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XCZU4CG-1FBVB900E
IC SOC CORTEX-A53 900FCBGA
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- Mfr。パート #XCZU4CG-1FBVB900E
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仕様
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| Base Product Number | XCZU4 |
概要
Description
The XCZU4CG-1FBVB900E is a part of Xilinx's Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) family. It integrates a powerful ARM Cortex-A53 quad-core processor with a dual-core ARM Cortex-R5 real-time processor and programmable logic (FPGA), providing a versatile platform for various applications. The device features 4GB of DDR4 memory and supports high-speed interfaces like PCIe, USB, and Ethernet, making it suitable for applications in automotive, industrial, communications, and consumer electronics.
The XCZU4CG-1FBVB900E is optimized for low power consumption while delivering high performance for compute-intensive tasks. Its programmable logic allows users to customize hardware acceleration for specific applications, enhancing overall efficiency. The device is housed in a compact BGA package, making it ideal for space-constrained environments. With extensive development tools and a robust ecosystem, including the Vitis and Vivado Design Suites, developers can quickly design and deploy applications tailored to their needs.
The XCZU4CG-1FBVB900E is optimized for low power consumption while delivering high performance for compute-intensive tasks. Its programmable logic allows users to customize hardware acceleration for specific applications, enhancing overall efficiency. The device is housed in a compact BGA package, making it ideal for space-constrained environments. With extensive development tools and a robust ecosystem, including the Vitis and Vivado Design Suites, developers can quickly design and deploy applications tailored to their needs.
Features
The XCZU4CG-1FBVB900E is part of Xilinx's Zynq UltraScale+ MPSoC family, combining a quad-core ARM Cortex-A53 processor with dual-core ARM Cortex-R5 real-time processors and extensive FPGA resources. Key features include:
1. Processing System: Quad-core ARM Cortex-A53 (up to 1 GHz) for high-performance applications, and dual-core Cortex-R5 for real-time tasks.
2. FPGA Fabric: Offers programmable logic with around 4,680 LUTs, enabling custom hardware acceleration.
3. Memory Interface: Supports DDR4/DDR3 memory interfaces, enhancing data throughput.
4. Connectivity: Includes high-speed transceivers (up to 6.6 Gbps), enabling various communication protocols.
5. I/O Capabilities: Multiple GPIO and peripheral interfaces for extensive connectivity.
6. Power Efficiency: Designed for low power consumption while maintaining high performance.
7. Integrated Features: Contains hardware security features and support for industrial applications.
This combination of processing power and programmable logic makes it suitable for applications in automotive, industrial, and communication systems.
1. Processing System: Quad-core ARM Cortex-A53 (up to 1 GHz) for high-performance applications, and dual-core Cortex-R5 for real-time tasks.
2. FPGA Fabric: Offers programmable logic with around 4,680 LUTs, enabling custom hardware acceleration.
3. Memory Interface: Supports DDR4/DDR3 memory interfaces, enhancing data throughput.
4. Connectivity: Includes high-speed transceivers (up to 6.6 Gbps), enabling various communication protocols.
5. I/O Capabilities: Multiple GPIO and peripheral interfaces for extensive connectivity.
6. Power Efficiency: Designed for low power consumption while maintaining high performance.
7. Integrated Features: Contains hardware security features and support for industrial applications.
This combination of processing power and programmable logic makes it suitable for applications in automotive, industrial, and communication systems.
Package
The XCZU4CG-1FBVB900E is packaged in a BGA (Ball Grid Array) format, specifically a 900-ball configuration. This type of package provides a compact design suitable for high-density applications, ensuring efficient thermal performance and electrical connectivity.
Pinout
The XCZU4CG-1FBVB900E is a part of the Xilinx Zynq UltraScale+ MPSoC family. It features a pin count of 900 pins. This device integrates a dual-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and programmable logic fabric along with various I/O capabilities.
The pin functions include:
1. Power Supply Pins: For powering the device (VCC and ground).
2. Configuration Pins: For loading the FPGA configuration.
3. I/O Pins: General-purpose I/O for interfacing with external devices.
4. High-Speed Transceivers: For high-speed data communication.
5. Clock and Reset Pins: For timing and initialization.
This versatile architecture supports various applications including embedded systems, automotive, and digital signal processing.
The pin functions include:
1. Power Supply Pins: For powering the device (VCC and ground).
2. Configuration Pins: For loading the FPGA configuration.
3. I/O Pins: General-purpose I/O for interfacing with external devices.
4. High-Speed Transceivers: For high-speed data communication.
5. Clock and Reset Pins: For timing and initialization.
This versatile architecture supports various applications including embedded systems, automotive, and digital signal processing.
Manufacturer
The manufacturer of the XCZU4CG-1FBVB900E is Xilinx, Inc., a leading company in the field of programmable logic devices. Xilinx specializes in designing and producing Field Programmable Gate Arrays (FPGAs), System on Chips (SoCs), and other related technologies. Founded in 1984, the company has been a pioneer in the development of FPGAs and has expanded its offerings to include adaptive compute acceleration platforms, such as the Versal ACAP (Adaptive Compute Acceleration Platform). Xilinx serves a wide range of industries, including telecommunications, automotive, aerospace, and industrial applications, providing solutions that enable high-performance computing, signal processing, and data acceleration. In October 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), further enhancing its capabilities in the semiconductor market.
Application
The XCZU4CG-1FBVB900E is a versatile System on Chip (SoC) from Xilinx, primarily used in applications such as industrial automation, robotics, medical devices, telecommunications, and automotive systems. Its capabilities support high-performance processing, real-time data analytics, and complex control tasks, making it suitable for edge computing and embedded systems. Additionally, it is employed in machine learning and video processing tasks due to its integrated programmable logic and ARM processing cores.
Equivalent
The XCZU4CG-1FBVB900E is a Xilinx Zynq UltraScale+ MPSoC. Equivalent products include the XCZU4CG-1FVC900E and other Zynq UltraScale+ devices with similar performance and features, such as the XCZU3EG and XCZU5EG, depending on specific application requirements. For specific use cases, consider the equivalent parts from other manufacturers, such as Intel's Stratix or Lattice Semiconductor's CrossLink series. Always verify compatibility based on your project needs.
出荷
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出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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