画像は参照用のみです。
SKY77824-11
SKY77824-11
- メーカー
- Mfr。パート #SKY77824-11
- パッケージ
- データシート
- 在庫中21739
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
RFQおよびもっと割引を得る
仕様
| Part Status | Obsolete |
| Base Product Number | SKY77824 |
概要
Description
SKY77824-11 is a highly integrated, highly efficient power amplifier (PA) designed for use in mobile devices, particularly in the LTE and 5G frequency bands. It operates in the 2.4 GHz to 2.5 GHz range, making it suitable for applications like Wi-Fi and Bluetooth, as well as cellular communication. This chip is built for optimal performance, offering high linearity and low power consumption, which is crucial for enhancing battery life in portable devices.
The device features a compact package, facilitating easy integration into various applications, and supports a wide range of operating conditions, making it versatile for both consumer electronics and IoT applications. Additionally, its design incorporates advanced technology to ensure reliable performance and minimal thermal management challenges. Overall, the SKY77824-11 is an essential component for manufacturers looking to enhance connectivity features in modern electronic products.
The device features a compact package, facilitating easy integration into various applications, and supports a wide range of operating conditions, making it versatile for both consumer electronics and IoT applications. Additionally, its design incorporates advanced technology to ensure reliable performance and minimal thermal management challenges. Overall, the SKY77824-11 is an essential component for manufacturers looking to enhance connectivity features in modern electronic products.
Features
The SKY77824-11 is a highly integrated front-end module (FEM) designed for mobile devices, particularly for cellular applications. Key features include:
1. Integrated Power Amplifier (PA): Optimized for 2G, 3G, and 4G LTE applications, providing high efficiency and linearity.
2. Low Noise Amplifier (LNA): Enhances receiver sensitivity with low noise figure, improving overall system performance.
3. Diversity Support: Enables better signal reception and improved data throughput through multiple antenna configurations.
4. High Output Power: Capable of delivering significant output power for extended range and coverage.
5. Compact Package: Offers a small footprint, facilitating integration into space-constrained designs.
6. Temperature Range: Operates effectively across a wide temperature range, ensuring reliability in various environments.
7. Integrated Matching Network: Reduces the need for external components, simplifying design and manufacturing processes.
Overall, the SKY77824-11 is designed to enhance performance in mobile communication systems while minimizing design complexity.
1. Integrated Power Amplifier (PA): Optimized for 2G, 3G, and 4G LTE applications, providing high efficiency and linearity.
2. Low Noise Amplifier (LNA): Enhances receiver sensitivity with low noise figure, improving overall system performance.
3. Diversity Support: Enables better signal reception and improved data throughput through multiple antenna configurations.
4. High Output Power: Capable of delivering significant output power for extended range and coverage.
5. Compact Package: Offers a small footprint, facilitating integration into space-constrained designs.
6. Temperature Range: Operates effectively across a wide temperature range, ensuring reliability in various environments.
7. Integrated Matching Network: Reduces the need for external components, simplifying design and manufacturing processes.
Overall, the SKY77824-11 is designed to enhance performance in mobile communication systems while minimizing design complexity.
Package
The SKY77824-11 is packaged in a 6x6 mm, 36-lead QFN (Quad Flat No-lead) package. This compact packaging helps optimize performance in mobile and other wireless communication applications.
Pinout
The SKY77824-11 is a highly integrated power amplifier (PA) designed for mobile applications, specifically in the LTE and WCDMA frequency bands. It features a compact package with a pin count of 24.
The main functions of the pins include power supply, ground, input and output for RF signals, and control signals. Key functions include:
- VCC: Power supply pins for the amplifier.
- GND: Ground connections for proper operation.
- RF_IN: Input pin for the RF signal.
- RF_OUT: Output pin for the amplified RF signal.
- Control pins: Used for various operational modes (e.g., enable/disable, gain control).
The device is optimized for efficiency and performance in mobile communication systems. For specific pin configurations and details, refer to the manufacturer's datasheet.
The main functions of the pins include power supply, ground, input and output for RF signals, and control signals. Key functions include:
- VCC: Power supply pins for the amplifier.
- GND: Ground connections for proper operation.
- RF_IN: Input pin for the RF signal.
- RF_OUT: Output pin for the amplified RF signal.
- Control pins: Used for various operational modes (e.g., enable/disable, gain control).
The device is optimized for efficiency and performance in mobile communication systems. For specific pin configurations and details, refer to the manufacturer's datasheet.
Manufacturer
The SKY77824-11 is manufactured by Skyworks Solutions, Inc., a leading company in the semiconductor industry. Skyworks specializes in high-performance analog and mixed-signal semiconductors, particularly focusing on connectivity and mobile communications. Their products are widely used in various applications, including smartphones, tablets, and other wireless devices, enabling features such as Wi-Fi, Bluetooth, and cellular communications. Founded in 1962, Skyworks has established itself as a key player in the RF and wireless markets, contributing to the advancement of technology in the telecommunications sector.
Application
The SKY77824-11 is a power amplifier module primarily used in mobile devices, such as smartphones and tablets. Its application areas include LTE, WCDMA, and GSM networks, enhancing data transmission and voice communication. The module is designed for high efficiency and compact integration, making it suitable for various wireless applications, including IoT devices and other portable electronics that require robust RF performance.
Equivalent
Equivalent products to the SKY77824-11 chip include the Qorvo QPF4001, Broadcom BCM43602, and NXP's NXH2280. These chips offer similar features for RF front-end applications, including power amplification and integrated solutions for wireless communication. Always check specific datasheets for detailed specifications and compatibility.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
支払い
Payment Methods
支払い期間は100%前払いです。
現在、下記の支払い方法のみを受け入れています。:
1. ペイパル
2. クレジット・デビットカード
3. ワイヤー 転送
類似
-
MX25R8035FM1IL0
Macronix
-
MX25L3233FZBI-08Q
Macronix
-
MX25L3233FM1I-08Q
Macronix
-
MX25V1635FZNI
Macronix
-
MX25V1635FZNQ03
Macronix
-
MX25V5126FM1I
Macronix
-
MX25V2033FM1I
Macronix
-
MX25L25673GMI-08G
Macronix
-
MX25U25643GZNI00
Macronix
-
MX25L12833FM2I-10..
Macronix
-
MX29LV160DTTI-70G
Macronix
-
MX29F040CQI-70G
Macronix