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XC3S2000-4FGG676C
IC FPGA 489 I/O 676FBGA
- メーカー
- Mfr。パート #XC3S2000-4FGG676C
- パッケージ FBGA-676
- データシート
- 在庫中5451
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仕様
| Package | Tray |
| Series | Spartan®-3 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 5120 |
| NumberofLogicElements/Cells | 46080 |
| TotalRAMBits | 737280 |
| NumberofI/O | 489 |
| NumberofGates | 2000000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 676-BGA |
概要
Description
The XC3S2000-4FGG676C is a Field-Programmable Gate Array (FPGA) from Xilinx's Spartan-3 family, designed for a wide range of applications including digital signal processing, embedded systems, and custom logic design. It features 2 million system gates, 576 kbits of block RAM, and up to 192 user I/O pins. The device operates at a core voltage of 1.2V and supports a variety of I/O standards, making it suitable for both low-power and high-performance applications.
The "4" in the part number indicates the speed grade, while "FGG" signifies the package type, which is a Fine Pitch Ball Grid Array (FBGA), allowing for a compact design with a high pin count. The XC3S2000 is programmable via standard design tools like Vivado and ISE, making it accessible for developers to implement custom logic. Its versatility, combined with cost-effectiveness and reliability, makes it a popular choice for prototyping and production in industries such as telecommunications, automotive, and consumer electronics.
The "4" in the part number indicates the speed grade, while "FGG" signifies the package type, which is a Fine Pitch Ball Grid Array (FBGA), allowing for a compact design with a high pin count. The XC3S2000 is programmable via standard design tools like Vivado and ISE, making it accessible for developers to implement custom logic. Its versatility, combined with cost-effectiveness and reliability, makes it a popular choice for prototyping and production in industries such as telecommunications, automotive, and consumer electronics.
Features
The XC3S2000-4FGG676C is a field-programmable gate array (FPGA) from the Xilinx Spartan-3 family. Key features include:
1. Logic Cells: Approximately 2,000 logic cells, allowing for a variety of digital designs.
2. Configurable I/O: 676 I/O pins with support for various standards including LVTTL, LVCMOS, and PCI.
3. Dynamically Reconfigurable: Supports partial reconfiguration, enabling updates without halting operation.
4. Memory: 128 Kbits of distributed RAM and 4 Mbits of block RAM for data storage.
5. DSP Slices: Integrated DSP slices for efficient digital signal processing tasks.
6. Clock Management: Features global clock networks and phase-locked loops (PLLs) for timing management.
7. Power Consumption: Designed for low power operation, making it suitable for battery-powered applications.
8. Development Tools: Compatible with Xilinx ISE development environment for design and simulation.
Overall, the XC3S2000-4FGG676C is ideal for embedded systems, automotive applications, and other designs requiring flexibility and scalability.
1. Logic Cells: Approximately 2,000 logic cells, allowing for a variety of digital designs.
2. Configurable I/O: 676 I/O pins with support for various standards including LVTTL, LVCMOS, and PCI.
3. Dynamically Reconfigurable: Supports partial reconfiguration, enabling updates without halting operation.
4. Memory: 128 Kbits of distributed RAM and 4 Mbits of block RAM for data storage.
5. DSP Slices: Integrated DSP slices for efficient digital signal processing tasks.
6. Clock Management: Features global clock networks and phase-locked loops (PLLs) for timing management.
7. Power Consumption: Designed for low power operation, making it suitable for battery-powered applications.
8. Development Tools: Compatible with Xilinx ISE development environment for design and simulation.
Overall, the XC3S2000-4FGG676C is ideal for embedded systems, automotive applications, and other designs requiring flexibility and scalability.
Package
The XC3S2000-4FGG676C is packaged in a Fine Pitch Ball Grid Array (FBGA) with 676 balls. This package type offers a compact design suitable for high-density applications, facilitating efficient thermal performance and electrical connectivity.
Pinout
The XC3S2000-4FGG676C is a Field Programmable Gate Array (FPGA) from the Xilinx Spartan-3 family. It features a pin count of 676 pins.
The main functions of the XC3S2000 include:
- Implementing digital logic circuits.
- Supporting a variety of I/O standards such as LVTTL, LVCMOS, and others.
- Enabling high-speed serial communication protocols.
- Providing programmable interconnect resources for custom circuit designs.
- Supporting embedded block RAM for data storage.
This FPGA is used in applications such as communications, automotive, industrial control, and consumer electronics, among others, where customization and adaptability are essential.
The main functions of the XC3S2000 include:
- Implementing digital logic circuits.
- Supporting a variety of I/O standards such as LVTTL, LVCMOS, and others.
- Enabling high-speed serial communication protocols.
- Providing programmable interconnect resources for custom circuit designs.
- Supporting embedded block RAM for data storage.
This FPGA is used in applications such as communications, automotive, industrial control, and consumer electronics, among others, where customization and adaptability are essential.
Manufacturer
The XC3S2000-4FGG676C is manufactured by Xilinx, Inc., a company specializing in programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), SoCs (System on Chips), and other integrated circuits. Xilinx is known for its innovative solutions in the field of digital design and is a key player in the semiconductor industry. The company provides products and technologies that enable engineers to create customized hardware solutions for various applications, including telecommunications, automotive, aerospace, and industrial automation. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities and market reach.
Application
The XC3S2000-4FGG676C is a Spartan-3 FPGA used in various applications such as telecommunications, automotive systems, consumer electronics, industrial automation, and embedded systems. It supports digital signal processing, image processing, and hardware acceleration tasks, making it suitable for prototyping, data acquisition, and control applications. Its versatility and reconfigurability make it ideal for both development and production environments.
Equivalent
The XC3S2000-4FGG676C is a FPGA from Xilinx's Spartan-3 series. Equivalent products include the XC3S2000-4FGG676, XC3S1500-5FGG676, and other Spartan-3 FPGAs with similar or lower logic capacity and performance. For newer technology, consider the Artix-7 series (e.g., XC7A200T) as a modern alternative. Always check specific requirements like I/O count and configuration.
出荷
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出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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