H5TC4G63EFR-PBA

The H5TC4G63EFR-PBA is a DRAM (Dynamic Random Access Memory) chip manufactured by SK Hynix. It is part of the DDR3 SDRAM family, widely utilized in various computing and electronic devices for temporary data storage to enhance their processing speed and efficiency. Specifically, this model offers 4Gb (gigabit) capacity, which translates to 512MB (megabytes) of storage per chip.
This memory is notable for its high-speed data processing capabilities and low power consumption, optimized to support a wide range of applications including PCs, laptops, servers, and other electronic devices that demand high-performance memory solutions. It operates at a standard voltage of 1.5V, adhering to the DDR3 memory standards for improved performance and reliability.
The H5TC4G63EFR-PBA features a 2,133MHz (megahertz) clock speed, which facilitates quick data transfer rates, making it suitable for both consumer and enterprise-level applications. Its efficient design contributes to reduced heat generation, thereby enhancing the overall longevity and durability of the devices it powers.

The H5TC4G63EFR-PBA is a DRAM chip designed by SK Hynix, commonly used in various computing and electronic devices. Here are its key features:
1. Type: 4Gb DDR3L SDRAM, indicating it has a storage capacity of 4 gigabits and utilizes DDR3L technology, which operates at a lower voltage for improved power efficiency.
2. Package: It is typically available in a standard FBGA (Fine-Pitch Ball Grid Array) package, which enhances performance by reducing electrical interference and improving thermal management.
3. Voltage: The DDR3L designation suggests it operates at 1.35V, which is lower than the standard DDR3 voltage of 1.5V, offering better energy efficiency.
4. Speed: It supports various data rates, commonly up to 1600 MT/s (megatransfers per second), providing robust performance for a wide range of applications.
5. Interface: It has a 64-bit data interface, suitable for handling high bandwidths necessary for smooth operation in demanding environments.
6. Applications: This DRAM module is often used in laptops, desktops, and other electronic devices requiring efficient and reliable memory solutions.
The H5TC4G63EFR-PBA is valued for its balance of performance, efficiency, and compact design, making it a solid choice for modern electronic devices.

The H5TC4G63EFR-PBA is a DRAM chip from SK Hynix, encapsulated in a 78-ball FBGA (Fine-Pitch Ball Grid Array) package. This type of packaging is designed to provide a compact and efficient form for mounting the chip onto circuit boards, enhancing electrical performance and heat dissipation.

The H5TC4G63EFR-PBA is a DDR3L SDRAM chip manufactured by SK Hynix. It typically comes in a 78-ball FBGA package. This memory chip is designed for high-performance applications and offers the following key functions:
1. Density and Configuration: It is a 4Gb (gigabit) DRAM organized in 256M x 16-bit configurations.
2. Interface: Operates with a DDR3L interface, which supports lower voltage operations at 1.35V, offering energy efficiency.
3. Data Rate: Supports data rates up to 1866 Mbps, which contributes to high-speed data transfer.
4. Applications: Primarily used in computing devices like laptops, desktops, and servers to enhance processing speed and efficiency.
5. Advanced Features: Includes features such as on-die termination (ODT), self-refresh mode, and programmable burst lengths, which optimize performance under various conditions.
The 78-ball FBGA package enables compact and efficient board design, which is essential for modern electronic devices.

The H5TC4G63EFR-PBA is a DRAM memory chip manufactured by SK Hynix. SK Hynix is a South Korean company that primarily produces semiconductor memory chips, including DRAM and NAND flash. It is one of the world's largest memory chip manufacturers and a significant player in the semiconductor industry. SK Hynix supplies memory solutions for a wide range of applications, including computing, mobile, and server markets.

The H5TC4G63EFR-PBA is a DRAM chip commonly used in applications requiring efficient memory solutions. These include consumer electronics like smartphones, tablets, and laptops, where it's employed for RAM to ensure quick data processing and multitasking. It's also used in networking equipment, automotive systems, and industrial applications, where reliable and high-speed memory is essential. Its design supports high-density storage and energy efficiency, making it suitable for compact and power-sensitive devices.

The H5TC4G63EFR-PBA is a DDR3L SDRAM chip from SK Hynix. Equivalent products from other manufacturers include the Micron MT41K256M16HA-125, Samsung K4B4G1646D-BCK0, and Kingston's equivalent DDR3L chips. These alternatives match in terms of capacity (4Gb), voltage (1.35V), and speed (1600 MT/s). Always verify pin configurations and specific feature compatibility when selecting an equivalent.