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XC3S400-4FTG256C
IC FPGA 173 I/O 256FTBGA
- メーカー
- Mfr。パート #XC3S400-4FTG256C
- パッケージ FBGA-256
- データシート
- 在庫中7223
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仕様
| Package | Tray |
| Series | Spartan®-3 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 896 |
| NumberofLogicElements/Cells | 8064 |
| TotalRAMBits | 294912 |
| NumberofI/O | 173 |
| NumberofGates | 400000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 256-LBGA |
概要
Description
The XC3S400-4FTG256C is a field-programmable gate array (FPGA) from Xilinx's Spartan-3 series, designed for cost-effective, high-performance applications. It features 400,000 system gates and comes in a compact 256-ball fine-pitch ball grid array (FBGA) package. The device is built on a 90nm process technology, offering enhanced performance and lower power consumption.
Key features include:
- Configurable Logic Blocks (CLBs): Comprised of look-up tables (LUTs) and flip-flops, allowing for versatile design configurations.
- Digital Signal Processing (DSP) slices: Optimized for high-speed arithmetic operations, making it suitable for signal processing applications.
- I/O capabilities: Supports a variety of I/O standards (LVTTL, LVCMOS, etc.), enabling flexible interfacing with other components.
- On-chip memory: Includes block RAM for data storage needs, enhancing performance for specific applications.
The XC3S400-4FTG256C is widely used in consumer electronics, automotive applications, and communications due to its balance of performance, power, and cost.
Key features include:
- Configurable Logic Blocks (CLBs): Comprised of look-up tables (LUTs) and flip-flops, allowing for versatile design configurations.
- Digital Signal Processing (DSP) slices: Optimized for high-speed arithmetic operations, making it suitable for signal processing applications.
- I/O capabilities: Supports a variety of I/O standards (LVTTL, LVCMOS, etc.), enabling flexible interfacing with other components.
- On-chip memory: Includes block RAM for data storage needs, enhancing performance for specific applications.
The XC3S400-4FTG256C is widely used in consumer electronics, automotive applications, and communications due to its balance of performance, power, and cost.
Features
The XC3S400-4FTG256C is a Field-Programmable Gate Array (FPGA) from Xilinx's Spartan-3 family. Key features include:
1. Logic Cells: It contains 400,000 system gates, enabling complex logic designs.
2. Configurable Logic Blocks (CLBs): Comprised of numerous 4-input LUTs (Look-Up Tables) and flip-flops.
3. I/O Pins: 256 user I/O pins, supporting various voltage levels and I/O standards.
4. Embedded Memory: Includes Block RAM for efficient storage of data within the FPGA.
5. DSP Slices: Supports dedicated DSP slices for high-performance digital signal processing applications.
6. Low Power Consumption: Designed for power efficiency, making it suitable for battery-operated devices.
7. Programmability: User-configurable with a variety of design tools, including Xilinx ISE.
8. Performance: Offers a maximum performance of up to 200 MHz.
This FPGA is ideal for applications in communications, automotive, consumer electronics, and industrial control systems, providing flexibility and scalability in digital design.
1. Logic Cells: It contains 400,000 system gates, enabling complex logic designs.
2. Configurable Logic Blocks (CLBs): Comprised of numerous 4-input LUTs (Look-Up Tables) and flip-flops.
3. I/O Pins: 256 user I/O pins, supporting various voltage levels and I/O standards.
4. Embedded Memory: Includes Block RAM for efficient storage of data within the FPGA.
5. DSP Slices: Supports dedicated DSP slices for high-performance digital signal processing applications.
6. Low Power Consumption: Designed for power efficiency, making it suitable for battery-operated devices.
7. Programmability: User-configurable with a variety of design tools, including Xilinx ISE.
8. Performance: Offers a maximum performance of up to 200 MHz.
This FPGA is ideal for applications in communications, automotive, consumer electronics, and industrial control systems, providing flexibility and scalability in digital design.
Package
The XC3S400-4FTG256C is packaged in a Fine Pitch Ball Grid Array (FBGA) type, specifically with a 256-ball configuration. This compact package type is designed for high-density applications, offering improved thermal performance and reduced footprint for FPGA designs.
Pinout
The XC3S400-4FTG256C is a Spartan-3 FPGA from Xilinx, featuring 256 pins. Its core functions include digital signal processing, logic implementation, and interfacing with various peripherals. The device is designed for high-performance applications, offering 400,000 system gates, multiple I/O configurations, and support for various voltage levels. The pinout includes dedicated power and ground pins, configurable I/O pins, and specific pins for JTAG programming and configuration. Additionally, it supports multiple communication standards, making it versatile for various applications in embedded systems, telecommunications, and more.
Manufacturer
The manufacturer of the XC3S400-4FTG256C is Xilinx, Inc. Xilinx is a leading company in the field of programmable logic devices and is known for its development of field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and system-on-chip (SoC) solutions. Founded in 1984, Xilinx has played a significant role in advancing digital circuits and provides products that serve various applications, including telecommunications, automotive, industrial, and aerospace sectors. The company is recognized for its innovation in reconfigurable computing technology, enabling designers to create custom hardware for specific applications efficiently. In October 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities in high-performance computing and AI solutions.
Application
The XC3S400-4FTG256C is a Spartan-3 FPGA used in various applications such as digital signal processing, communications, automotive systems, industrial control, and embedded systems. Its flexibility allows for custom hardware implementations in areas like video processing, audio processing, and custom logic design, making it suitable for prototyping and low to mid-range performance applications across diverse industries.
Equivalent
The XC3S400-4FTG256C is a Spartan-3 FPGA from Xilinx. Equivalent products include:
1. XC3S200 - a lower capacity Spartan-3 variant.
2. XC3S1000 - a higher capacity Spartan-3 variant.
3. Lattice ICE40 series - lower power alternatives with similar functionality.
4. Altera MAX 10 series - comparable in terms of FPGA capabilities.
For precise compatibility, refer to specific application requirements and design constraints.
1. XC3S200 - a lower capacity Spartan-3 variant.
2. XC3S1000 - a higher capacity Spartan-3 variant.
3. Lattice ICE40 series - lower power alternatives with similar functionality.
4. Altera MAX 10 series - comparable in terms of FPGA capabilities.
For precise compatibility, refer to specific application requirements and design constraints.
出荷
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出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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