XCZU19EG-2FFVB1517I

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XCZU19EG-2FFVB1517I

IC SOC CORTEX-A53 1517FCBGA

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仕様

Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FCBGA (40x40)
Base Product Number XCZU19

概要

Description

The XCZU19EG-2FFVB1517I is a high-performance System-on-Chip (SoC) developed by Xilinx, part of their Zynq UltraScale+ family. This device integrates a powerful ARM Cortex-A53 quad-core processor with a dual-core Cortex-R5 real-time processor alongside programmable logic, allowing for a flexible and scalable system design.
Key features include:
- FPGA Fabric: A large amount of programmable logic provides user-defined hardware acceleration capabilities.
- Memory Interface: Supports various memory types, enhancing data processing speed.
- Connectivity: Includes multiple high-speed interfaces such as PCIe, USB, and Ethernet, facilitating extensive communication options.
- Power Efficiency: Designed for low power consumption while maintaining high performance, making it suitable for embedded applications in industrial, automotive, and telecommunications sectors.
The XCZU19EG-2FFVB1517I is ideal for applications requiring high computational power combined with customizable hardware logic, enabling efficient execution of complex tasks.

Features

The XCZU19EG-2FFVB1517I is a member of Xilinx's Zynq UltraScale+ MPSoC family, combining a multi-core ARM Cortex-A53 processor with FPGA capabilities. Key features include:
1. Processing: Quad-core ARM Cortex-A53 (64-bit) and dual-core ARM Cortex-R5 for real-time processing.
2. FPGA Fabric: Integrated programmable logic with a significant number of configurable logic blocks (CLBs) for custom digital design.
3. DSP Slices: High-performance DSP slices for signal processing applications.
4. Memory: Supports DDR4 memory interfaces, enabling high bandwidth memory access.
5. I/O: Multiple high-speed I/O interfaces including PCIe, SATA, and USB for connectivity.
6. Power Efficiency: Designed for low power consumption, making it suitable for embedded applications.
7. Security: Built-in security features for data protection and secure boot.
This SoC is ideal for applications in automotive, industrial, and communications sectors, providing a powerful platform for deploying complex algorithms and real-time processing tasks.

Package

The XCZU19EG-2FFVB1517I is packaged in a FFG (Fine Pitch Ball Grid Array) format, specifically a 1517-ball BGA. This type of package provides a compact design for high-density connections, suitable for performance-intensive applications.

Pinout

The XCZU19EG-2FFVB1517I is a part of Xilinx's Zynq UltraScale+ MPSoC family. It features a pin count of 1517. This device integrates both programmable logic (FPGA) and a processing system (PS) that includes a quad-core ARM Cortex-A53 and a dual-core ARM Cortex-R5.
The functions of the pins include a variety of digital I/O capabilities, power supply pins, and dedicated interfaces such as PCIe, Ethernet, and USB. It also supports high-speed transceivers, LVDS, and multiple general-purpose I/O (GPIO) configurations. The design is optimized for applications in communications, automotive, industrial, and aerospace sectors, providing flexibility for implementing custom logic alongside powerful processing capabilities.

Manufacturer

The XCZU19EG-2FFVB1517I is manufactured by Xilinx, Inc., a subsidiary of Advanced Micro Devices (AMD). Xilinx is a leading technology company known for its innovative development of field-programmable gate arrays (FPGAs), system-on-a-chip (SoC) devices, and adaptive computing solutions. Founded in 1984, Xilinx pioneered the FPGA technology and has since expanded its product lineup to include high-performance computing solutions for various applications, such as telecommunications, automotive, aerospace, and data centers. The XCZU19EG is part of the Zynq UltraScale+ MPSoC family, which integrates a processing system with programmable logic, making it suitable for complex tasks in embedded systems and real-time processing.

Application

The XCZU19EG-2FFVB1517I is a versatile System on Chip (SoC) that finds application in high-performance computing, data centers, and AI/ML workloads. It is ideal for video and image processing, machine vision, software-defined networking, and automotive applications. Additionally, it is used in industrial automation, IoT systems, and edge computing solutions due to its efficient processing capabilities and integrated programmable logic.

Equivalent

The XCZU19EG-2FFVB1517I chip is part of Xilinx's Zynq UltraScale+ MPSoC family. Equivalent products include the XCZU19EG-2FFVC1760I and XCZU19EG-2FFVB1517E, which share similar specifications but might differ in package, temperature range, or I/O configurations. For alternatives, consider other Zynq UltraScale+ models, such as XCZU17 or XCZU21, depending on specific requirements like performance and resource availability. Always check the datasheets for detailed compatibility.

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出荷料参照(DHL/FedEx):

DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。

フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。

UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。

TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。

EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。

登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。

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