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W25Q256JWBIQ
IC FLASH 256MBIT SPI 24TFBGA
- メーカー
- Mfr。パート #W25Q256JWBIQ
- パッケージ
- データシート W25Q256JWBIQ DataSheet
- 在庫中8872
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仕様
| Series | SpiFlash® |
| Part Status | Active |
| Base Product Number | W25Q256 |
| DigiKey Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 256Mbit |
| Memory Organization | 32M x 8 |
| Memory Interface | SPI - Quad I/O |
| Clock Frequency | 133 MHz |
| Write Cycle Time - Word, Page | 5ms |
| Voltage - Supply | 1.7V ~ 1.95V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package | 24-TBGA |
| Supplier Device Package | 24-TFBGA (6x8) |
| Packaging | Tray |
| Access Time | 6 ns |
概要
Description
The W25Q256JWBIQ is Winbond’s 256‑Mbit serial NOR flash memory. It provides non‑volatile storage for firmware or data in embedded systems and is SPI‑compatible.
Key points
- Capacity and voltage: ~32 MB of storage powered typically from 3.3 V.
- Interface: SPI-compatible; supports standard SPI reads, fast reads, and higher‑throughput dual/quad I/O modes (and QPI on supported variants).
- Organization and operations: 8‑bit I/O; page program (typically 256 bytes); sector erase (4 KB) and larger block/chip Erase options.
- Features: security and protection registers, deep power‑down, resume from DP, and data retention typically on the order of decades; endurance around 100k P/E cycles (device wear).
- Temperature and packaging: industrial-grade option (-40°C to 85°C, suffix “IQ”); available in common 8‑pin packages (e.g., SOIC/VSON).
Typical uses
- Firmware storage and execution in place (XIP), boot ROMs, application code storage, data logging.
Note: Exact timings, voltage ranges, supported modes, and package options vary by part revision; consult the latest W25Q256JWBIQ datasheet for precise specs.
Key points
- Capacity and voltage: ~32 MB of storage powered typically from 3.3 V.
- Interface: SPI-compatible; supports standard SPI reads, fast reads, and higher‑throughput dual/quad I/O modes (and QPI on supported variants).
- Organization and operations: 8‑bit I/O; page program (typically 256 bytes); sector erase (4 KB) and larger block/chip Erase options.
- Features: security and protection registers, deep power‑down, resume from DP, and data retention typically on the order of decades; endurance around 100k P/E cycles (device wear).
- Temperature and packaging: industrial-grade option (-40°C to 85°C, suffix “IQ”); available in common 8‑pin packages (e.g., SOIC/VSON).
Typical uses
- Firmware storage and execution in place (XIP), boot ROMs, application code storage, data logging.
Note: Exact timings, voltage ranges, supported modes, and package options vary by part revision; consult the latest W25Q256JWBIQ datasheet for precise specs.
Features
Key features of W25Q256JWBIQ (Winbond 256-Mbit serial flash):
- Density and packaging: 256 Mb (32 MB) serial flash in an 8-pin package.
- Supply voltage: 2.7–3.6 V (typical 3.3 V).
- Memory organization: 256-byte pages; 4 KB sectors; 64 KB blocks; chip erase option.
- Interface: SPI core with single, dual, and quad I/O modes (Quad SPI; supports fast read and higher‑throughput modes).
- Speed: fast read up to high MHz operation (typical up to 104 MHz clock).
- Endurance and retention: ~100,000 program/erase cycles; data retention typically ~20 years.
- Power management: low-power modes including Deep Power-Down with wake via command.
- Security and protection: software and hardware write protection, status register (WIP/WEL), and protection mechanisms for regions.
- Identification and security features: JEDEC ID and 64‑bit unique ID support.
- Operating range: -40°C to 85°C (industrial grade).
- Typical applications: firmware/BIOS storage, boot memory, code protection in embedded systems.
Note: exact supported modes (e.g., QPI) and block/sector configuration can vary by package revision.
- Density and packaging: 256 Mb (32 MB) serial flash in an 8-pin package.
- Supply voltage: 2.7–3.6 V (typical 3.3 V).
- Memory organization: 256-byte pages; 4 KB sectors; 64 KB blocks; chip erase option.
- Interface: SPI core with single, dual, and quad I/O modes (Quad SPI; supports fast read and higher‑throughput modes).
- Speed: fast read up to high MHz operation (typical up to 104 MHz clock).
- Endurance and retention: ~100,000 program/erase cycles; data retention typically ~20 years.
- Power management: low-power modes including Deep Power-Down with wake via command.
- Security and protection: software and hardware write protection, status register (WIP/WEL), and protection mechanisms for regions.
- Identification and security features: JEDEC ID and 64‑bit unique ID support.
- Operating range: -40°C to 85°C (industrial grade).
- Typical applications: firmware/BIOS storage, boot memory, code protection in embedded systems.
Note: exact supported modes (e.g., QPI) and block/sector configuration can vary by package revision.
Package
8-pin SOP (SOIC8) package.
Pinout
- Pin count: 8 pins (SOP-8).
- Function: 256‑Mbit serial SPI flash memory (nonvolatile storage for firmware/data). Interface uses SPI: CS, DI/MOSI, DO/MISO, CLK, plus WP, HOLD, VCC, GND.
- Function: 256‑Mbit serial SPI flash memory (nonvolatile storage for firmware/data). Interface uses SPI: CS, DI/MOSI, DO/MISO, CLK, plus WP, HOLD, VCC, GND.
Manufacturer
- Manufacturer: Winbond Electronics Corporation.
- What kind of company: A Taiwanese semiconductor company that designs and manufactures memory integrated circuits (notably NOR flash, DRAM, SRAM) for global markets.
- What kind of company: A Taiwanese semiconductor company that designs and manufactures memory integrated circuits (notably NOR flash, DRAM, SRAM) for global markets.
Application
W25Q256JWBIQ is a 256‑Mbit serial NOR Flash (Quad I/O) used for non-volatile storage in embedded systems. Common applications include:
- Firmware storage/execution for MCUs/SoCs
- Bootloaders and secure boot storage
- Firmware updates and recovery
- Data logging in embedded devices
- IoT devices, consumer electronics (set‑top boxes, cameras, printers)
- Automotive and industrial controllers
- Networking equipment (routers, switches)
- Firmware storage/execution for MCUs/SoCs
- Bootloaders and secure boot storage
- Firmware updates and recovery
- Data logging in embedded devices
- IoT devices, consumer electronics (set‑top boxes, cameras, printers)
- Automotive and industrial controllers
- Networking equipment (routers, switches)
Equivalent
Equivalent 256-Mbit SPI flash parts include:
- Macronix MX25L256 (MX25L25645G)
- Micron N25Q256A
- Spansion/Cypress S25FL256S
- GigaDevice GD25Q256
- Puya P25Q256
- SST SST25VF256 (and SST25WF256)
- Eon EN25Q256
Note: exact pinout, voltage (≈3V), and timing must be verified for interchangeability.
- Macronix MX25L256 (MX25L25645G)
- Micron N25Q256A
- Spansion/Cypress S25FL256S
- GigaDevice GD25Q256
- Puya P25Q256
- SST SST25VF256 (and SST25WF256)
- Eon EN25Q256
Note: exact pinout, voltage (≈3V), and timing must be verified for interchangeability.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
支払い
Payment Methods
支払い期間は100%前払いです。
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3. ワイヤー 転送
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