画像は参照用のみです。
THGAF8T1T83BAIR
IC FLASH 256GBIT UFS 153VFBGA
- メーカー
- Mfr。パート #THGAF8T1T83BAIR
- パッケージ 153-VFBGA
- データシート
- 在庫中3331
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
RFQおよびもっと割引を得る
仕様
| Package | Tray |
| Series | Consumer UFS |
| ProductStatus | Active |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NAND |
| MemorySize | 256Gb (32G x 8) |
| MemoryInterface | UFS |
| Voltage-Supply | 2.7V ~ 3.6V |
| OperatingTemperature | -25°C ~ 85°C (TC) |
| MountingType | Surface Mount |
| Package/Case | 153-VFBGA |
概要
Description
THGAF8T1T83BAIR isn’t a recognized term to me. Could you share what it refers to (topic, product, project, dataset, acronym, etc.)? With context I can tailor the intro precisely. In case you need a quick generic template, use this structure:
- What it is: a brief definition of THGAF8T1T83BAIR
- Purpose: the problem it solves or goal
- Core components: key parts or features
- Benefit: value to users or stakeholders
- Audience: who it’s for
- How it works: high-level mechanism or workflow
- Status/Getting started: availability or next steps
Sample skeleton:
“THGAF8T1T83BAIR is a [type of thing] designed to [solve/achieve]. It comprises [X core components] and employs [methods/techniques]. Targeted at [audience], it provides [benefits]. You can [get started/find out more] by [access/contact].”
- What it is: a brief definition of THGAF8T1T83BAIR
- Purpose: the problem it solves or goal
- Core components: key parts or features
- Benefit: value to users or stakeholders
- Audience: who it’s for
- How it works: high-level mechanism or workflow
- Status/Getting started: availability or next steps
Sample skeleton:
“THGAF8T1T83BAIR is a [type of thing] designed to [solve/achieve]. It comprises [X core components] and employs [methods/techniques]. Targeted at [audience], it provides [benefits]. You can [get started/find out more] by [access/contact].”
Package
I’m not sure which device variant you mean. THGAF8T1T83BAIR could belong to different manufacturers. Please share the manufacturer or a datasheet/link. The package type is device-specific (e.g., QFN, LQFP, BGA, DFN).
Application
THGAF8T1T83BAIR seems to be an unrecognized model/part number. Please specify what it is (chemical, device, software, etc.). If it relates to air technology, typical applications include: air filtration/purification, HVAC/building ventilation, environmental monitoring, industrial hygiene, automotive/aerospace air systems, and consumer air-quality devices.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
支払い
Payment Methods
支払い期間は100%前払いです。
現在、下記の支払い方法のみを受け入れています。:
1. ペイパル
2. クレジット・デビットカード
3. ワイヤー 転送
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