MT53E2G32D4DE-046WT:C

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MT53E2G32D4DE-046WT:C

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  • Mfr。パート #MT53E2G32D4DE-046WT:C
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100% オリジナル &新しい

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365日の保証

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仕様

Manufacturer JLCPCB Assembly
Package FBGA-200_14.5X10

概要

Description

The MT53E2G32D4DE-046WT:C is a type of DRAM module, specifically a low-power, double data rate (DDR) memory chip used in computing and electronic devices. It is manufactured by Micron Technology, a leading producer of memory and storage solutions. This chip is part of the LPDDR4 family, offering high-speed data transfer rates while consuming less power, making it ideal for mobile and portable devices such as smartphones, tablets, and laptops.
Key features of the MT53E2G32D4DE-046WT:C include its 2Gb density, x32 configuration, and the ability to operate at frequencies of up to 3200 MHz. It supports various features such as deep power-down mode and temperature compensation refresh, enhancing its efficiency and performance in energy-sensitive applications.
The chip is designed to operate in a wide temperature range, which adds to its versatility across different environmental conditions. Its compact size and low power consumption make it an optimal choice for devices where space and battery life are critical considerations. Overall, this memory chip is engineered to deliver reliable performance while extending battery life in advanced electronic devices.

Features

The MT53E2G32D4DE-046WT:C is a DRAM memory module from Micron Technology, part of the LPDDR4X family. It is designed to offer high performance with low power consumption, making it suitable for a variety of mobile and compact applications such as smartphones, tablets, and other portable devices.
Key features of the MT53E2G32D4DE-046WT:C include:
1. Capacity and Organization: It typically offers 8Gb (gigabit) of storage capacity, organized as 2Gb x 32.
2. Low Power Consumption: As an LPDDR4X module, it operates at a lower voltage than standard DDR4, which enhances battery life in portable devices.
3. High Data Transfer Rates: It supports data transfer rates up to 4266 MT/s (megatransfers per second), providing fast performance for high-speed data processing and multitasking.
4. Temperature Range: It is designed to operate efficiently across a wide temperature range, making it suitable for various environmental conditions.
5. Advanced Features: The module supports features like deep power-down mode and self-refresh, which further reduce power usage during periods of low activity.
These features make the MT53E2G32D4DE-046WT:C an ideal choice for power-efficient, high-performance mobile computing solutions.

Package

The MT53E2G32D4DE-046WT:C is a DRAM memory chip typically using a Ball Grid Array (BGA) package. BGA packages are widely used for high-density applications due to their small footprint and efficient heat dissipation.

Pinout

The MT53E2G32D4DE-046WT:C is a LPDDR4 (Low Power Double Data Rate 4) DRAM memory chip manufactured by Micron Technology. This particular chip configuration is organized as a 2Gb (Gigabit) memory arranged in a ×32 configuration.
Pin Count:
The pin count for this type of memory chip typically ranges around 200 balls, as LPDDR4 is commonly packaged in a FBGA (Fine-pitch Ball Grid Array) format. The exact pin count can vary slightly depending on the specific package design.
Function:
The primary function of the MT53E2G32D4DE-046WT:C is to provide high-speed, low-power volatile memory storage for use in mobile and other power-sensitive applications. It supports features like low power consumption, high data transfer rates, and efficient memory bandwidth utilization, making it suitable for smartphones, tablets, and other portable electronic devices. This chip operates at low voltages and supports the LPDDR4 interface standard, which allows for fast data processing and efficient energy use.

Manufacturer

The MT53E2G32D4DE-046WT:C is manufactured by Micron Technology, Inc. Micron is a leading American company in the semiconductor industry, primarily engaged in the production and marketing of memory and storage solutions. They specialize in dynamic random-access memory (DRAM), NAND flash memory, and other semiconductor components used in computing devices, consumer electronics, and industrial applications. Micron is known for its innovation and development in memory technology and plays a significant role in the global semiconductor supply chain.

Application

The MT53E2G32D4DE-046WT:C is a low-power DDR4 SDRAM module commonly used in mobile and embedded applications. Its primary application areas include smartphones, tablets, and other portable devices where energy efficiency is crucial. It is also utilized in IoT devices, automotive electronics, and networking equipment, offering high-speed data processing and low power consumption. Its compact size and performance capabilities make it ideal for integration into systems requiring efficient memory solutions.

Equivalent

The MT53E2G32D4DE-046WT:C is a LPDDR4 DRAM chip often used in mobile applications. Equivalent products include:
1. Samsung K4FBE3D4HM-MGCH
2. Hynix H9HCNNN8KUMLHR-NEE
3. Kingston D2516EC4BXGGB
These alternatives offer similar performance and specifications, suitable for applications requiring low power and high-speed data processing. Always check the datasheets for compatibility with your specific use case.

出荷

出荷方法私たち

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出荷料参照(DHL/FedEx):

DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。

フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。

UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。

TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。

EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。

登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。

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