画像は参照用のみです。
MT53E256M32D2DS-053 WT:B
8Gbit 1.1V 1.866GHz LPDDR4 SDRAM VFBGA-200 Memory (ICs) RoHS
- メーカー
- Mfr。パート #MT53E256M32D2DS-053 WT:B
- パッケージ
- データシート
- 在庫中24975
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
RFQおよびもっと割引を得る
仕様
| Packaging | VFBGA-200 |
| Clock Frequency | 1.866GHz |
| Memory Format | LPDDR4 SDRAM |
| Memory Size | 8Gbit |
| Operating temperature | -30℃~+85℃ |
| Voltage - Supply | 1.1V |
概要
Description
The MT53E256M32D2DS-053 WT:B is a memory chip produced by Micron Technology. It is part of the DDR3 SDRAM family and features a 256 Meg x 32 configuration, indicating it has a capacity of 8 gigabits (1 gigabyte) per chip. This chip operates with a data bus width of 32 bits and is optimized for high-performance applications, such as computing and networking.
The "053" in its designation typically refers to the speed grade, indicating that it operates at a specific frequency, while "WT:B" denotes the package type and temperature grade. DDR3 memory is known for its improved bandwidth and lower power consumption compared to previous DDR generations. This makes it suitable for applications requiring efficient data processing and power management.
In summary, the MT53E256M32D2DS-053 WT:B is a high-performance, low-power DDR3 memory solution ideal for various electronic devices and systems that demand reliable and fast data handling capabilities.
The "053" in its designation typically refers to the speed grade, indicating that it operates at a specific frequency, while "WT:B" denotes the package type and temperature grade. DDR3 memory is known for its improved bandwidth and lower power consumption compared to previous DDR generations. This makes it suitable for applications requiring efficient data processing and power management.
In summary, the MT53E256M32D2DS-053 WT:B is a high-performance, low-power DDR3 memory solution ideal for various electronic devices and systems that demand reliable and fast data handling capabilities.
Features
The MT53E256M32D2DS-053 WT:B is a DDR4 DRAM memory chip manufactured by Micron Technology. It features a density of 256 Megabytes, organized in a 32-bit wide configuration. Key specifications include:
1. Speed: Operates at a data rate of 2400 MT/s (million transfers per second).
2. Voltage: Typically operates at a low voltage of 1.2V, enhancing power efficiency.
3. Package Type: Comes in a compact package, suitable for various applications requiring space efficiency.
4. Latency: Designed for low latency, which improves overall system performance.
5. Applications: Commonly used in computing devices, networking applications, and embedded systems.
Overall, the MT53E256M32D2DS-053 WT:B is suitable for high-performance applications requiring reliable and efficient memory solutions.
1. Speed: Operates at a data rate of 2400 MT/s (million transfers per second).
2. Voltage: Typically operates at a low voltage of 1.2V, enhancing power efficiency.
3. Package Type: Comes in a compact package, suitable for various applications requiring space efficiency.
4. Latency: Designed for low latency, which improves overall system performance.
5. Applications: Commonly used in computing devices, networking applications, and embedded systems.
Overall, the MT53E256M32D2DS-053 WT:B is suitable for high-performance applications requiring reliable and efficient memory solutions.
Package
The MT53E256M32D2DS-053 WT:B is a DDR4 memory device packaged in a 96-ball FBGA (Fine Ball Grid Array) package. This type of packaging is designed for high-density memory applications, providing good thermal performance and efficient use of space on PCBs.
Pinout
The MT53E256M32D2DS-053 WT:B is a DDR3 SDRAM memory device with a pin count of 78 pins. This device is organized as 256 Meg x 32 bits and operates at a data rate of 1066 MT/s (megatransfers per second).
The main functions of this memory module include providing high-speed data storage and retrieval for various applications, such as computing and networking devices. It supports features like burst mode and has a prefetch capability to enhance performance. The device operates on a supply voltage of 1.5V and is designed for use in systems that require efficient power consumption and high data bandwidth.
For detailed specifications, including pin assignments and electrical characteristics, referring to the manufacturer's datasheet is recommended.
The main functions of this memory module include providing high-speed data storage and retrieval for various applications, such as computing and networking devices. It supports features like burst mode and has a prefetch capability to enhance performance. The device operates on a supply voltage of 1.5V and is designed for use in systems that require efficient power consumption and high data bandwidth.
For detailed specifications, including pin assignments and electrical characteristics, referring to the manufacturer's datasheet is recommended.
Manufacturer
The MT53E256M32D2DS-053 WT:B is manufactured by Micron Technology, Inc. Micron is a leading global producer of semiconductor devices, specializing in memory and storage solutions, including DRAM, NAND flash, and NOR flash. The company is known for its innovation in memory technology and is a key player in the semiconductor industry, providing products for various applications such as computing, mobile, automotive, and industrial sectors. Founded in 1978 and headquartered in Boise, Idaho, Micron operates multiple manufacturing facilities worldwide and is recognized for its commitment to quality and performance in memory solutions.
Application
The MT53E256M32D2DS-053 WT:B is a DRAM memory chip primarily used in applications such as mobile devices, tablets, and consumer electronics requiring high-performance memory. It's suitable for graphics processing, gaming systems, and networking equipment, where fast data access and efficiency are critical. Its low power consumption also makes it ideal for battery-operated devices.
Equivalent
The MT53E256M32D2DS-053 WT:B chip is a 2Gb DDR3 SDRAM memory chip. Equivalent products include similar DDR3 SDRAM chips from manufacturers such as Micron (MT53E256M32D2DS-053), Samsung (K4B4G1646D), and Hynix (HMT451S6CFR8A). Ensure to check specifications like speed, voltage, and package type for compatibility.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
支払い
Payment Methods
支払い期間は100%前払いです。
現在、下記の支払い方法のみを受け入れています。:
1. ペイパル
2. クレジット・デビットカード
3. ワイヤー 転送
類似
-
MX25R8035FM1IL0
Macronix
-
MX25L3233FZBI-08Q
Macronix
-
MX25L3233FM1I-08Q
Macronix
-
MX29F400CBTI-70G
Macronix
-
MX66U1G45GXDI00
Macronix
-
MX25V5126FM1I
Macronix
-
MX25V4035FZUI
Macronix
-
MX25V2033FM1I
Macronix
-
MX25R3235FZNIL0
Macronix
-
MX30LF2G28AD-TI
Macronix
-
MX25L2006EM1I-12G
Macronix
-
MX25R1635FZUIH0
Macronix