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H5TQ4G63CFR-RDC
4Gbit 1.425V~1.575V 800MHz DDR3 SDRAM FBGA-96 Memory (ICs) RoHS
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- データシート H5TQ4G63CFR-RDC DataSheet
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仕様
| Packaging | FBGA-96 |
| Clock Frequency | 800MHz |
| Memory Format | DDR3 SDRAM |
| Memory Size | 4Gbit |
| Operating temperature | -40℃~+95℃ |
| Refresh Current | 10mA |
| Voltage - Supply | 1.425V~1.575V |
概要
Description
The H5TQ4G63CFR-RDC is a type of dynamic random-access memory (DRAM) chip commonly used in various electronic devices. Manufactured by Hynix (now SK Hynix), it features a 4Gb (gigabit) capacity and is part of the DDR3 (Double Data Rate Type 3) family, which enhances data transfer rates compared to earlier generations. The "CFR" designation indicates it is a commercial-grade product, while "RDC" refers to its role in memory applications, typically in consumer electronics, gaming devices, and computing systems.
The chip operates at a voltage of 1.5V and is known for its efficiency and speed, making it suitable for high-performance applications. Its design allows for dual-channel memory configurations, which further improve overall performance. Understanding the specifications and functionalities of H5TQ4G63CFR-RDC is essential for engineers and developers when selecting memory solutions for their projects or products.
The chip operates at a voltage of 1.5V and is known for its efficiency and speed, making it suitable for high-performance applications. Its design allows for dual-channel memory configurations, which further improve overall performance. Understanding the specifications and functionalities of H5TQ4G63CFR-RDC is essential for engineers and developers when selecting memory solutions for their projects or products.
Features
The H5TQ4G63CFR-RDC is a 4 Gb (gigabit) DDR3 SDRAM (Synchronous Dynamic Random Access Memory) chip, designed for high-performance computing applications. Key features include:
1. Capacity: 4 Gb density, suitable for various applications requiring substantial memory.
2. Data Rate: Operates at data rates up to 1600 MT/s (megatransfers per second), allowing for fast data processing.
3. Organization: Typically organized in a 512M x 8 configuration, providing efficient data access.
4. Voltage: Operates at a low voltage of 1.5V, enhancing power efficiency.
5. Package Type: Available in a compact FBGA (Fine Ball Grid Array) package, facilitating space-saving designs.
6. Temperature Range: Designed for a wide operating temperature, ensuring reliability in diverse environments.
7. Compatibility: Compatible with various DDR3 memory controllers, making it versatile for numerous applications.
These features make the H5TQ4G63CFR-RDC suitable for use in devices like laptops, desktops, and network equipment, where high-speed and efficient memory is critical.
1. Capacity: 4 Gb density, suitable for various applications requiring substantial memory.
2. Data Rate: Operates at data rates up to 1600 MT/s (megatransfers per second), allowing for fast data processing.
3. Organization: Typically organized in a 512M x 8 configuration, providing efficient data access.
4. Voltage: Operates at a low voltage of 1.5V, enhancing power efficiency.
5. Package Type: Available in a compact FBGA (Fine Ball Grid Array) package, facilitating space-saving designs.
6. Temperature Range: Designed for a wide operating temperature, ensuring reliability in diverse environments.
7. Compatibility: Compatible with various DDR3 memory controllers, making it versatile for numerous applications.
These features make the H5TQ4G63CFR-RDC suitable for use in devices like laptops, desktops, and network equipment, where high-speed and efficient memory is critical.
Package
The H5TQ4G63CFR-RDC is a DRAM chip typically packaged in a 78-ball FBGA (Fine Ball Grid Array) format. This compact package type is designed for high-density memory applications, providing efficient space utilization and thermal performance.
Pinout
The H5TQ4G63CFR-RDC is a 4Gb (gigabit) DDR3 SDRAM memory chip. It typically has a pin count of 78 pins. The chip is designed for use in various applications such as computing, networking, and consumer electronics.
Key functions include:
- Data Storage: It serves as volatile memory, providing fast read and write operations.
- Interface: It operates with a 64-bit data bus, allowing efficient data transfer.
- Power Management: It features low power consumption modes to enhance energy efficiency.
- Speed Grades: It supports different clock speeds, commonly operating at 800 MT/s (megatransfers per second) or higher.
Overall, this chip is integrated into various devices to enhance performance and data handling capabilities.
Key functions include:
- Data Storage: It serves as volatile memory, providing fast read and write operations.
- Interface: It operates with a 64-bit data bus, allowing efficient data transfer.
- Power Management: It features low power consumption modes to enhance energy efficiency.
- Speed Grades: It supports different clock speeds, commonly operating at 800 MT/s (megatransfers per second) or higher.
Overall, this chip is integrated into various devices to enhance performance and data handling capabilities.
Manufacturer
The H5TQ4G63CFR-RDC is manufactured by Hynix Semiconductor, which is now known as SK Hynix Inc. It is a South Korean multinational company specializing in semiconductor products, particularly memory chips such as DRAM and NAND flash. Established in 1983, SK Hynix is one of the largest semiconductor manufacturers globally, providing components for a wide range of applications, including consumer electronics, servers, and mobile devices. The company is known for its innovation and is a key player in the memory market, competing with other industry leaders like Samsung and Micron Technology.
Application
The H5TQ4G63CFR-RDC is a 4GB DDR3 SDRAM memory chip commonly used in various consumer electronics. Its application areas include smartphones, tablets, laptops, and other computing devices, where it enhances performance through high-speed data processing and efficient memory management. Additionally, it may be utilized in automotive systems, smart TVs, and gaming consoles for improved multimedia and gaming experiences.
Equivalent
The H5TQ4G63CFR-RDC is a DDR3 SDRAM memory chip. Equivalent products include the H5TQ4G63CFR-PBC, MT41K256M16, and NBM4G16A1C1. Always verify compatibility based on specifications such as speed, voltage, and pin configuration.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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