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XCVU095-2FFVB1760I
IC FPGA 702 I/O 1760FCBGA
- メーカー
- Mfr。パート #XCVU095-2FFVB1760I
- パッケージ FBGA-1760
- データシート
- 在庫中3095
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
RFQおよびもっと割引を得る
仕様
| Package | Bulk |
| Series | Virtex® UltraScale™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 67200 |
| NumberofLogicElements/Cells | 1176000 |
| TotalRAMBits | 62259200 |
| NumberofI/O | 702 |
| Voltage-Supply | 0.922V ~ 0.979V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 1760-BBGA, FCBGA |
概要
Description
The XCVU095-2FFVB1760I is a high-performance FPGA (Field-Programmable Gate Array) from Xilinx's Virtex UltraScale+ family. Designed for demanding applications, it offers significant resources with 95,000 logic cells, high-speed transceivers, and substantial memory blocks. The "2" in the part number indicates the speed grade, while "FFVB" refers to the package type and thermal characteristics, specifically a flip-chip package.
This FPGA is ideal for applications requiring high bandwidth and low latency, such as data centers, telecommunications, and high-performance computing. It supports advanced features like dynamic partial reconfiguration, high-speed serial connectivity, and extensive I/O options, making it versatile for various designs.
Overall, the XCVU095-2FFVB1760I is suited for engineers looking to implement complex algorithms, signal processing, and real-time data handling within a flexible hardware framework.
This FPGA is ideal for applications requiring high bandwidth and low latency, such as data centers, telecommunications, and high-performance computing. It supports advanced features like dynamic partial reconfiguration, high-speed serial connectivity, and extensive I/O options, making it versatile for various designs.
Overall, the XCVU095-2FFVB1760I is suited for engineers looking to implement complex algorithms, signal processing, and real-time data handling within a flexible hardware framework.
Features
The XCVU095-2FFVB1760I is a high-performance FPGA (Field Programmable Gate Array) from Xilinx's UltraScale+ series, designed for advanced applications in data centers, telecommunications, and high-performance computing. Key features include:
1. Architecture: Utilizes a 16nm FinFET technology for enhanced performance and lower power consumption.
2. Logic Cells: Offers a significant number of logic cells and flip-flops for complex designs.
3. DSP Slices: Includes a large number of DSP slices for efficient digital signal processing.
4. High-Speed Transceivers: Features high-speed transceivers supporting up to 28 Gbps for fast data transfer.
5. Memory Interfaces: Supports various memory interfaces, including DDR4, for high bandwidth.
6. Configurable I/O: Provides flexible I/O options to cater to diverse connectivity needs.
7. Advanced Security: Incorporates security features like encryption and secure boot for design protection.
This FPGA is ideal for applications requiring high throughput and low latency, such as machine learning, video processing, and networking tasks.
1. Architecture: Utilizes a 16nm FinFET technology for enhanced performance and lower power consumption.
2. Logic Cells: Offers a significant number of logic cells and flip-flops for complex designs.
3. DSP Slices: Includes a large number of DSP slices for efficient digital signal processing.
4. High-Speed Transceivers: Features high-speed transceivers supporting up to 28 Gbps for fast data transfer.
5. Memory Interfaces: Supports various memory interfaces, including DDR4, for high bandwidth.
6. Configurable I/O: Provides flexible I/O options to cater to diverse connectivity needs.
7. Advanced Security: Incorporates security features like encryption and secure boot for design protection.
This FPGA is ideal for applications requiring high throughput and low latency, such as machine learning, video processing, and networking tasks.
Package
The XCVU095-2FFVB1760I is packaged in a FFG (Fine Fine Grid) BGA (Ball Grid Array) format with 1760 balls. This package type is designed for high-density applications, providing efficient thermal and electrical performance.
Pinout
The XCVU095-2FFVB1760I is a FPGA from Xilinx's Virtex UltraScale family. It has a total pin count of 1,760 pins. The device features a wide range of functionality, including programmable logic, digital signal processing (DSP), high-speed transceivers, and configurable I/O interfaces. It supports various connectivity protocols and is designed for high-performance applications in areas like data centers, telecommunications, and advanced computing. The "2" in the part number indicates the speed grade, while "FF" refers to the package type, which is a Flip-Chip Ball Grid Array (BGA). The "VB" indicates the package style, and "I" designates the industrial temperature range.
Manufacturer
The XCVU095-2FFVB1760I is manufactured by Xilinx, which is a semiconductor company known for its development of programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), SoCs (System on Chips), and ACAPs (Adaptive Compute Acceleration Platforms). Xilinx, founded in 1984, is a leader in the field of reconfigurable computing and is widely used in various applications such as telecommunications, automotive, aerospace, and industrial automation. In 2021, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its influence in the semiconductor industry. The company focuses on providing innovative solutions that enhance performance and efficiency in both hardware and software design.
Application
The XCVU095-2FFVB1760I is a high-performance FPGA from Xilinx's UltraScale+ series, suitable for various application areas including telecommunications, data center acceleration, high-performance computing, machine learning, video processing, and automotive systems. Its versatility in handling complex algorithms and processing large data streams makes it ideal for real-time analytics, network processing, and embedded processing applications.
Equivalent
The XCVU095-2FFVB1760I is a high-performance FPGA from Xilinx's UltraScale family. Equivalent products from other manufacturers include Intel's Stratix 10 series (e.g., Stratix 10 GX), Lattice Semiconductor's CrossLink-NX, and Achronix's Speedster7t series. For exact replacements, consider performance specifications, I/O count, and power consumption to ensure compatibility with your application.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
支払い
Payment Methods
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3. ワイヤー 転送
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