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K4A4G165WE-BIWE
1.2V 4Gbit 256Mx16 DDR4 FBGA-96 Memory (ICs) RoHS
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- Mfr。パート #K4A4G165WE-BIWE
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- 在庫中5146
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
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仕様
| Packaging | FBGA-96 |
| Interface | DDR4 |
| Memory Format | 256Mx16 |
| Memory Size | 4Gbit |
| Operating temperature | -40℃~+95℃ |
| Voltage - Supply | 1.2V |
概要
Description
The K4A4G165WE-BIWE is a model of DRAM (Dynamic Random Access Memory) manufactured by Samsung. It typically belongs to the LPDDR4 (Low Power Double Data Rate 4) memory category, designed for high-performance and energy-efficient applications. This type of memory is commonly used in mobile devices, tablets, and other portable electronics where power efficiency is crucial.
Key features of the K4A4G165WE-BIWE include its high data transfer rates and low power consumption, making it suitable for modern computing needs. It is designed to support seamless multitasking and faster app loading, enhancing overall device performance. LPDDR4 memory, such as this model, typically operates at lower voltages, contributing significantly to battery life extension in mobile devices.
Overall, the K4A4G165WE-BIWE is integral to modern electronics, offering a balance of speed, efficiency, and reduced power usage, aligning with the demanding needs of today's technology-driven world.
Key features of the K4A4G165WE-BIWE include its high data transfer rates and low power consumption, making it suitable for modern computing needs. It is designed to support seamless multitasking and faster app loading, enhancing overall device performance. LPDDR4 memory, such as this model, typically operates at lower voltages, contributing significantly to battery life extension in mobile devices.
Overall, the K4A4G165WE-BIWE is integral to modern electronics, offering a balance of speed, efficiency, and reduced power usage, aligning with the demanding needs of today's technology-driven world.
Features
The model number K4A4G165WE-BIWE refers to a specific DRAM chip, likely manufactured by Samsung, as the naming convention aligns with their products. This is a low-power DDR4 SDRAM chip typically used in various electronics, including smartphones, tablets, and other portable devices.
Key features might include:
1. Capacity: 4Gb (Gigabits).
2. Form Factor: Likely a BGA (Ball Grid Array) package, suitable for compact devices.
3. Voltage: Operates at a low voltage, around 1.2V, enhancing power efficiency.
4. Speed: High data transfer rates, possibly up to 3200 MT/s (Megatransfers per second).
5. Temperature Range: Designed to function across a wide temperature spectrum, suitable for consumer electronics.
6. Reliability: Includes error correction features and robust data integrity mechanisms.
7. Compatibility: Conforms to JEDEC standards for DDR4 memory, ensuring compatibility with a wide range of processors and systems.
These features make it suitable for applications requiring efficient memory usage and high-speed data processing while maintaining low power consumption.
Key features might include:
1. Capacity: 4Gb (Gigabits).
2. Form Factor: Likely a BGA (Ball Grid Array) package, suitable for compact devices.
3. Voltage: Operates at a low voltage, around 1.2V, enhancing power efficiency.
4. Speed: High data transfer rates, possibly up to 3200 MT/s (Megatransfers per second).
5. Temperature Range: Designed to function across a wide temperature spectrum, suitable for consumer electronics.
6. Reliability: Includes error correction features and robust data integrity mechanisms.
7. Compatibility: Conforms to JEDEC standards for DDR4 memory, ensuring compatibility with a wide range of processors and systems.
These features make it suitable for applications requiring efficient memory usage and high-speed data processing while maintaining low power consumption.
Package
The K4A4G165WE-BIWE is a DRAM chip typically packaged in a 178-ball FBGA (Fine-pitch Ball Grid Array) format. This package type allows for efficient thermal performance and compact size, suitable for high-density memory applications.
Pinout
The K4A4G165WE-BIWE is a 4Gb LPDDR4 DRAM chip manufactured by Samsung. It features a 200-ball FBGA package. This memory chip is designed for high-performance, low-power applications, such as mobile and embedded devices. The functions of the K4A4G165WE-BIWE include high-speed data processing and efficient power consumption, suited for use in smartphones, tablets, and other portable electronics. It supports multiple power-saving modes and high data transfer rates. The chip's architecture enables improved bandwidth and power efficiency, meeting the demands of modern computing needs while extending battery life in mobile applications.
Manufacturer
The K4A4G165WE-BIWE is manufactured by Samsung. Samsung is a South Korean multinational conglomerate known for its diversified operations in various industries, including electronics, information technology, and consumer appliances. As a leading global technology company, Samsung is well recognized for producing a wide range of electronic components, such as semiconductors and memory chips, along with consumer electronics like smartphones, televisions, and home appliances.
Application
The K4A4G165WE-BIWE is a DRAM memory chip, commonly used in applications requiring high-speed data processing and storage. Its primary application areas include computing devices like PCs and laptops, servers, and data centers that demand efficient memory solutions for multitasking and data-intensive operations. Additionally, it is used in embedded systems, networking equipment, and consumer electronics such as smartphones and tablets, where it supports smooth performance and enhanced user experience.
Equivalent
The K4A4G165WE-BIWE is a 4Gb DDR4 SDRAM chip produced by Samsung. Equivalent products include:
- Micron MT40A512M16
- SK Hynix H5AN4G8NBJR-UHC
- Kingston D4G8C1GE
These chips offer similar specifications such as capacity, speed, and voltage, making them suitable substitutes for applications requiring equivalent DDR4 memory performance.
- Micron MT40A512M16
- SK Hynix H5AN4G8NBJR-UHC
- Kingston D4G8C1GE
These chips offer similar specifications such as capacity, speed, and voltage, making them suitable substitutes for applications requiring equivalent DDR4 memory performance.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
支払い
Payment Methods
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