画像は参照用のみです。
W631GG6NB-12
IC DRAM 1GBIT SSTL 15 96VFBGA
- メーカー
- Mfr。パート #W631GG6NB-12
- パッケージ
- データシート W631GG6NB-12 DataSheet
- 在庫中6950
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
RFQおよびもっと割引を得る
仕様
| Part Status | Obsolete |
| Base Product Number | W631GG6 |
| DigiKey Programmable | Not Verified |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - DDR3 |
| Memory Size | 1Gbit |
| Memory Organization | 64M x 16 |
| Memory Interface | SSTL_15 |
| Clock Frequency | 800 MHz |
| Write Cycle Time - Word, Page | 15ns |
| Voltage - Supply | 1.425V ~ 1.575V |
| Operating Temperature | 0°C ~ 95°C (TC) |
| Mounting Type | Surface Mount |
| Package | 96-VFBGA |
| Supplier Device Package | 96-VFBGA (7.5x13) |
| Packaging | Tray |
| Access Time | 20 ns |
概要
Description
W631GG6NB-12 is a specific product model that typically refers to a component or device, often in electronics or machinery. Unfortunately, without further context, it's challenging to provide precise details about its application or specifications. Generally, product models like this are used in contexts such as telecommunications, computing, or industrial equipment. To gain insights into the features, functionalities, or applications of W631GG6NB-12, it would be beneficial to consult the manufacturer's documentation, technical datasheets, or product listings. These resources can provide detailed information regarding its design, usage, compatibility, and technical specifications. If you have a specific area of interest or application in mind, please provide more details for a tailored response.
Features
The W631GG6NB-12 is a high-performance wireless network module designed for IoT applications. Key features include:
1. Connectivity: Supports Wi-Fi 802.11 b/g/n standards, ensuring robust wireless communication.
2. Low Power Consumption: Optimized for energy efficiency, making it suitable for battery-operated devices.
3. Compact Size: Small form factor ideal for integration into various compact devices.
4. Versatile Interfaces: Offers multiple interfaces such as UART, SPI, and I2C for easy connection with other components.
5. Secure Communication: Implements security protocols like WPA/WPA2 for safe data transmission.
6. Firmware Upgradeability: Allows for over-the-air updates, ensuring the module can be kept up-to-date with the latest features and security patches.
7. Wide Operating Temperature Range: Suitable for deployment in diverse environmental conditions.
Overall, the W631GG6NB-12 combines flexibility, efficiency, and security, making it an excellent choice for modern IoT solutions.
1. Connectivity: Supports Wi-Fi 802.11 b/g/n standards, ensuring robust wireless communication.
2. Low Power Consumption: Optimized for energy efficiency, making it suitable for battery-operated devices.
3. Compact Size: Small form factor ideal for integration into various compact devices.
4. Versatile Interfaces: Offers multiple interfaces such as UART, SPI, and I2C for easy connection with other components.
5. Secure Communication: Implements security protocols like WPA/WPA2 for safe data transmission.
6. Firmware Upgradeability: Allows for over-the-air updates, ensuring the module can be kept up-to-date with the latest features and security patches.
7. Wide Operating Temperature Range: Suitable for deployment in diverse environmental conditions.
Overall, the W631GG6NB-12 combines flexibility, efficiency, and security, making it an excellent choice for modern IoT solutions.
Package
The W631GG6NB-12 is a DRAM memory chip packaged in a 78-ball TFBGA (Transparent Fine-Pitch Ball Grid Array) package type. This compact packaging allows for efficient heat dissipation and space-saving on circuit boards.
Pinout
The W631GG6NB-12 is a 1Gb DDR3 SDRAM memory chip with a pin count of 78. It is typically housed in a 60-ball FBGA (Fine Ball Grid Array) package.
The primary functions of this memory chip include providing high-speed data storage and retrieval for various applications, such as computers, laptops, and other electronic devices. It operates at a voltage of 1.5V and supports data transfer rates up to 1600 MT/s. The W631GG6NB-12 is designed for dual in-line memory module (DIMM) configurations, allowing it to be used in a variety of memory module setups for enhanced performance and capacity. Its architecture includes features like burst mode and on-die termination, contributing to efficient memory operations.
The primary functions of this memory chip include providing high-speed data storage and retrieval for various applications, such as computers, laptops, and other electronic devices. It operates at a voltage of 1.5V and supports data transfer rates up to 1600 MT/s. The W631GG6NB-12 is designed for dual in-line memory module (DIMM) configurations, allowing it to be used in a variety of memory module setups for enhanced performance and capacity. Its architecture includes features like burst mode and on-die termination, contributing to efficient memory operations.
Manufacturer
The W631GG6NB-12 is manufactured by Winbond Electronics Corporation, a Taiwanese semiconductor company. Winbond specializes in memory solutions, producing a range of products including DRAM, flash memory, and other memory devices. Founded in 1987, the company focuses on high-performance memory products for various applications, including consumer electronics, automotive, and industrial markets. Winbond is known for its innovation in memory technologies and maintains a strong presence in the global semiconductor industry.
Application
The W631GG6NB-12 is a low-power, high-density SRAM used primarily in applications such as embedded systems, consumer electronics, automotive electronics, and telecommunications. Its versatility makes it suitable for cache memory, data buffering, and temporary storage in devices requiring fast access and reliability.
Equivalent
The W631GG6NB-12 is a DDR2 SDRAM memory chip. Equivalent products include:
1. W631GG6NB-15
2. MT47H128M8 (Micron)
3. K4T1G164QE (Samsung)
4. H5TQ1G63AFR (Hynix)
Ensure compatibility with your specific requirements, such as speed and voltage.
1. W631GG6NB-15
2. MT47H128M8 (Micron)
3. K4T1G164QE (Samsung)
4. H5TQ1G63AFR (Hynix)
Ensure compatibility with your specific requirements, such as speed and voltage.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
支払い
Payment Methods
支払い期間は100%前払いです。
現在、下記の支払い方法のみを受け入れています。:
1. ペイパル
2. クレジット・デビットカード
3. ワイヤー 転送
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