C, SPI, and GPIO. The chip supports multiple voltage levels and can be configured for various applications, including communications, automotive, and industrial control systems.
For detailed pin assignments and functionalities, refer to the device's documentation provided by Xilinx.

Manufacturer

The XCZU4EG-2FBVB900I is manufactured by Xilinx, Inc., a company known for its development of programmable logic devices, primarily FPGAs (Field Programmable Gate Arrays) and SoCs (System on Chips). Founded in 1984, Xilinx specializes in providing adaptive and intelligent computing solutions for a variety of applications, including telecommunications, automotive, industrial, and consumer electronics. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further enhancing its capabilities in the semiconductor industry. The XCZU4EG-2FBVB900I is part of the Zynq UltraScale+ MPSoC family, which combines a processing system with programmable logic, enabling high-performance computing and flexibility for complex applications.

Application

The XCZU4EG-2FBVB900I is a versatile device in the Xilinx Zynq UltraScale+ MPSoC family, commonly used in areas such as embedded vision, industrial automation, automotive systems, telecommunications, and robotic control. Its combination of programmable logic and processing capabilities makes it ideal for applications requiring high performance and real-time processing, such as artificial intelligence, machine learning, and high-speed data processing.

Equivalent

The XCZU4EG-2FBVB900I is a part of Xilinx's Zynq UltraScale+ family. Equivalent products include the XCZU4EG-1FBVB900I, which offers a lower speed grade, and other Zynq UltraScale+ models like the XCZU5EG and XCZU3EG, which provide varying resources and performance levels. Compatibility may depend on specific application requirements, such as I/O configuration and processing power. Always verify with the manufacturer's datasheet for precise comparisons.

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出荷料参照(DHL/FedEx):

DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。

フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。

UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。

TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。

EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。

登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。

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