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XC3S1600E-4FGG320I
IC FPGA 250 I/O 320FBGA
- メーカー
- Mfr。パート #XC3S1600E-4FGG320I
- パッケージ BGA320
- データシート
- 在庫中6716
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仕様
| Package | Tray |
| Series | Spartan®-3E |
| ProductStatus | Active |
| NumberofLABs/CLBs | 3688 |
| NumberofLogicElements/Cells | 33192 |
| TotalRAMBits | 663552 |
| NumberofI/O | 250 |
| NumberofGates | 1600000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 320-BGA |
概要
Description
The XC3S1600E-4FGG320I is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3E family. It features 1.6 million system gates, providing a versatile platform for various digital logic applications. The device operates at a maximum clock speed of 250 MHz and supports a range of I/O standards, making it suitable for high-performance designs.
The "-4" indicates the speed grade, while "FGG320" refers to the package type, which is a fine-pitch ball grid array (FBGA) with 320 balls, facilitating dense circuit layouts. The "I" at the end signifies that the device is industrial grade, capable of functioning in a wider temperature range for robust applications.
Common applications include digital signal processing, communications, and embedded systems, where flexibility and reconfigurability are essential. The XC3S1600E also supports various design tools, such as Xilinx ISE, enabling users to implement complex designs efficiently.
The "-4" indicates the speed grade, while "FGG320" refers to the package type, which is a fine-pitch ball grid array (FBGA) with 320 balls, facilitating dense circuit layouts. The "I" at the end signifies that the device is industrial grade, capable of functioning in a wider temperature range for robust applications.
Common applications include digital signal processing, communications, and embedded systems, where flexibility and reconfigurability are essential. The XC3S1600E also supports various design tools, such as Xilinx ISE, enabling users to implement complex designs efficiently.
Features
The XC3S1600E-4FGG320I is a Spartan-3E FPGA from Xilinx, designed for cost-effective applications. Key features include:
- Logic Cells: 1.6 million system gates with 3,840 logic cells.
- I/O Pins: Up to 232 I/O pins, supporting various I/O standards.
- Memory: 18 Kb Block RAM, providing up to 4.5 Mbits of integrated memory.
- DSP Slices: Includes 8 DSP slices for efficient signal processing.
- Speed Grade: Operates at a speed grade of -4, ensuring high performance for time-sensitive applications.
- Configuration: Supports JTAG, SPI, and other configuration methods.
- Power Consumption: Low power consumption, suitable for battery-operated devices.
- Development Tools: Compatible with Xilinx ISE Design Suite for design and implementation.
This FPGA is ideal for applications in communications, automotive, consumer electronics, and industrial control systems.
- Logic Cells: 1.6 million system gates with 3,840 logic cells.
- I/O Pins: Up to 232 I/O pins, supporting various I/O standards.
- Memory: 18 Kb Block RAM, providing up to 4.5 Mbits of integrated memory.
- DSP Slices: Includes 8 DSP slices for efficient signal processing.
- Speed Grade: Operates at a speed grade of -4, ensuring high performance for time-sensitive applications.
- Configuration: Supports JTAG, SPI, and other configuration methods.
- Power Consumption: Low power consumption, suitable for battery-operated devices.
- Development Tools: Compatible with Xilinx ISE Design Suite for design and implementation.
This FPGA is ideal for applications in communications, automotive, consumer electronics, and industrial control systems.
Package
The XC3S1600E-4FGG320I is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically with 320 balls. This type of package provides a compact footprint and efficient thermal performance, suitable for high-density applications.
Pinout
The XC3S1600E-4FGG320I is a Spartan-3E FPGA from Xilinx, featuring a pin count of 320. It operates in a Fine-Pitch Ball Grid Array (FBGA) package. The device is primarily used for various digital logic applications, including embedded processing, signal processing, and communications.
Key functions of the XC3S1600E include:
1. Logic Capacity: It has a logic cell count of 1,600, allowing for the implementation of complex designs.
2. I/O Capability: Supports multiple I/O standards, providing flexibility for interfacing with other devices.
3. Embedded Block RAM: Contains multiple kilobits of block RAM for data storage and processing.
4. DSP Slices: Equipped with DSP slices for efficient arithmetic operations.
5. Configuration Options: Supports several configuration modes, including JTAG and serial modes.
This FPGA is widely used in applications requiring high performance and flexibility.
Key functions of the XC3S1600E include:
1. Logic Capacity: It has a logic cell count of 1,600, allowing for the implementation of complex designs.
2. I/O Capability: Supports multiple I/O standards, providing flexibility for interfacing with other devices.
3. Embedded Block RAM: Contains multiple kilobits of block RAM for data storage and processing.
4. DSP Slices: Equipped with DSP slices for efficient arithmetic operations.
5. Configuration Options: Supports several configuration modes, including JTAG and serial modes.
This FPGA is widely used in applications requiring high performance and flexibility.
Manufacturer
The manufacturer of the XC3S1600E-4FGG320I is Xilinx, Inc., which is a leading semiconductor company headquartered in San Jose, California. Xilinx specializes in designing and developing programmable logic devices, including Field-Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and System on Chips (SoCs). The XC3S1600E is part of the Spartan-3E family of FPGAs, known for their cost-effectiveness and performance in various applications such as communications, automotive, industrial, and consumer electronics.
Xilinx plays a pivotal role in the electronics industry by providing solutions that enable designers to create customizable hardware and software systems. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further enhancing its capabilities in the field of high-performance computing and adaptive computing solutions.
Xilinx plays a pivotal role in the electronics industry by providing solutions that enable designers to create customizable hardware and software systems. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further enhancing its capabilities in the field of high-performance computing and adaptive computing solutions.
Application
The XC3S1600E-4FGG320I is a Spartan-3E FPGA used in various applications such as digital signal processing, embedded systems, communications, industrial automation, automotive electronics, and consumer electronics. Its versatility supports prototyping, hardware acceleration, and custom logic implementations in fields like imaging, video processing, and control systems.
Equivalent
The XC3S1600E-4FGG320I is a Spartan-3E FPGA from Xilinx. Equivalent products include:
1. Lattice ECP3-70: Another FPGA family offering similar features.
2. Altera Cyclone III EP3C16: Comparable in logic density and performance.
3. Microsemi SmartFusion: A mixed-signal FPGA with similar capabilities.
When selecting alternatives, consider specific application requirements like I/O count, speed, and power consumption.
1. Lattice ECP3-70: Another FPGA family offering similar features.
2. Altera Cyclone III EP3C16: Comparable in logic density and performance.
3. Microsemi SmartFusion: A mixed-signal FPGA with similar capabilities.
When selecting alternatives, consider specific application requirements like I/O count, speed, and power consumption.
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出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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