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XCZU15EG-2FFVB1156I
IC SOC CORTEX-A53 1156FCBGA
- メーカー
- Mfr。パート #XCZU15EG-2FFVB1156I
- パッケージ 1156FCBGA
- データシート
- 在庫中2379
100% オリジナル &新しい
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仕様
| Package | Tray |
| Series | Zynq® UltraScale+™ MPSoC EG |
| ProductStatus | Active |
| Architecture | MCU, FPGA |
| CoreProcessor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAMSize | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| PrimaryAttributes | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 1156-BBGA, FCBGA |
概要
Description
The XCZU15EG-2FFVB1156I is a member of Xilinx's Zynq UltraScale+ MPSoC family, which integrates a multi-core ARM Cortex-A53 processor with programmable logic (FPGA). This device features 15,000 LUTs, making it suitable for high-performance applications requiring both processing and customizable hardware solutions. It operates on a 1.2V core voltage and offers multiple interfaces, including PCIe, USB, and Ethernet, enhancing connectivity options for various applications.
The XCZU15EG is designed for various industries such as automotive, aerospace, and telecommunications, providing flexibility for real-time processing tasks and efficient data handling. It supports advanced features like high-speed serial transceivers and extensive memory interfaces, enabling complex system designs. The device is packaged in a 1156-ball FCBGA, promoting compact designs in space-constrained environments.
Overall, the XCZU15EG-2FFVB1156I is ideal for applications involving machine learning, video processing, and embedded systems, delivering both high performance and adaptability in a single chip solution.
The XCZU15EG is designed for various industries such as automotive, aerospace, and telecommunications, providing flexibility for real-time processing tasks and efficient data handling. It supports advanced features like high-speed serial transceivers and extensive memory interfaces, enabling complex system designs. The device is packaged in a 1156-ball FCBGA, promoting compact designs in space-constrained environments.
Overall, the XCZU15EG-2FFVB1156I is ideal for applications involving machine learning, video processing, and embedded systems, delivering both high performance and adaptability in a single chip solution.
Features
The XCZU15EG-2FFVB1156I is part of Xilinx's Zynq UltraScale+ MPSoC family, integrating a powerful ARM Cortex-A53 quad-core processor with a dual-core ARM Cortex-R5 real-time processor alongside programmable logic (FPGA). Key features include:
1. Processor Architecture: Quad-core ARM Cortex-A53 for general processing and dual-core ARM Cortex-R5 for real-time tasks.
2. FPGA Fabric: 15K logic cells with a variety of configurable I/O options for custom hardware acceleration.
3. Memory: Supports DDR4 memory interfaces and includes integrated memory controllers.
4. High-Speed Connectivity: Multiple high-speed transceivers, including PCIe, USB, and Ethernet interfaces.
5. Power Efficiency: Optimized for low power consumption while delivering high performance.
6. Security Features: Built-in hardware security features for secure boot and data protection.
Overall, the XCZU15EG-2FFVB1156I is ideal for applications in communications, automotive, industrial, and consumer electronics where high performance and flexibility are crucial.
1. Processor Architecture: Quad-core ARM Cortex-A53 for general processing and dual-core ARM Cortex-R5 for real-time tasks.
2. FPGA Fabric: 15K logic cells with a variety of configurable I/O options for custom hardware acceleration.
3. Memory: Supports DDR4 memory interfaces and includes integrated memory controllers.
4. High-Speed Connectivity: Multiple high-speed transceivers, including PCIe, USB, and Ethernet interfaces.
5. Power Efficiency: Optimized for low power consumption while delivering high performance.
6. Security Features: Built-in hardware security features for secure boot and data protection.
Overall, the XCZU15EG-2FFVB1156I is ideal for applications in communications, automotive, industrial, and consumer electronics where high performance and flexibility are crucial.
Package
The XCZU15EG-2FFVB1156I is packaged in a FFG (Fine Pitch Flip Chip Ball Grid Array) form factor. This package type features a 1156-ball arrangement, designed for high-density applications, providing efficient thermal management and electrical performance.
Pinout
The XCZU15EG-2FFVB1156I is a Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) from Xilinx (now part of AMD). It features a total of 1156 pins.
The primary functions of these pins include:
1. Power Supply: Various pins provide different voltage levels for the core and I/O.
2. Configuration: Pins are used for JTAG and other programming interfaces.
3. I/O Interfaces: The device supports multiple I/O standards, including DDR, PCIe, and Ethernet, allowing for high-speed communication and connectivity options.
4. Programmable Logic: Pins connect to the FPGA fabric for custom logic implementations.
5. Processing System: Interfaces for the ARM-based processing units and peripherals.
This pin arrangement supports versatile applications across various industries, including communications, automotive, and industrial automation.
The primary functions of these pins include:
1. Power Supply: Various pins provide different voltage levels for the core and I/O.
2. Configuration: Pins are used for JTAG and other programming interfaces.
3. I/O Interfaces: The device supports multiple I/O standards, including DDR, PCIe, and Ethernet, allowing for high-speed communication and connectivity options.
4. Programmable Logic: Pins connect to the FPGA fabric for custom logic implementations.
5. Processing System: Interfaces for the ARM-based processing units and peripherals.
This pin arrangement supports versatile applications across various industries, including communications, automotive, and industrial automation.
Manufacturer
The XCZU15EG-2FFVB1156I is manufactured by Xilinx, Inc., which is a leading company in the field of programmable logic devices. Xilinx specializes in the design and production of Field Programmable Gate Arrays (FPGAs), System on Chips (SoCs), and other adaptive computing solutions. The company is well-known for its innovative technology that enables engineers to create customizable hardware for a variety of applications, including telecommunications, automotive, aerospace, and data centers. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities in high-performance computing and adaptive solutions.
Application
The XCZU15EG-2FFVB1156I is a versatile FPGA from Xilinx's Zynq UltraScale+ family, primarily used in applications such as automotive driver assistance systems, industrial automation, telecommunications, medical imaging, and high-performance computing. Its high processing power, integrated ARM cores, and extensive connectivity options make it suitable for real-time data processing, machine learning, and edge computing solutions.
Equivalent
The XCZU15EG-2FFVB1156I is a Xilinx Zynq UltraScale+ MPSoC. Equivalent products include the XCZU15EG-2FFVB1156E, which has the same architecture but may vary in speed grade or package options. Other alternatives in the Zynq UltraScale+ family are XCZU19EG and XCZU13EG, depending on specific application needs for performance and resources. Always check specific datasheets for detailed compatibility and performance requirements.
出荷
出荷方法私たち
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出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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