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XC4VLX25-11FFG668I
IC FPGA 448 I/O 668FCBGA
- メーカー
- Mfr。パート #XC4VLX25-11FFG668I
- パッケージ 668-BBGA, FCBGA
- データシート
- 在庫中6817
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仕様
| Supplier | AMD Xilinx |
| Package | Tray |
| Series | Virtex®-4 LX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 2688 |
| NumberofLogicElements/Cells | 24192 |
| TotalRAMBits | 1327104 |
| NumberofI/O | 448 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 668-BBGA, FCBGA |
概要
Description
XC4VLX25-11FFG668I is a Xilinx Virtex-4 LX-series FPGA. Key points:
- Architecture: Virtex-4 LX logic device with about 25k logic cells, LUT-based slices, fast carry, and DSP/BRAM resources for digital processing.
- Size/package: Packaged in a 668-ball flip-chip BGA (FFG668), giving a high I/O count and dense routing.
- Speed grade: -11 (moderate performance; not the fastest variant in the family).
- I/O and banks: Multiple I/O banks supporting several standards; sizable I/O capability for complex interfaces.
- On-chip resources: Includes block RAM, DSP slices (DSP capabilities for math-intensive tasks), clocking resources (DCMs/PLLs) for clock management.
- Temperature/compliance: Suffix I typically indicates industrial temperature range and RoHS-compliant manufacturing.
- Typical use: Mid-density FPGA for DSP, embedded processing, data-path, and interface-rich designs where a balance of logic, memory, and I/O is required.
Notes: This is a legacy device from the Virtex-4 era; consult the datasheet and user guide for exact numbers and pinout.
- Architecture: Virtex-4 LX logic device with about 25k logic cells, LUT-based slices, fast carry, and DSP/BRAM resources for digital processing.
- Size/package: Packaged in a 668-ball flip-chip BGA (FFG668), giving a high I/O count and dense routing.
- Speed grade: -11 (moderate performance; not the fastest variant in the family).
- I/O and banks: Multiple I/O banks supporting several standards; sizable I/O capability for complex interfaces.
- On-chip resources: Includes block RAM, DSP slices (DSP capabilities for math-intensive tasks), clocking resources (DCMs/PLLs) for clock management.
- Temperature/compliance: Suffix I typically indicates industrial temperature range and RoHS-compliant manufacturing.
- Typical use: Mid-density FPGA for DSP, embedded processing, data-path, and interface-rich designs where a balance of logic, memory, and I/O is required.
Notes: This is a legacy device from the Virtex-4 era; consult the datasheet and user guide for exact numbers and pinout.
Features
Key features of XC4VLX25-11FFG668I (Virtex-4 LX25 in 668-pin FFG package, speed grade -11):
- FPGA family: Virtex-4 LX (logic-centric)
- Logic resources: ~25K logic cells
- On-chip RAM: ~1 Mb of block RAM (configurable)
- DSP: ~80 DSP slices (DSP48-type)
- I/O: up to ~200 user I/Os across multiple banks; 3.3V tolerant I/O
- Clocking: 2 on-chip PLLs (clock management tiles)
- Core voltage: 2.5V core (I/O banks at 3.3V)
- Packaging: 668-pin Fine Pitch Ball Grid Array (FFG668)
- Features: clock management tile, boundary-scan/JTAG, power-management options
- Speed grade: -11 (relatively slower end of the LX range)
- Suitable for: high-density logic, DSP, and parallel processing tasks in a compact package
Note: Exact counts (BRAM, DSP slices, I/O) may vary slightly by device revision; refer to the official datasheet for precise numbers.
- FPGA family: Virtex-4 LX (logic-centric)
- Logic resources: ~25K logic cells
- On-chip RAM: ~1 Mb of block RAM (configurable)
- DSP: ~80 DSP slices (DSP48-type)
- I/O: up to ~200 user I/Os across multiple banks; 3.3V tolerant I/O
- Clocking: 2 on-chip PLLs (clock management tiles)
- Core voltage: 2.5V core (I/O banks at 3.3V)
- Packaging: 668-pin Fine Pitch Ball Grid Array (FFG668)
- Features: clock management tile, boundary-scan/JTAG, power-management options
- Speed grade: -11 (relatively slower end of the LX range)
- Suitable for: high-density logic, DSP, and parallel processing tasks in a compact package
Note: Exact counts (BRAM, DSP slices, I/O) may vary slightly by device revision; refer to the official datasheet for precise numbers.
Package
Fine-pitch Ball Grid Array (FFG) package, 668 balls (FFG668); industrial temperature range (-I).
Pinout
- Pin count: 668 pins (FFG668 package)
- Function: Virtex-4 LX FPGA (XC4VLX25) – a 25K-logic-cell programmable logic device for digital designs (LUTs, registers, DSP, BRAM, etc.).
- Function: Virtex-4 LX FPGA (XC4VLX25) – a 25K-logic-cell programmable logic device for digital designs (LUTs, registers, DSP, BRAM, etc.).
Manufacturer
Manufacturer: Xilinx, Inc.
What kind of company: An American semiconductor company specializing in programmable logic devices (FPGAs, CPLDs) and related software/IP; now a subsidiary of AMD.
What kind of company: An American semiconductor company specializing in programmable logic devices (FPGAs, CPLDs) and related software/IP; now a subsidiary of AMD.
Application
Typical application areas for the XC4VLX25-11FFG668I include telecom and networking (line cards, packet processing, SERDES), wireless baseband/front-end processing, video/image processing, DSP-intensive signal processing, test and measurement equipment, high-speed data acquisition and instrumentation, embedded aerospace/defense systems, and industrial automation.
Equivalent
Closest direct equivalent: XC4VLX25-11FFG676I (Virtex-4 LX25 in 676-pin FG676 package). Functionally identical aside from package/pinout. There are no other exact drop-in equivalents from Xilinx; any substitute outside Virtex-4 would require redesign.
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DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
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