MX52LM04A11XSI

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MX52LM04A11XSI

IC FLASH 4GB EMMC 153-BGA (11.5X

100% オリジナル &新しい

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仕様

Series e.MMC™
Part Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (MLC)
Memory Size 32Gbit
Memory Organization 4G x 8
Memory Interface eMMC_5.1
Clock Frequency 200 MHz
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package 153-VFBGA
Supplier Device Package 153-LFBGA (11.5x13)
Packaging Tray

概要

Description

The MX52LM04A11XSI is a high-performance, low-power memory chip designed for various applications, such as consumer electronics and industrial devices. It typically features a density of 4 Megabits (512 K x 8 bits) and is based on advanced CMOS technology, allowing for efficient operation and reduced energy consumption. The chip supports multiple access modes and has a fast read/write cycle time, making it suitable for applications requiring quick data retrieval and storage.
It's often used in embedded systems, including automotive electronics, IoT devices, and portable gadgets, where reliability and performance are crucial. The MX52LM04A11XSI is compatible with common communication protocols, ensuring easy integration into existing designs. Additionally, it is built to withstand a range of environmental conditions, enhancing its durability and longevity in various operating scenarios. Overall, this memory chip is a key component for developers looking for efficient and effective memory solutions in modern electronic applications.

Features

The MX52LM04A11XSI is a low-power, high-performance SRAM (Static Random Access Memory) chip commonly used in various applications. Key features include:
1. Memory Capacity: 4 Megabits (512KB).
2. Access Time: Fast access times typically around 55 ns.
3. Operating Voltage: Typically operates at 3.0V to 3.6V, enabling low power consumption.
4. Data Bus Width: 8 bits, allowing for byte-wide data access.
5. Low Power Consumption: Designed for battery-operated devices, it features low active and standby power modes.
6. Asynchronous Operation: No clock signal required for operation, simplifying design.
7. Temperature Range: Generally supports industrial temperature ranges, suitable for various environmental conditions.
8. Compatibility: Often used in embedded systems, telecommunications, and consumer electronics.
These features make the MX52LM04A11XSI ideal for applications requiring fast, efficient, and reliable memory solutions.

Package

The MX52LM04A11XSI is packaged in a 48-ball FBGA (Fine Pitch Ball Grid Array) format. This type of packaging offers a compact design and efficient thermal management, making it suitable for high-performance applications.

Pinout

The MX52LM04A11XSI is a 4 Mbit (512 K x 8) SRAM device that typically comes in a 32-pin package. The pin count for this device is 32, and it is primarily used for high-speed memory applications.
The main functions of the pins include:
- Address pins (A0 to A18): Used to select memory locations.
- Data pins (DQ0 to DQ7): Bidirectional data bus for reading and writing data.
- Control pins:
- Chip Enable (CE): Activates the chip for read/write operations.
- Write Enable (WE): Determines whether the operation is a read (inactive) or write (active).
- Output Enable (OE): Activates the output drivers for reading data.
- Ground (VSS): Common ground connection.
- Power Supply (VDD): Provides the necessary operating voltage.
This SRAM is designed for applications requiring fast data access with low latency.

Manufacturer

The MX52LM04A11XSI is manufactured by Macronix International Co., Ltd., a Taiwan-based company. Macronix specializes in the design and production of non-volatile memory solutions, including Flash memory and ROM products. The company serves various markets, including consumer electronics, automotive, and industrial applications. Established in 1989, Macronix is known for its innovation in memory technology and has a strong presence in the semiconductor industry. The company's products are widely used in devices such as smartphones, tablets, and embedded systems.

Application

The MX52LM04A11XSI is a low-power, high-density SRAM designed for applications in embedded systems, consumer electronics, and telecommunications. It is commonly used in mobile devices, automotive systems, and industrial controls, where fast data access and reliability are essential. Its features make it suitable for cache memory, data buffering, and temporary storage in various electronic applications.

Equivalent

The MX52LM04A11XSI chip is a 512Kb SRAM. Equivalent products include the Microchip 23K640, Cypress CY62167EV30LL, and ISSI IS62WV51216BLL. Always verify compatibility with your specific application requirements.

出荷

出荷方法私たち

DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。


出荷料参照(DHL/FedEx):

DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。

フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。

UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。

TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。

EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。

登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。

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