画像は参照用のみです。
XC3S1600E-4FG320I
IC FPGA 250 I/O 320FBGA
- メーカー
- Mfr。パート #XC3S1600E-4FG320I
- パッケージ
- データシート
- 在庫中3846
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
RFQおよびもっと割引を得る
仕様
| Series | Spartan®-3E |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Number of Logic Elements/Cells | 33192 |
| Total RAM Bits | 663552 |
| Number of I/O | 250 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 320-BGA |
| Supplier Device Package | 320-FBGA (19x19) |
| Base Product Number | XC3S1600 |
| Number of LABs/CLBs | 3688 |
| Number of Gates | 1600000 |
概要
Description
The XC3S1600E-4FG320I is a member of the Xilinx Spartan-3E FPGA (Field Programmable Gate Array) family, designed for a wide range of applications, including digital signal processing, communications, and embedded systems. It features a capacity of 1.6 million system gates, with 4,560 logic cells, and supports a variety of I/O standards.
Key specifications include a maximum operating frequency of up to 200 MHz, 32 DSP slices for efficient digital signal processing, and integrated block RAM for data storage. The FPGA is provided in a compact 320-pin Fine Pitch Ball Grid Array (FBGA) package, enabling high-density designs.
The XC3S1600E-4FG320I is notable for its low power consumption and versatile functionality, making it suitable for both consumer and industrial applications. It is programmed using Xilinx's ISE Design Suite, which provides a comprehensive development environment for design and implementation. Overall, the XC3S1600E is a cost-effective solution for engineers seeking flexibility and performance in their digital designs.
Key specifications include a maximum operating frequency of up to 200 MHz, 32 DSP slices for efficient digital signal processing, and integrated block RAM for data storage. The FPGA is provided in a compact 320-pin Fine Pitch Ball Grid Array (FBGA) package, enabling high-density designs.
The XC3S1600E-4FG320I is notable for its low power consumption and versatile functionality, making it suitable for both consumer and industrial applications. It is programmed using Xilinx's ISE Design Suite, which provides a comprehensive development environment for design and implementation. Overall, the XC3S1600E is a cost-effective solution for engineers seeking flexibility and performance in their digital designs.
Features
The XC3S1600E-4FG320I is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3E family. Key features include:
1. Capacity: It offers 1.6 million system gates.
2. Logic Cells: Contains 3,840 logic cells, providing flexible logic functionality.
3. Embedded Memory: Supports up to 144 Kbits of block RAM for data storage.
4. I/O Pins: Features 320 user I/O pins, allowing extensive connectivity options.
5. Speed Grade: The "4" indicates a speed grade optimized for performance.
6. Power Efficiency: Designed for low power consumption, suitable for portable applications.
7. Programmability: Reconfigurable architecture allows for multiple applications and updates.
8. Development Support: Compatible with Xilinx's ISE design tools for development and simulation.
These features make the XC3S1600E-4FG320I an ideal choice for various applications, including telecommunications, automotive systems, and industrial equipment.
1. Capacity: It offers 1.6 million system gates.
2. Logic Cells: Contains 3,840 logic cells, providing flexible logic functionality.
3. Embedded Memory: Supports up to 144 Kbits of block RAM for data storage.
4. I/O Pins: Features 320 user I/O pins, allowing extensive connectivity options.
5. Speed Grade: The "4" indicates a speed grade optimized for performance.
6. Power Efficiency: Designed for low power consumption, suitable for portable applications.
7. Programmability: Reconfigurable architecture allows for multiple applications and updates.
8. Development Support: Compatible with Xilinx's ISE design tools for development and simulation.
These features make the XC3S1600E-4FG320I an ideal choice for various applications, including telecommunications, automotive systems, and industrial equipment.
Package
The XC3S1600E-4FG320I is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically in a 320-ball configuration. This package type provides a compact design with efficient thermal performance and is suitable for high-density applications.
Pinout
The XC3S1600E-4FG320I is a field-programmable gate array (FPGA) from Xilinx's Spartan-3E family. It features a pin count of 320 pins.
In terms of function, this FPGA is designed for various applications including digital signal processing, communications, and embedded systems. It offers a combination of configurable logic blocks (CLBs), digital signal processing (DSP) slices, and memory resources, providing flexibility for implementing custom logic and complex algorithms. The "4" in the part number indicates the speed grade, specifying its performance characteristics. The "I" at the end denotes that it is the industrial temperature grade, suitable for more demanding environmental conditions.
In terms of function, this FPGA is designed for various applications including digital signal processing, communications, and embedded systems. It offers a combination of configurable logic blocks (CLBs), digital signal processing (DSP) slices, and memory resources, providing flexibility for implementing custom logic and complex algorithms. The "4" in the part number indicates the speed grade, specifying its performance characteristics. The "I" at the end denotes that it is the industrial temperature grade, suitable for more demanding environmental conditions.
Manufacturer
The XC3S1600E-4FG320I is manufactured by Xilinx, Inc., a company known for its development of programmable logic devices, particularly Field Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and associated software tools. Founded in 1984 and headquartered in San Jose, California, Xilinx is a pioneer in the FPGA industry and has played a significant role in advancing programmable logic technology. The company's products are widely used in various applications, including telecommunications, automotive, aerospace, industrial, and consumer electronics, enabling engineers to create customizable hardware solutions for their specific needs. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities in high-performance computing and adaptive computing solutions.
Application
The XC3S1600E-4FG320I is a Spartan-3E FPGA used in various applications, including digital signal processing, embedded systems, automotive systems, industrial automation, and consumer electronics. Its versatility allows for custom logic implementations, high-speed data processing, and control systems in applications like robotics, communication devices, and image processing.
Equivalent
The XC3S1600E-4FG320I is a Spartan-3E FPGA from Xilinx. Equivalent products include the Lattice MachXO2-256, Intel (Altera) Cyclone IV EP4CE15, and Microsemi SmartFusion2 M2S010. These alternatives offer similar features and capabilities, but specific compatibility may vary based on your application requirements. Always check datasheets for precise specifications.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
支払い
Payment Methods
支払い期間は100%前払いです。
現在、下記の支払い方法のみを受け入れています。:
1. ペイパル
2. クレジット・デビットカード
3. ワイヤー 転送
類似
-
MX25L3233FZBI-08Q
Macronix
-
MX25L3233FM1I-08Q
Macronix
-
MX25V1635FZNI
Macronix
-
MX29F400CBTI-70G
Macronix
-
MX66U1G45GXDI00
Macronix
-
MX30LF2G28AD-TI
Macronix
-
MX25R6435FBDIL0
Macronix
-
MX25L25673GMI-08G
Macronix
-
MX25L25673GMI-10G
Macronix
-
MX25U51279GXDR00
Macronix
-
MX25L2006EM1I-12G
Macronix
-
MX25V1635FM2I
Macronix