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XCVM1502-1MSEVFVC1760
IC VERSALPRIME ACAP FPGA 1760BGA
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- Mfr。パート #XCVM1502-1MSEVFVC1760
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- 在庫中5753
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仕様
| Series | Versal™ Prime |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ Prime FPGA, 1M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
概要
Description
"Introduction to XCVM1502-1MSEVFVC1760" likely refers to a specific course, module, or product that is not widely recognized or documented in publicly available resources. To understand its context, you would typically need to refer to the syllabus or documentation provided by the institution or organization offering it. The alphanumeric code could indicate a course number, version, or a specific section relevant to a particular field, such as engineering, computer science, or vocational training. If this is related to a course or product, it's essential to check with the issuing institution, company, or platform for detailed information, including objectives, content, and prerequisites. If you have access to additional context or details, please share them for a more precise response.
Package
The XCVM1502-1MSEVFVC1760 is a type of FPGA package from Xilinx, typically in a VFBGA1760 package format, which indicates a Very Fine Ball Grid Array with 1760 solder balls. This type of package is used for high-performance programmable logic devices and is suitable for applications requiring high-density interconnections and efficient heat dissipation.
Pinout
The XCVM1502-1MSEVFVC1760 is a part of the Xilinx Virtex UltraScale+ FPGA family. It features 1760 pins. These FPGAs are designed for high-performance applications and include a wide range of functionalities, such as high-speed I/O, DSP slices, and configurable logic blocks.
Key functions of this FPGA include:
1. Programmable Logic: Offers a large number of logic cells that can be configured for various digital processing tasks.
2. High-Speed I/O: Supports multiple high-speed communication standards, making it suitable for data-intensive applications.
3. DSP Capabilities: Includes DSP slices for efficient signal processing tasks.
4. Memory Blocks: Offers embedded memory resources for data storage and retrieval.
5. Power Management: Features advanced power management capabilities, enhancing efficiency.
6. Clock Management: Provides clock management tiles for flexible and reliable clock distribution.
This device is suitable for applications in telecommunications, data centers, and aerospace where high performance and flexibility are required.
Key functions of this FPGA include:
1. Programmable Logic: Offers a large number of logic cells that can be configured for various digital processing tasks.
2. High-Speed I/O: Supports multiple high-speed communication standards, making it suitable for data-intensive applications.
3. DSP Capabilities: Includes DSP slices for efficient signal processing tasks.
4. Memory Blocks: Offers embedded memory resources for data storage and retrieval.
5. Power Management: Features advanced power management capabilities, enhancing efficiency.
6. Clock Management: Provides clock management tiles for flexible and reliable clock distribution.
This device is suitable for applications in telecommunications, data centers, and aerospace where high performance and flexibility are required.
Manufacturer
The XCVM1502-1MSEVFVC1760 is a product manufactured by Xilinx, which is a part of AMD (Advanced Micro Devices) following its acquisition. Xilinx is renowned for its development of programmable logic devices, including FPGAs (Field Programmable Gate Arrays), SoCs (System on Chips), and ACAPs (Adaptive Compute Acceleration Platforms). These products are used in a variety of applications including telecommunications, data centers, automotive, and industrial sectors. Xilinx's technologies are integral to creating adaptive and intelligent computing solutions, which allow for high performance and flexibility in various computing tasks.
Application
The XCVM1502-1MSEVFVC1760 is typically used in advanced computing applications requiring high-performance processing and energy efficiency. Common application areas include AI and machine learning systems, data centers, and cloud computing infrastructures. It is also utilized in telecommunications for network optimization, and in automotive industries for supporting autonomous vehicle technologies. Its capabilities make it suitable for handling large datasets and performing complex computations efficiently.
Equivalent
The XCVM1502-1MSEVFVC1760 is a Xilinx Versal ACAP chip. Equivalent products might include other chips from the Xilinx Versal series with similar specifications or offerings from competing brands like Intel's Agilex series. Exact equivalents would depend on the specific requirements such as processing power, DSP capabilities, and I/O interfaces. It's important to compare the datasheets for precise feature and performance matches.
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出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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