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XC7K325T-3FFG676E
IC FPGA 400 I/O 676FCBGA
- メーカー
- Mfr。パート #XC7K325T-3FFG676E
- パッケージ
- データシート
- 在庫中7035
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
RFQおよびもっと割引を得る
仕様
| Series | Kintex®-7 |
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| Number of Logic Elements/Cells | 326080 |
| Total RAM Bits | 16404480 |
| Number of I/O | 400 |
| Voltage - Supply | 0.97V ~ 1.03V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| Base Product Number | XC7K325 |
| Number of LABs/CLBs | 25475 |
概要
Description
The XC7K325T-3FFG676E is a Field Programmable Gate Array (FPGA) from Xilinx's 7 Series, specifically the Kintex-7 family. Designed for high-performance applications, it features 325,000 logic cells, making it suitable for complex digital designs, including signal processing, communications, and embedded systems.
Key characteristics include a maximum operating frequency of up to 450 MHz, support for various I/O standards, and integrated DSP slices for efficient arithmetic operations. With a power-efficient architecture, it provides a balance between performance and power consumption, making it ideal for applications requiring high throughput and low latency.
The device is packaged in a 676-pin FFG (Fine Pitch Ball Grid Array) form factor, facilitating easy integration into various systems. Development tools like Vivado Design Suite enhance design productivity through advanced synthesis, simulation, and implementation capabilities. Overall, the XC7K325T-3FFG676E offers flexibility and scalability for diverse applications in industries such as telecommunications, automotive, and aerospace.
Key characteristics include a maximum operating frequency of up to 450 MHz, support for various I/O standards, and integrated DSP slices for efficient arithmetic operations. With a power-efficient architecture, it provides a balance between performance and power consumption, making it ideal for applications requiring high throughput and low latency.
The device is packaged in a 676-pin FFG (Fine Pitch Ball Grid Array) form factor, facilitating easy integration into various systems. Development tools like Vivado Design Suite enhance design productivity through advanced synthesis, simulation, and implementation capabilities. Overall, the XC7K325T-3FFG676E offers flexibility and scalability for diverse applications in industries such as telecommunications, automotive, and aerospace.
Features
The XC7K325T-3FFG676E is a part of the Xilinx Kintex-7 FPGA family. It features:
1. Logic Cells: 325,000 logic cells providing significant processing power.
2. DSP Slices: 360 DSP slices optimized for high-performance arithmetic operations.
3. Embedded Memory: 18 Mbits of block RAM, supporting efficient data storage and processing.
4. Transceivers: Up to 12.5 Gbps transceivers for high-speed data communication.
5. I/O Pins: 676 package pins with flexible I/O standards, enabling versatile connectivity.
6. Power Efficiency: Designed for low power consumption, making it suitable for mobile and embedded applications.
7. Configuration: Supports multiple configuration options, including JTAG and SPI.
8. Development Tools: Compatible with Xilinx Vivado Design Suite for design and simulation.
This FPGA is ideal for applications in telecommunications, automotive, and industrial automation, combining flexibility with robust performance.
1. Logic Cells: 325,000 logic cells providing significant processing power.
2. DSP Slices: 360 DSP slices optimized for high-performance arithmetic operations.
3. Embedded Memory: 18 Mbits of block RAM, supporting efficient data storage and processing.
4. Transceivers: Up to 12.5 Gbps transceivers for high-speed data communication.
5. I/O Pins: 676 package pins with flexible I/O standards, enabling versatile connectivity.
6. Power Efficiency: Designed for low power consumption, making it suitable for mobile and embedded applications.
7. Configuration: Supports multiple configuration options, including JTAG and SPI.
8. Development Tools: Compatible with Xilinx Vivado Design Suite for design and simulation.
This FPGA is ideal for applications in telecommunications, automotive, and industrial automation, combining flexibility with robust performance.
Package
The XC7K325T-3FFG676E is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically with 676 balls. This type of package is designed for high-density applications and provides excellent thermal and electrical performance.
Pinout
The XC7K325T-3FFG676E is a field-programmable gate array (FPGA) from Xilinx's Kintex-7 series. It features a pin count of 676.
The primary functions of the pins include:
1. General I/O: Configurable as inputs or outputs for interfacing with other devices.
2. Power and Ground: Pins designated for supplying power and grounding the FPGA.
3. Clock Inputs: Dedicated pins for clock signals to synchronize operations.
4. Configuration Pins: Specific pins used for loading configuration data into the FPGA.
5. High-Speed Transceivers: Some pins support high-speed serial communication standards.
This FPGA is designed for high performance and flexibility in applications such as telecommunications, automotive, and data processing.
The primary functions of the pins include:
1. General I/O: Configurable as inputs or outputs for interfacing with other devices.
2. Power and Ground: Pins designated for supplying power and grounding the FPGA.
3. Clock Inputs: Dedicated pins for clock signals to synchronize operations.
4. Configuration Pins: Specific pins used for loading configuration data into the FPGA.
5. High-Speed Transceivers: Some pins support high-speed serial communication standards.
This FPGA is designed for high performance and flexibility in applications such as telecommunications, automotive, and data processing.
Manufacturer
The manufacturer of the XC7K325T-3FFG676E is Xilinx, Inc. Xilinx is a leading company in the field of programmable logic devices, specializing in Field Programmable Gate Arrays (FPGAs), SoCs (System on Chips), and related software tools. Founded in 1984, Xilinx is known for its innovative products that are widely used in various applications, including telecommunications, automotive, industrial automation, and data centers. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in high-performance computing and adaptive computing solutions.
Application
The XC7K325T-3FFG676E is a Xilinx Kintex-7 FPGA used in various application areas, including digital signal processing, telecommunications, video processing, high-performance computing, aerospace and defense, industrial automation, and automotive systems. Its capabilities for parallel processing and high-speed I/O make it suitable for applications requiring real-time data processing and complex algorithms.
Equivalent
The XC7K325T-3FFG676E is a Xilinx Kintex-7 FPGA. Equivalent products include the following:
1. Xilinx Kintex-7 K325T (various package options)
2. Xilinx Virtex-6 FPGA (similar performance tier)
3. Lattice ECP5 or ECP5-5G series (for lower capacity needs)
4. Intel (Altera) Cyclone V or Cyclone 10 series (for affordable alternatives)
Always verify specific requirements like I/O count, speed grade, and power consumption.
1. Xilinx Kintex-7 K325T (various package options)
2. Xilinx Virtex-6 FPGA (similar performance tier)
3. Lattice ECP5 or ECP5-5G series (for lower capacity needs)
4. Intel (Altera) Cyclone V or Cyclone 10 series (for affordable alternatives)
Always verify specific requirements like I/O count, speed grade, and power consumption.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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