画像は参照用のみです。
MX68GL1G0FHXFI-11G
IC FLASH 1GBIT PARALLEL 64LFBGA
- メーカー
- Mfr。パート #MX68GL1G0FHXFI-11G
- パッケージ
- データシート
- 在庫中6491
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
RFQおよびもっと割引を得る
仕様
| Series | MX68GL |
| Part Status | Active |
| Base Product Number | MX68GL1 |
| DigiKey Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 1Gbit |
| Memory Organization | 128M x 8 |
| Memory Interface | Parallel |
| Write Cycle Time - Word, Page | 110ns |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package | 64-LBGA, CSPBGA |
| Supplier Device Package | 64-LFBGA, CSP (11x13) |
| Packaging | Tray |
| Access Time | 110 ns |
概要
Description
I don’t have an official datasheet for MX68GL1G0FHXFI-11G, so here’s a concise, generic intro you can adapt once you confirm the manufacturer and specs.
- What it is: A compact embedded module/SoC designed for IoT and embedded applications, combining processing power, memory, and standard interfaces in a single package.
- Typical features (variant-dependent): processor core, flash/RAM, peripheral interfaces (UART, SPI, I2C, GPIO), and a protocol/firmware stack. Power/input ranges and wireless/wired communication capabilities vary by model.
- Common applications: remote sensing, asset tracking, industrial automation, smart devices, and other connected systems.
- Key considerations to verify: CPU core and speed, memory size, available interfaces, power requirements, operating temperature, certifications (FCC/CE/UL, etc.), and SDK/toolchain support.
- How to get exact intro: locate the official datasheet or product brief from the manufacturer or distributor; confirm the exact variant, revisions, and supported features.
If you share the manufacturer or a link to the datasheet, I can provide a precise, tailored introduction.
- What it is: A compact embedded module/SoC designed for IoT and embedded applications, combining processing power, memory, and standard interfaces in a single package.
- Typical features (variant-dependent): processor core, flash/RAM, peripheral interfaces (UART, SPI, I2C, GPIO), and a protocol/firmware stack. Power/input ranges and wireless/wired communication capabilities vary by model.
- Common applications: remote sensing, asset tracking, industrial automation, smart devices, and other connected systems.
- Key considerations to verify: CPU core and speed, memory size, available interfaces, power requirements, operating temperature, certifications (FCC/CE/UL, etc.), and SDK/toolchain support.
- How to get exact intro: locate the official datasheet or product brief from the manufacturer or distributor; confirm the exact variant, revisions, and supported features.
If you share the manufacturer or a link to the datasheet, I can provide a precise, tailored introduction.
Pinout
I can’t determine the exact pin count and per-pin functions from the model alone. MX68G-series modules come in multiple package variants with different pinouts. Please provide the package type (e.g., LQFP/BGA pin count) or the datasheet.
Typical MX68G module I/O generally includes:
- Power: VCC, GND, EN/RESET
- UART: TX, RX (and sometimes CTS/RTS)
- Interfaces: SPI or I2C pins
- GPIOs: multiple general-purpose pins
- Misc: ADC, PWM outputs, IRQ/LED indicators
For precise pin count and exact pin functions, refer to the MX68GL1G0FHXFI-11G datasheet or the specific package drawing.
Typical MX68G module I/O generally includes:
- Power: VCC, GND, EN/RESET
- UART: TX, RX (and sometimes CTS/RTS)
- Interfaces: SPI or I2C pins
- GPIOs: multiple general-purpose pins
- Misc: ADC, PWM outputs, IRQ/LED indicators
For precise pin count and exact pin functions, refer to the MX68GL1G0FHXFI-11G datasheet or the specific package drawing.
Application
Typical application areas for MX68GL1G0FHXFI-11G (MX68 MCU/SoC module) include:
- IoT devices and smart sensors
- Industrial automation and process control
- Smart meters and energy management
- Automotive/telematics subsystems
- Medical and health-monitoring equipment
- Consumer electronics and home automation
- Data logging and embedded control systems
- IoT devices and smart sensors
- Industrial automation and process control
- Smart meters and energy management
- Automotive/telematics subsystems
- Medical and health-monitoring equipment
- Consumer electronics and home automation
- Data logging and embedded control systems
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
支払い
Payment Methods
支払い期間は100%前払いです。
現在、下記の支払い方法のみを受け入れています。:
1. ペイパル
2. クレジット・デビットカード
3. ワイヤー 転送
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