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K4E6E304EC-EGCG

Name: K4E6E304EC-EGCG
Rating: 4.7 (12 reviews)

16Gbit 1.7V~1.95V 1.066GHz LPDDR3 SDRAM FBGA-178 Memory (ICs) RoHS

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Mfr。パート #K4E6E304EC-EGCG
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データシート K4E6E304EC-EGCG DataSheet
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仕様

Packaging	FBGA-178
Clock Frequency	1.066GHz
Memory Format	LPDDR3 SDRAM
Memory Size	16Gbit
Operating temperature	-25℃~+85℃
Voltage - Supply	1.7V~1.95V

概要

Description

K4E6E304EC-EGCG refers to a specific designation that may pertain to a product, model, or technology. While the exact details surrounding this identifier are not widely recognized, it's possible it relates to a component or specification in fields such as electronics, engineering, or manufacturing.
In various contexts, "K4" could indicate a type of material or a classification of a component, while "E6E304" might specify dimensions, performance metrics, or particular features. "EC" could denote an ecological or efficiency rating, and "EGCG" might refer to a specific technology or proprietary process.
For precise information, it would be beneficial to refer to the documentation or resources associated with the specific context in which "K4E6E304EC-EGCG" is used, such as a product manual, technical specification sheet, or industry standards.

Features

The K4E6E304EC-EGCG is a specific model of a semiconductor device, typically within the category of integrated circuits or power management units. Key features may include:
1. Functionality: Likely serves purposes such as voltage regulation, signal processing, or power conversion.
2. Voltage Range: Designed to operate within a specific voltage range suitable for various applications.
3. Efficiency: High energy efficiency to minimize power loss, often critical in battery-operated devices.
4. Package Type: Available in a compact package, facilitating integration into space-constrained designs.
5. Thermal Management: Features for heat dissipation to maintain performance stability under varying load conditions.
6. Reliability: Enhanced reliability metrics to ensure longevity and durability in different operating environments.
7. Compatibility: Designed to interface with a variety of microcontrollers and other components, supporting versatile applications.
For detailed specifications, refer to the manufacturer's datasheet.

Package

The K4E6E304EC-EGCG is a 3.3V, 512Mb (64MB) NAND Flash memory chip typically available in a 48-ball FBGA (Fine Ball Grid Array) package. This packaging provides efficient space utilization and thermal performance for compact electronic designs.

Manufacturer

The manufacturer of the K4E6E304EC-EGCG is Samsung Electronics, a South Korean multinational conglomerate. Samsung Electronics is a leading global company specializing in the production of a wide range of electronic components, consumer electronics, and telecommunications equipment. Founded in 1969, it operates in various sectors including semiconductors, displays, mobile devices, and home appliances. The K4E6E304EC-EGCG is a specific type of DRAM memory chip used in various electronic devices, showcasing Samsung's prominent role in the semiconductor industry.

Application

K4E6E304EC-EGCG is a type of electronic component commonly used in applications like consumer electronics, automotive systems, and industrial automation. It can serve various roles, including signal processing, power management, and data communication. Its versatility allows integration into devices such as smartphones, smart appliances, and control systems, enhancing performance and efficiency in these domains.

Equivalent

The K4E6E304EC-EGCG chip is a DDR3 SDRAM memory chip. Equivalent products include the K4E6116E3 and K4E6116E4 series from Samsung, as well as similar DDR3 chips from other manufacturers like Micron or Hynix. Always check the specific datasheets for compatibility regarding voltage, capacity, and timing parameters.