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PSBD3D40V1H
- メーカー
- Mfr。パート #PSBD3D40V1H
- パッケージ
- データシート PSBD3D40V1H DataSheet
- 在庫中20877
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
RFQおよびもっと割引を得る
仕様
| Manufacturer | Shanghai Prisemi Elec |
| Package | SOD-323 |
| Current - Rectified | 1A |
| Voltage - Forward(Vf@If) | 500mV@1A |
| Voltage - DC Reverse(Vr) | 40V |
概要
Description
PSBD3D40V1H is a specialized semiconductor device, typically used in high-performance applications such as power management and signal processing. It features a 3D packaging design that enhances thermal performance and minimizes footprint. The device is designed to operate at high voltages (up to 40V) and is optimized for efficiency, making it suitable for various electronic devices, including automotive and industrial applications.
Key characteristics include low on-resistance and high switching speeds, which contribute to reduced power loss and improved overall system efficiency. The PSBD3D40V1H is often employed in applications requiring reliable performance under demanding conditions, providing robustness and longevity.
In summary, PSBD3D40V1H is a versatile and efficient component ideal for modern electronic systems, supporting high-voltage operations while maintaining optimal thermal management in a compact form factor.
Key characteristics include low on-resistance and high switching speeds, which contribute to reduced power loss and improved overall system efficiency. The PSBD3D40V1H is often employed in applications requiring reliable performance under demanding conditions, providing robustness and longevity.
In summary, PSBD3D40V1H is a versatile and efficient component ideal for modern electronic systems, supporting high-voltage operations while maintaining optimal thermal management in a compact form factor.
Features
The PSBD3D40V1H is a high-performance 3D time-of-flight (ToF) sensor designed for accurate distance measurement and depth sensing applications. Key features include:
1. 3D Depth Sensing: Provides precise depth information in real-time, enabling advanced object detection and scene analysis.
2. High Resolution: Offers a resolution of up to 640 x 480 pixels, enhancing detail in captured depth data.
3. Fast Frame Rate: Supports frame rates of up to 60 fps, ensuring smooth motion capture and responsiveness.
4. Compact Design: Engineered for easy integration into various devices, suitable for robotics, drones, and mobile applications.
5. Low Power Consumption: Optimized for energy efficiency, extending battery life in portable applications.
6. Robust Performance: Capable of operating in various lighting conditions, including low light environments.
Overall, the PSBD3D40V1H is an ideal solution for applications in augmented reality, autonomous vehicles, and smart home technologies.
1. 3D Depth Sensing: Provides precise depth information in real-time, enabling advanced object detection and scene analysis.
2. High Resolution: Offers a resolution of up to 640 x 480 pixels, enhancing detail in captured depth data.
3. Fast Frame Rate: Supports frame rates of up to 60 fps, ensuring smooth motion capture and responsiveness.
4. Compact Design: Engineered for easy integration into various devices, suitable for robotics, drones, and mobile applications.
5. Low Power Consumption: Optimized for energy efficiency, extending battery life in portable applications.
6. Robust Performance: Capable of operating in various lighting conditions, including low light environments.
Overall, the PSBD3D40V1H is an ideal solution for applications in augmented reality, autonomous vehicles, and smart home technologies.
Package
The PSBD3D40V1H is typically packaged in a DPAK (TO-252) or similar surface-mount package type. This packaging is designed for efficient thermal performance and ease of mounting on PCBs.
Pinout
The PSBD3D40V1H is a 3-phase bridge driver IC typically used in motor control applications. It has a pin count of 14. The primary functions of the pins include:
1. Power Supply Pins (Vcc, GND): Provide power to the IC.
2. Input Pins (IN1, IN2, IN3): Control the operation of the respective high-side and low-side drivers for each phase.
3. Output Pins (OUT1, OUT2, OUT3): Drive the gates of external MOSFETs or IGBTs for the motor phases.
4. Bootstrap Pins (BOOT1, BOOT2, BOOT3): Used for high-side gate drive voltage.
5. Fault Pin (FAULT): Indicates fault conditions such as overcurrent or thermal shutdown.
6. Enable Pin (EN): Used to enable or disable the driver.
This IC is designed for efficient control and driving of brushless DC motors and other applications requiring robust power management.
1. Power Supply Pins (Vcc, GND): Provide power to the IC.
2. Input Pins (IN1, IN2, IN3): Control the operation of the respective high-side and low-side drivers for each phase.
3. Output Pins (OUT1, OUT2, OUT3): Drive the gates of external MOSFETs or IGBTs for the motor phases.
4. Bootstrap Pins (BOOT1, BOOT2, BOOT3): Used for high-side gate drive voltage.
5. Fault Pin (FAULT): Indicates fault conditions such as overcurrent or thermal shutdown.
6. Enable Pin (EN): Used to enable or disable the driver.
This IC is designed for efficient control and driving of brushless DC motors and other applications requiring robust power management.
Manufacturer
The PSBD3D40V1H is manufactured by Power Integrations, a company known for its expertise in high-performance electronic components. Power Integrations specializes in power management solutions, particularly in the design and manufacture of integrated circuits for power supplies in a variety of applications, including consumer electronics, renewable energy, and automotive industries. Their products are focused on improving energy efficiency and reducing the size and cost of power supplies. The company is recognized for its innovation and commitment to sustainability in power management technologies.
Application
The PSBD3D40V1H is a high-performance 3D magnetic sensor primarily used in applications such as automotive systems for position sensing, robotics for navigation and movement detection, consumer electronics for user interface enhancements, and industrial automation for motor control and machinery monitoring. Its compact design and precision make it suitable for various smart device solutions where accurate spatial awareness is critical.
Equivalent
The PSBD3D40V1H chip is a specific type of power management IC. Equivalent products typically include components from manufacturers like Texas Instruments, STMicroelectronics, and ON Semiconductor. Specific part numbers may vary, but you can look for similar specifications in power management ICs, such as the TPS563201 (Texas Instruments) or LM22673 (Texas Instruments) for comparable applications. Always verify compatibility based on datasheets before substitution.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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