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THGBMJG8C4LBAU8
IC FLASH 256GBIT EMMC 153FBGA
- メーカー
- Mfr。パート #THGBMJG8C4LBAU8
- パッケージ FBGA-153
- データシート
- 在庫中5594
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
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仕様
| Package | Tray |
| Series | e•MMC™ |
| ProductStatus | Active |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NAND |
| MemorySize | 256Gb (32G x 8) |
| MemoryInterface | eMMC |
| OperatingTemperature | -40°C ~ 105°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 153-WFBGA |
概要
Description
It seems that "THGBMJG8C4LBAU8" refers to a specific code, possibly related to an electronic component, product, or system. However, without additional context, it’s challenging to provide an accurate introduction.
If it pertains to a memory chip, for instance, it may denote a particular model or serial number from a manufacturer, often used in electronics for identification and specification purposes. Such codes typically include information about the technology, capacity, speed, and other characteristics of the item.
For a comprehensive understanding, more details about the context in which THGBMJG8C4LBAU8 is used would be needed, such as its application, manufacturer, or related specifications. Please provide additional information for a more tailored response.
If it pertains to a memory chip, for instance, it may denote a particular model or serial number from a manufacturer, often used in electronics for identification and specification purposes. Such codes typically include information about the technology, capacity, speed, and other characteristics of the item.
For a comprehensive understanding, more details about the context in which THGBMJG8C4LBAU8 is used would be needed, such as its application, manufacturer, or related specifications. Please provide additional information for a more tailored response.
Features
The THGBMJG8C4LBAU8 is a NAND flash memory chip produced by Toshiba. It typically features:
1. Type: Multi-Level Cell (MLC) NAND flash technology.
2. Capacity: 8 Gb (Gigabits), equivalent to 1 GB (Gigabyte).
3. Interface: It usually uses a Serial Peripheral Interface (SPI) for communication, facilitating easy integration into various devices.
4. Endurance: Designed for high endurance, making it suitable for applications that require frequent read/write cycles.
5. Applications: Commonly used in consumer electronics, embedded systems, smartphones, tablets, and other devices requiring reliable storage solutions.
6. Performance: Offers a balance between speed and power efficiency, suitable for low-power applications.
This chip is particularly valued for its compact size and reliability in data storage solutions.
1. Type: Multi-Level Cell (MLC) NAND flash technology.
2. Capacity: 8 Gb (Gigabits), equivalent to 1 GB (Gigabyte).
3. Interface: It usually uses a Serial Peripheral Interface (SPI) for communication, facilitating easy integration into various devices.
4. Endurance: Designed for high endurance, making it suitable for applications that require frequent read/write cycles.
5. Applications: Commonly used in consumer electronics, embedded systems, smartphones, tablets, and other devices requiring reliable storage solutions.
6. Performance: Offers a balance between speed and power efficiency, suitable for low-power applications.
This chip is particularly valued for its compact size and reliability in data storage solutions.
Package
The THGBMJG8C4LBAU8 is a NAND flash memory chip from Toshiba, typically packaged in a BGA (Ball Grid Array) format. This type of packaging allows for efficient thermal dissipation and a compact footprint, making it suitable for various applications in consumer electronics and computing devices.
Pinout
The THGBMJG8C4LBAU8 is a NAND flash memory chip manufactured by Toshiba. It features a total of 48 pins. The key functions of these pins include:
1. Power Supply Pins (VCC, VSS): Provide power to the chip.
2. Data Pins (D0-D7): Used for data input and output during read and write operations.
3. Command Pins (CE, WE, RE): Control chip enable, write enable, and read enable functions.
4. Address Pins (A0-A19): Used to address memory locations.
5. Status Pins (R/B): Indicate the status of the device (ready/busy).
6. Miscellaneous Pins: May include pins for additional functionalities, such as reset or protection.
This device is typically employed in consumer electronics, mobile devices, and embedded systems for data storage.
1. Power Supply Pins (VCC, VSS): Provide power to the chip.
2. Data Pins (D0-D7): Used for data input and output during read and write operations.
3. Command Pins (CE, WE, RE): Control chip enable, write enable, and read enable functions.
4. Address Pins (A0-A19): Used to address memory locations.
5. Status Pins (R/B): Indicate the status of the device (ready/busy).
6. Miscellaneous Pins: May include pins for additional functionalities, such as reset or protection.
This device is typically employed in consumer electronics, mobile devices, and embedded systems for data storage.
Manufacturer
The manufacturer of the THGBMJG8C4LBAU8 is Toshiba Memory Corporation, which is now part of Kioxia Holdings Corporation. Kioxia is a multinational company specializing in NAND flash memory and storage solutions. It was established as a standalone entity in 2017 after Toshiba's memory business was spun off. Kioxia focuses on producing innovative memory products for various applications, including consumer electronics, mobile devices, and enterprise storage solutions. The company's expertise in NAND technology positions it as a key player in the global semiconductor industry.
Application
THGBMJG8C4LBAU8 is a NAND flash memory chip primarily used in consumer electronics such as smartphones, tablets, and laptops. Its applications include data storage for applications, media files, and system operations, enabling fast read/write speeds and reliable performance. Additionally, it can be used in embedded systems, automotive applications, and industrial devices requiring compact and efficient storage solutions.
Equivalent
The THGBMJG8C4LBAU8 is a NAND flash memory chip. Equivalent products include:
1. Micron MT29F128G08CBABA
2. Samsung K9GAG08U0M
3. SK Hynix H26M31003GTR
4. SanDisk SDTNCG8G
5. Toshiba THGBMFG8C4LBAA
Always verify compatibility based on specific application requirements and datasheets.
1. Micron MT29F128G08CBABA
2. Samsung K9GAG08U0M
3. SK Hynix H26M31003GTR
4. SanDisk SDTNCG8G
5. Toshiba THGBMFG8C4LBAA
Always verify compatibility based on specific application requirements and datasheets.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
支払い
Payment Methods
支払い期間は100%前払いです。
現在、下記の支払い方法のみを受け入れています。:
1. ペイパル
2. クレジット・デビットカード
3. ワイヤー 転送
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