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XCZU47DR-2FFVG1517I
IC ZUP RFSOC A53 FPGA 1517BGA
- メーカー
- Mfr。パート #XCZU47DR-2FFVG1517I
- パッケージ BBGA-1517
- データシート
- 在庫中2190
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仕様
| Package | Tray |
| Series | Zynq® UltraScale+™ RFSoC |
| ProductStatus | Active |
| Architecture | MCU, FPGA |
| CoreProcessor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| RAMSize | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 1.333GHz |
| PrimaryAttributes | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 1517-BBGA, FCBGA |
概要
Description
The XCZU47DR-2FFVG1517I is a member of Xilinx's Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) family, which integrates a powerful ARM-based processing system with a high-performance programmable logic (FPGA) fabric. This specific model features a dual-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and a Graphics Processing Unit (GPU), enabling efficient handling of complex applications.
The "DR" designation indicates a device with a specific set of features tailored for high-performance and low-power applications. The FPGA fabric allows for custom hardware acceleration and flexibility in design, making it suitable for applications such as telecommunications, automotive, industrial automation, and medical devices.
The XCZU47DR-2FFVG1517I is packaged in a 1517-pin FFG (Fine Pitch Grid Array) format, facilitating easy integration into various systems. It supports advanced connectivity and interfacing options, including high-speed transceivers. Overall, the XCZU47DR-2FFVG1517I is ideal for developers seeking a balance of processing power and flexibility in their designs.
The "DR" designation indicates a device with a specific set of features tailored for high-performance and low-power applications. The FPGA fabric allows for custom hardware acceleration and flexibility in design, making it suitable for applications such as telecommunications, automotive, industrial automation, and medical devices.
The XCZU47DR-2FFVG1517I is packaged in a 1517-pin FFG (Fine Pitch Grid Array) format, facilitating easy integration into various systems. It supports advanced connectivity and interfacing options, including high-speed transceivers. Overall, the XCZU47DR-2FFVG1517I is ideal for developers seeking a balance of processing power and flexibility in their designs.
Features
The XCZU47DR-2FFVG1517I is a versatile device from Xilinx's Zynq UltraScale+ MPSoC family. Key features include:
1. Architecture: Combines a dual-core ARM Cortex-A53 application processor with a dual-core ARM Cortex-R5 real-time processor.
2. FPGA Fabric: Offers a significant amount of programmable logic with around 23,300 logic cells, enabling custom hardware acceleration.
3. DSP Resources: Includes 220 DSP slices for high-performance digital signal processing tasks.
4. Memory Interface: Supports multiple memory interfaces, including DDR4 and LPDDR4, facilitating high-bandwidth memory access.
5. I/O Capabilities: Features a wide range of I/O options including PCIe, USB, and UART interfaces.
6. Power Management: Designed for low-power operation, suitable for embedded and edge applications.
7. Security Features: Provides robust security options, including secure boot and encryption.
This combination of processing power, flexibility, and connectivity makes the XCZU47DR suitable for applications in telecommunications, automotive, industrial automation, and more.
1. Architecture: Combines a dual-core ARM Cortex-A53 application processor with a dual-core ARM Cortex-R5 real-time processor.
2. FPGA Fabric: Offers a significant amount of programmable logic with around 23,300 logic cells, enabling custom hardware acceleration.
3. DSP Resources: Includes 220 DSP slices for high-performance digital signal processing tasks.
4. Memory Interface: Supports multiple memory interfaces, including DDR4 and LPDDR4, facilitating high-bandwidth memory access.
5. I/O Capabilities: Features a wide range of I/O options including PCIe, USB, and UART interfaces.
6. Power Management: Designed for low-power operation, suitable for embedded and edge applications.
7. Security Features: Provides robust security options, including secure boot and encryption.
This combination of processing power, flexibility, and connectivity makes the XCZU47DR suitable for applications in telecommunications, automotive, industrial automation, and more.
Package
The XCZU47DR-2FFVG1517I is packaged in a 1517-pin FFG (Fine Pitch Ball Grid Array) package, which provides a compact footprint and facilitates high-density interconnections for advanced applications in the Zynq UltraScale+ family by Xilinx.
Pinout
The XCZU47DR-2FFVG1517I is part of the Xilinx Zynq UltraScale+ MPSoC family. It features a pin count of 1517 pins.
The device combines a quad-core ARM Cortex-A53 processor with dual ARM Cortex-R5 real-time processors and programmable logic (FPGA). Its functions include high-performance processing, embedded system integration, and extensive connectivity options. The MPSoC architecture allows for concurrent processing of software and hardware tasks, making it suitable for applications in automotive, industrial, and communications sectors.
Key features include multiple I/O interfaces, high-speed transceivers, and integrated memory controllers, enabling flexible design configurations for various application requirements.
The device combines a quad-core ARM Cortex-A53 processor with dual ARM Cortex-R5 real-time processors and programmable logic (FPGA). Its functions include high-performance processing, embedded system integration, and extensive connectivity options. The MPSoC architecture allows for concurrent processing of software and hardware tasks, making it suitable for applications in automotive, industrial, and communications sectors.
Key features include multiple I/O interfaces, high-speed transceivers, and integrated memory controllers, enabling flexible design configurations for various application requirements.
Manufacturer
The XCZU47DR-2FFVG1517I is manufactured by Xilinx, Inc., which is a subsidiary of Advanced Micro Devices (AMD). Xilinx is a semiconductor company known for its development of programmable devices, specifically Field Programmable Gate Arrays (FPGAs), System on Chips (SoCs), and Adaptive Compute Acceleration Platforms (ACAPs). Founded in 1984, Xilinx pioneered the FPGA technology and has been a key player in the digital circuit design space, providing solutions across various industries such as telecommunications, automotive, aerospace, and consumer electronics. With a focus on innovation, Xilinx enables designers to create customizable and flexible hardware solutions tailored to specific application needs.
Application
The XCZU47DR-2FFVG1517I, part of Xilinx's Zynq UltraScale+ MPSoC family, is suitable for various application areas, including automotive, industrial automation, aerospace, and defense. It excels in real-time processing, machine learning, embedded vision, and digital signal processing. Common use cases include advanced driver assistance systems (ADAS), robotics, high-performance computing, and IoT applications, where flexibility and high performance are critical.
Equivalent
The XCZU47DR-2FFVG1517I is a variant of the Xilinx Zynq UltraScale+ MPSoC series. Equivalent products include XCZU47DR-2FFVG1517E, XCZU47DR-2FFVG1517C, and other members of the Zynq UltraScale+ family, depending on specific requirements like package type, speed grade, and functionality. Additionally, similar performance can be found in competing products like Intel's Stratix 10 or Altera FPGAs, but exact equivalence would depend on application needs.
出荷
出荷方法私たち
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出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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