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H27U4G8F2DTR-BC
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- Mfr。パート #H27U4G8F2DTR-BC
- パッケージ
- データシート
- 在庫中5446
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仕様
| Manufacturer | JLCPCB Assembly |
| Package | TSOP1-48 |
概要
Description
It appears that "H27U4G8F2DTR-BC" is a product code, likely associated with a specific electronic component or device. Given the format, it could be a part number for a semiconductor component such as a memory chip, a microcontroller, or a similar integrated circuit.
In many cases, such codes are used by manufacturers to identify specific models and configurations of their products. For example, memory chips from companies like Samsung, Hynix, or Micron often have similar alphanumeric codes indicating specifications like memory size, type (e.g., NAND, DRAM), speed, and package type.
For an accurate introduction, you would typically refer to the manufacturer's datasheet or product documentation for the H27U4G8F2DTR-BC. This documentation would provide details such as its electrical characteristics, pin configuration, operational guidelines, and application scenarios.
If you need specific information about this product code, I recommend visiting the manufacturer's website or consulting their technical support for official details.
In many cases, such codes are used by manufacturers to identify specific models and configurations of their products. For example, memory chips from companies like Samsung, Hynix, or Micron often have similar alphanumeric codes indicating specifications like memory size, type (e.g., NAND, DRAM), speed, and package type.
For an accurate introduction, you would typically refer to the manufacturer's datasheet or product documentation for the H27U4G8F2DTR-BC. This documentation would provide details such as its electrical characteristics, pin configuration, operational guidelines, and application scenarios.
If you need specific information about this product code, I recommend visiting the manufacturer's website or consulting their technical support for official details.
Features
The H27U4G8F2DTR-BC is a NAND flash memory chip produced by SK Hynix. It is designed for use in various electronic devices requiring reliable data storage solutions. Key features include:
1. Memory Capacity: Typically offers 32Gb (Gigabit) of storage.
2. Type: It is a Synchronous NAND Flash, which provides efficient data transfer speeds.
3. Voltage: Operates at a low voltage, around 3.3V, making it energy-efficient.
4. Interface: Utilizes a standard interface for compatibility with various controllers.
5. Endurance: Designed to withstand a high number of program/erase cycles, suitable for applications requiring frequent data rewriting.
6. Performance: Offers fast read and write speeds, enhancing overall device performance.
7. Form Factor: Comes in a compact package, making it ideal for space-constrained applications.
8. Temperature Range: Supports a wide operating temperature range, suitable for diverse environments.
9. Reliability: Features error correction mechanisms to ensure data integrity.
This chip is typically used in consumer electronics, mobile devices, and other applications where high-density, non-volatile memory is required.
1. Memory Capacity: Typically offers 32Gb (Gigabit) of storage.
2. Type: It is a Synchronous NAND Flash, which provides efficient data transfer speeds.
3. Voltage: Operates at a low voltage, around 3.3V, making it energy-efficient.
4. Interface: Utilizes a standard interface for compatibility with various controllers.
5. Endurance: Designed to withstand a high number of program/erase cycles, suitable for applications requiring frequent data rewriting.
6. Performance: Offers fast read and write speeds, enhancing overall device performance.
7. Form Factor: Comes in a compact package, making it ideal for space-constrained applications.
8. Temperature Range: Supports a wide operating temperature range, suitable for diverse environments.
9. Reliability: Features error correction mechanisms to ensure data integrity.
This chip is typically used in consumer electronics, mobile devices, and other applications where high-density, non-volatile memory is required.
Package
The H27U4G8F2DTR-BC is a NAND Flash memory chip typically found in a TSOP (Thin Small Outline Package) type package. TSOP is a rectangular package widely used for memory ICs due to its compact size, making it suitable for space-constrained applications like embedded systems and consumer electronics.
Pinout
The H27U4G8F2DTR-BC is a NAND Flash memory chip manufactured by SK Hynix. It typically comes in a standard TSOP (Thin Small-Outline Package) with 48 pins. The function of this chip is to provide non-volatile storage, meaning it retains data even when power is removed. It is commonly used in applications like solid-state drives, USB flash drives, and other embedded storage solutions.
Key functions of the pins include:
- Power Supply Pins: VCC and GND for providing power to the device.
- Data Interface Pins: I/O pins for data input and output operations.
- Control Pins: Include CLE (Command Latch Enable), ALE (Address Latch Enable), WE# (Write Enable), RE# (Read Enable), and CE# (Chip Enable) for managing the operations of the NAND flash.
- R/B# (Ready/Busy): Indicates the status of the memory operation.
The H27U4G8F2DTR-BC is designed to offer high-density storage with reliable performance, making it suitable for various digital storage applications. Always refer to the manufacturer's datasheet for detailed pin configuration and functions.
Key functions of the pins include:
- Power Supply Pins: VCC and GND for providing power to the device.
- Data Interface Pins: I/O pins for data input and output operations.
- Control Pins: Include CLE (Command Latch Enable), ALE (Address Latch Enable), WE# (Write Enable), RE# (Read Enable), and CE# (Chip Enable) for managing the operations of the NAND flash.
- R/B# (Ready/Busy): Indicates the status of the memory operation.
The H27U4G8F2DTR-BC is designed to offer high-density storage with reliable performance, making it suitable for various digital storage applications. Always refer to the manufacturer's datasheet for detailed pin configuration and functions.
Manufacturer
The H27U4G8F2DTR-BC is a NAND Flash memory chip manufactured by SK Hynix. SK Hynix is a South Korean company and is one of the largest semiconductor manufacturers in the world. It specializes in producing memory chips, including DRAM and NAND Flash, which are essential components in a wide array of electronic devices such as smartphones, computers, and servers. SK Hynix is recognized for its advanced technology in semiconductor manufacturing and plays a significant role in the global supply chain for electronic components.
Application
The H27U4G8F2DTR-BC is a NAND flash memory chip commonly used in various electronic devices. Its application areas include smartphones, tablets, digital cameras, and other portable electronics, where it serves as storage for operating systems, applications, and user data. Additionally, it is used in solid-state drives (SSDs) and embedded systems in automotive and industrial applications, providing reliable and high-capacity storage solutions.
Equivalent
The H27U4G8F2DTR-BC is a NAND flash memory chip produced by SK Hynix. Equivalent products from other manufacturers may include:
1. Samsung: K9GAG08U0F series
2. Micron: MT29F4G08ABADAWP series
3. Toshiba (now Kioxia): TC58NVG2S3HTA00 series
Ensure compatibility by checking specifications like capacity, voltage, interface, and package type, as they may vary slightly across manufacturers.
1. Samsung: K9GAG08U0F series
2. Micron: MT29F4G08ABADAWP series
3. Toshiba (now Kioxia): TC58NVG2S3HTA00 series
Ensure compatibility by checking specifications like capacity, voltage, interface, and package type, as they may vary slightly across manufacturers.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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