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W29N02GVSIAF
IC FLASH 2GBIT 48-TSOP
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- Mfr。パート #W29N02GVSIAF
- パッケージ
- データシート
- 在庫中7160
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
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仕様
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND (SLC) |
| Memory Size | 2Gbit |
| Memory Organization | 256M x 8 |
| Write Cycle Time - Word, Page | 25ns |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 48-TFSOP (0.724", 18.40mm Width) |
| Supplier Device Package | 48-TSOP |
| Base Product Number | W29N02 |
| Access Time | 25 ns |
概要
Description
"W29N02GVSIAF" appears to be a technical code or part number, possibly related to a specific product or component in fields like electronics, software, or telecommunications. Without additional context, it's challenging to pinpoint its exact nature or application. Typically, codes like this are used for identification, allowing manufacturers and users to efficiently manage inventory, ensure compatibility, and facilitate technical support. If this is a part number, it could relate to specifications like size, capacity, or version. In electronics, such numbers often refer to components such as memory chips, processors, or modules. Understanding its specific use would require consulting the manufacturer’s documentation or product catalog, where detailed descriptions and specifications are provided. If the code is from a specific company or industry, visiting their official website or contacting customer support could offer more detailed insights.
Features
The model number W29N02GVSIAF appears to reference a specific type of NAND flash memory chip, often used in various electronic devices for storage. While detailed specifications can vary by manufacturer and product line, flash memory chips like this one generally include the following features:
1. Capacity: Typically, these chips offer a range of storage capacities, which could be anything from a few gigabytes to terabytes, depending on the specific model.
2. Technology: NAND flash, known for high-density data storage, usually employs either SLC (Single-Level Cell), MLC (Multi-Level Cell), TLC (Triple-Level Cell), or QLC (Quad-Level Cell) technology, affecting speed, durability, and cost.
3. Interface: Common interfaces include parallel or serial (such as SPI) for communication with other components.
4. Performance: NAND flash chips are valued for their fast read and write speeds, though specific performance metrics will depend on the architecture and manufacturing technology.
5. Endurance and Reliability: Includes features for wear leveling, bad block management, and error correction to enhance longevity and data integrity.
6. Applications: Used in SSDs, mobile devices, cameras, and embedded systems for storage purposes.
For precise features and specifications, referring to the manufacturer's datasheet is recommended.
1. Capacity: Typically, these chips offer a range of storage capacities, which could be anything from a few gigabytes to terabytes, depending on the specific model.
2. Technology: NAND flash, known for high-density data storage, usually employs either SLC (Single-Level Cell), MLC (Multi-Level Cell), TLC (Triple-Level Cell), or QLC (Quad-Level Cell) technology, affecting speed, durability, and cost.
3. Interface: Common interfaces include parallel or serial (such as SPI) for communication with other components.
4. Performance: NAND flash chips are valued for their fast read and write speeds, though specific performance metrics will depend on the architecture and manufacturing technology.
5. Endurance and Reliability: Includes features for wear leveling, bad block management, and error correction to enhance longevity and data integrity.
6. Applications: Used in SSDs, mobile devices, cameras, and embedded systems for storage purposes.
For precise features and specifications, referring to the manufacturer's datasheet is recommended.
Package
The package type "W29N02GVSIAF" refers to a specific NAND Flash memory chip from Winbond, typically in a WSON (Wafer-Level Small Outline No-Lead) package. These packages are compact, offering efficient space utilization and thermal performance, commonly used in applications requiring non-volatile memory.
Pinout
The W29N02GVSIAF is a NAND Flash memory chip manufactured by Winbond. It features a total of 48 pins. This chip is used for storage solutions that require non-volatile memory. Its primary function is to store data persistently, even without power, making it suitable for applications such as embedded systems, consumer electronics, and solid-state drives.
The specific pin functions include power supply pins (VCC, VSS), data input/output pins (I/O[0:15]), address latch enable (ALE), command latch enable (CLE), chip enable (CE#), write enable (WE#), read enable (RE#), and ready/busy output (R/B#) among others. These pins work together to facilitate the reading, writing, and erasing of data within the memory chip, allowing for effective data management in various applications. The detailed functionality of each pin can be found in the chip's datasheet provided by Winbond.
The specific pin functions include power supply pins (VCC, VSS), data input/output pins (I/O[0:15]), address latch enable (ALE), command latch enable (CLE), chip enable (CE#), write enable (WE#), read enable (RE#), and ready/busy output (R/B#) among others. These pins work together to facilitate the reading, writing, and erasing of data within the memory chip, allowing for effective data management in various applications. The detailed functionality of each pin can be found in the chip's datasheet provided by Winbond.
Manufacturer
The manufacturer of the W29N02GVSIAF is Winbond Electronics Corporation. Winbond is a Taiwanese company known for designing and producing semiconductor memory solutions. They specialize in a range of products, including NOR flash, NAND flash, and DRAM, catering to various applications in consumer, automotive, industrial, and computing markets. Winbond is recognized for its focus on innovation and the production of memory components that are essential for a wide array of electronic devices.
Application
The W29N02GVSIAF is a NAND flash memory chip, commonly used in applications requiring reliable data storage. These areas typically include consumer electronics like smartphones and tablets, embedded systems, solid-state drives (SSDs), and industrial equipment. Its non-volatile nature makes it suitable for applications that need to retain data without continuous power supply, ensuring data integrity in various operational environments.
Equivalent
The W29N02GVSIAF is a NAND Flash memory chip by Winbond. Equivalent products could include NAND Flash memory chips with similar specifications from manufacturers like Micron, Samsung, Toshiba/Kioxia, and SK Hynix. Specific models like Micron's MT29F2G08ABAEAWP-IT, Samsung's K9F2G08U0F, or Toshiba's TC58NVG2S0FTA00 may be comparable, but it's important to verify the exact specifications such as capacity, interface, voltage, and package to ensure compatibility.
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出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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