XCVU3P-2FFVC1517I

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XCVU3P-2FFVC1517I

IC FPGA 520 I/O 1517FCBGA

  • メーカー
  • Mfr。パート #XCVU3P-2FFVC1517I
  • パッケージ FBGA-1517
  • データシート
  • 在庫中7222

100% オリジナル &新しい

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仕様

Package Tray
Series Virtex® UltraScale+™
ProductStatus Active
NumberofLABs/CLBs 49260
NumberofLogicElements/Cells 862050
TotalRAMBits 118067200
NumberofI/O 520
Voltage-Supply 0.825V ~ 0.876V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 1517-BBGA, FCBGA

概要

Description

The XCVU3P-2FFVC1517I is a high-performance field-programmable gate array (FPGA) from Xilinx's Virtex UltraScale+ family. It features advanced capabilities suited for a wide range of applications, including telecommunications, data centers, and high-performance computing. The device is built on a 16nm FinFET process technology, which allows for increased performance and reduced power consumption compared to earlier generations.
Key specifications include:
- Logic Cells: Approximately 2.5 million logic cells, enabling complex digital design.
- DSP Slices: Integrated DSP (Digital Signal Processing) slices optimized for high-speed arithmetic operations.
- Memory: Configurable memory resources, including block RAM and UltraRAM for efficient data storage.
- I/O Capabilities: Supports multiple high-speed serial and parallel interfaces, facilitating connectivity with various peripherals.
- Configurations: Available in a 1517-pin FFG (Fine Pitch Flip Chip) package for robust physical design.
The XCVU3P is ideal for demanding applications requiring flexibility and scalability in hardware design while maintaining high throughput and low latency.

Features

The XCVU3P-2FFVC1517I is a high-performance FPGA (Field Programmable Gate Array) from Xilinx's UltraScale+ family. Key features include:
1. Architecture: Built on a 16nm FinFET process, providing improved performance and power efficiency.
2. Logic Cells: Offers a substantial number of logic resources, with up to 2,400K logic cells.
3. DSP Slices: Contains approximately 1,080 DSP slices for high-speed arithmetic operations.
4. Memory: Includes up to 2.5 MB of block RAM and support for wide memory interfaces.
5. Transceivers: Equipped with high-speed serial transceivers, capable of supporting data rates up to 32.75 Gbps.
6. I/O Capabilities: Features versatile I/O options, including LVDS, for various communication protocols.
7. Security Features: Enhanced security options, including bitstream encryption.
8. Development Support: Compatible with Xilinx’s Vivado Design Suite for easy implementation and design.
This FPGA is ideal for applications requiring high processing power, such as data centers, telecommunications, and advanced computing.

Package

The XCVU3P-2FFVC1517I is packaged in a Fine-Pitch Ball Grid Array (FBGA) format, specifically a 1517-ball configuration. This packaging type provides a high density of connections and is suitable for advanced applications in FPGA designs.

Pinout

The XCVU3P-2FFVC1517I is a field-programmable gate array (FPGA) from the Xilinx Virtex UltraScale+ series. It features a pin count of 1517. The FPGA is designed for high-performance applications and provides a variety of functions, including digital signal processing, data processing, and high-speed connectivity. Key features include support for multiple I/O standards, high-speed transceivers, and programmable logic resources. This device is typically used in applications such as telecommunications, aerospace, defense, and data centers, where flexibility and performance are critical.

Manufacturer

The XCVU3P-2FFVC1517I is manufactured by Xilinx, a company known for producing field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), and other programmable logic devices. Xilinx specializes in advanced semiconductor technology and is a significant player in the electronic design automation industry. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities in high-performance computing and adaptive computing solutions. Xilinx devices are widely used in various applications, including telecommunications, automotive, aerospace, and industrial sectors, leveraging their flexibility and performance to meet diverse technological needs.

Application

The XCVU3P-2FFVC1517I is a high-performance FPGA used in various applications, including digital signal processing, image and video processing, telecommunications, data center acceleration, and machine learning. Its capabilities make it suitable for complex tasks in aerospace, automotive, and industrial automation, as well as in high-frequency trading and real-time data analytics.

Equivalent

The XCVU3P-2FFVC1517I is a part of the Xilinx Virtex UltraScale+ series. Equivalent products include the XCVU3P-1FFVC1517I (lower speed grade) and XCVU3P-3FFVC1517I (higher speed grade). For similar functionality, consider alternatives from other families, such as Intel's Stratix 10 series or Lattice's ECP5 series, depending on specific application requirements like performance, power consumption, and resource availability.

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出荷料参照(DHL/FedEx):

DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。

フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。

UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。

TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。

EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。

登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。

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