画像は参照用のみです。
XCVU13P-2FHGA2104E
IC FPGA 832 I/O 2104FCBGA
- メーカー
- Mfr。パート #XCVU13P-2FHGA2104E
- パッケージ FBGA-2104
- データシート
- 在庫中3879
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
RFQおよびもっと割引を得る
仕様
| Package | Tray |
| Series | Virtex® UltraScale+™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 216000 |
| NumberofLogicElements/Cells | 3780000 |
| TotalRAMBits | 514867200 |
| NumberofI/O | 832 |
| Voltage-Supply | 0.825V ~ 0.876V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 100°C (TJ) |
| Package/Case | 2104-BBGA, FCBGA |
概要
Description
The XCVU13P-2FHGA2104E is a high-performance FPGA (Field-Programmable Gate Array) from Xilinx's Virtex UltraScale+ family. It features advanced technology optimized for demanding applications such as data centers, high-performance computing, and machine learning.
Key specifications include:
- Logic Cells: It offers a large number of configurable logic cells, enabling complex designs.
- Memory: The device includes significant on-chip memory resources, enhancing data handling capabilities.
- I/O Capabilities: It supports various high-speed interfaces, allowing for versatile connectivity options.
- Power Efficiency: Designed for low-power operation, it enables high performance with reduced energy consumption.
- 400G Ethernet and PCIe Support: It is well-suited for applications requiring high bandwidth and fast data transfer.
The XCVU13P is particularly suitable for edge computing, AI inference, and large-scale telecom processing. Its programmability allows for customization, making it a popular choice for engineers looking to implement specific functionalities in hardware.
Key specifications include:
- Logic Cells: It offers a large number of configurable logic cells, enabling complex designs.
- Memory: The device includes significant on-chip memory resources, enhancing data handling capabilities.
- I/O Capabilities: It supports various high-speed interfaces, allowing for versatile connectivity options.
- Power Efficiency: Designed for low-power operation, it enables high performance with reduced energy consumption.
- 400G Ethernet and PCIe Support: It is well-suited for applications requiring high bandwidth and fast data transfer.
The XCVU13P is particularly suitable for edge computing, AI inference, and large-scale telecom processing. Its programmability allows for customization, making it a popular choice for engineers looking to implement specific functionalities in hardware.
Features
The XCVU13P-2FHGA2104E is a high-performance, high-capacity FPGA (Field Programmable Gate Array) from Xilinx's UltraScale+ family. Key features include:
1. Architecture: Utilizes a 16nm FinFET process technology, enabling higher performance and lower power consumption.
2. Logic Cells: Offers up to 1.5 million logic cells, suitable for complex designs and applications.
3. DSP Slices: Includes around 8,000 DSP slices, ideal for signal processing tasks.
4. Memory: Provides extensive on-chip memory options, including block RAM (BRAM) and UltraRAM for enhanced data handling capabilities.
5. I/O: Supports high-speed I/O interfaces, including PCIe Gen4, featuring up to 32 lanes for rapid data transfer.
6. Connectivity: Integrated high-speed transceivers capable of 28 Gbps for reliable communication.
7. Design Flexibility: Supports various design methodologies, including RTL, C/C++, and high-level synthesis (HLS).
8. Power Efficiency: Designed for optimized power management, suitable for both performance-intensive and power-sensitive applications.
Overall, the XCVU13P-2FHGA2104E is engineered for advanced computing tasks in data centers, telecommunications, and industrial applications.
1. Architecture: Utilizes a 16nm FinFET process technology, enabling higher performance and lower power consumption.
2. Logic Cells: Offers up to 1.5 million logic cells, suitable for complex designs and applications.
3. DSP Slices: Includes around 8,000 DSP slices, ideal for signal processing tasks.
4. Memory: Provides extensive on-chip memory options, including block RAM (BRAM) and UltraRAM for enhanced data handling capabilities.
5. I/O: Supports high-speed I/O interfaces, including PCIe Gen4, featuring up to 32 lanes for rapid data transfer.
6. Connectivity: Integrated high-speed transceivers capable of 28 Gbps for reliable communication.
7. Design Flexibility: Supports various design methodologies, including RTL, C/C++, and high-level synthesis (HLS).
8. Power Efficiency: Designed for optimized power management, suitable for both performance-intensive and power-sensitive applications.
Overall, the XCVU13P-2FHGA2104E is engineered for advanced computing tasks in data centers, telecommunications, and industrial applications.
Package
The XCVU13P-2FHGA2104E is packaged in a 2104-pin FFG (Fine Pitch Flip Chip) package, which is designed for high-performance applications in field-programmable gate arrays (FPGAs). This package type supports advanced thermal management and high-density interconnections.
Pinout
The XCVU13P-2FHGA2104E is a member of the Xilinx Virtex UltraScale+ family of FPGAs. It features a pin count of 2104. The device is designed for high-performance applications, offering advanced capabilities such as high-speed serial transceivers, digital signal processing (DSP) slices, and extensive I/O support. The XCVU13P integrates features for applications like data centers, networking, and high-performance computing, allowing for significant parallel processing and high bandwidth.
Manufacturer
The manufacturer of the XCVU13P-2FHGA2104E is Xilinx, Inc., which is a subsidiary of Advanced Micro Devices (AMD). Xilinx specializes in designing and manufacturing field-programmable gate arrays (FPGAs), system on chips (SoCs), and adaptive computing solutions. The company is known for its innovative products that allow for high flexibility and customization in hardware design, catering to various industries including telecommunications, automotive, aerospace, and data centers. Xilinx's FPGAs are widely used in applications requiring high performance and real-time processing capabilities.
Application
The XCVU13P-2FHGA2104E is a high-performance FPGA from Xilinx, ideal for applications such as data center acceleration, high-performance computing, machine learning inference, automotive driver assistance systems, 5G wireless infrastructure, and video processing. Its versatility and extensive I/O capabilities make it suitable for complex algorithms and real-time processing in diverse industries, including telecommunications, aerospace, and financial services.
Equivalent
The XCVU13P-2FHGA2104E is a high-performance FPGA from Xilinx's Virtex UltraScale+ family. Equivalent products include the XCVU13P-2FLGA2104E (with a lower thermal performance) and other similar UltraScale+ FPGAs like the XCVU19P or XCVU11P, depending on specific requirements like I/O count, logic resources, and performance. Always consult the manufacturer's datasheets for detailed specifications and compatibility.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
支払い
Payment Methods
支払い期間は100%前払いです。
現在、下記の支払い方法のみを受け入れています。:
1. ペイパル
2. クレジット・デビットカード
3. ワイヤー 転送
類似
-
MX25L3233FZBI-08Q
Macronix
-
MX25V1635FZNQ03
Macronix
-
MX25V5126FM1I
Macronix
-
MX25V16066M1I02
Macronix
-
MX25V16066M2I02
Macronix
-
MX25R6435FBDIL0
Macronix
-
MX29GL512FHXFI-11..
Macronix
-
MX25U51279GXDR00
Macronix
-
MX25U25643GZNI00
Macronix
-
MX25L6433FM2I-08G
Macronix
-
MX25L25645GXDI-08..
Macronix
-
MX29F040CTI-70G
Macronix