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EP2AGX260FF35I3N
IC FPGA 612 I/O 1152FBGA
- メーカー
- Mfr。パート #EP2AGX260FF35I3N
- パッケージ FBGA-1152
- データシート
- 在庫中5153
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
RFQおよびもっと割引を得る
仕様
| Package | Tray |
| Series | Arria II GX |
| ProductStatus | Obsolete |
| NumberofLABs/CLBs | 10260 |
| NumberofLogicElements/Cells | 244188 |
| TotalRAMBits | 12038144 |
| NumberofI/O | 612 |
| Voltage-Supply | 0.87V ~ 0.93V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 1152-BBGA, FCBGA |
概要
Description
The EP2AGX260FF35I3N is a high-performance FPGA (Field Programmable Gate Array) from Intel's Arria II GX family. It features 260,000 logic elements, enabling complex digital designs and applications. Designed for versatility, it supports a wide range of I/O standards, including LVDS and PCIe, making it suitable for various communication and processing tasks.
This FPGA offers advanced processing capabilities, including DSP blocks for high-speed signal processing, as well as embedded memory blocks that enhance data handling and storage. With its 35nm process technology, the EP2AGX260FF35I3N achieves a balance of performance and power efficiency, making it ideal for applications in telecommunications, automotive, industrial automation, and more.
The part number indicates specifics such as device family, density, package type (FF for Fine Pitch Flip Chip), and operating temperature range (I3 for industrial). Overall, the EP2AGX260FF35I3N provides a flexible and powerful solution for developers needing customizable hardware for demanding applications.
This FPGA offers advanced processing capabilities, including DSP blocks for high-speed signal processing, as well as embedded memory blocks that enhance data handling and storage. With its 35nm process technology, the EP2AGX260FF35I3N achieves a balance of performance and power efficiency, making it ideal for applications in telecommunications, automotive, industrial automation, and more.
The part number indicates specifics such as device family, density, package type (FF for Fine Pitch Flip Chip), and operating temperature range (I3 for industrial). Overall, the EP2AGX260FF35I3N provides a flexible and powerful solution for developers needing customizable hardware for demanding applications.
Features
The EP2AGX260FF35I3N is a member of Intel's Arria 10 FPGA family, designed for high-performance applications. Key features include:
1. Logic Elements: Approximately 260,000 logic elements, enabling complex designs and high processing capabilities.
2. Memory: Supports up to 11.5 Mbits of on-chip memory and multiple memory interfaces for high-speed data access.
3. DSP Blocks: Contains up to 840 DSP blocks for efficient digital signal processing tasks, suitable for applications like audio and video processing.
4. I/O Support: Offers a range of I/O standards, including LVDS, allowing for flexible connectivity options.
5. High-Speed Transceivers: Equipped with transceivers capable of operating at speeds up to 28 Gbps, facilitating high-bandwidth applications.
6. Power Efficiency: Designed for low power consumption while maintaining performance, ideal for embedded and portable designs.
7. Development Tools: Compatible with Intel's Quartus Prime software for streamlined design and integration.
These features make the EP2AGX260FF35I3N suitable for applications in telecommunications, industrial automation, and high-performance computing.
1. Logic Elements: Approximately 260,000 logic elements, enabling complex designs and high processing capabilities.
2. Memory: Supports up to 11.5 Mbits of on-chip memory and multiple memory interfaces for high-speed data access.
3. DSP Blocks: Contains up to 840 DSP blocks for efficient digital signal processing tasks, suitable for applications like audio and video processing.
4. I/O Support: Offers a range of I/O standards, including LVDS, allowing for flexible connectivity options.
5. High-Speed Transceivers: Equipped with transceivers capable of operating at speeds up to 28 Gbps, facilitating high-bandwidth applications.
6. Power Efficiency: Designed for low power consumption while maintaining performance, ideal for embedded and portable designs.
7. Development Tools: Compatible with Intel's Quartus Prime software for streamlined design and integration.
These features make the EP2AGX260FF35I3N suitable for applications in telecommunications, industrial automation, and high-performance computing.
Package
The EP2AGX260FF35I3N is packaged in a Fine-Pitch Ball Grid Array (FBGA) format. This package type features a 35 mm x 35 mm footprint and is designed for high-density applications, offering efficient thermal performance and connectivity for the FPGA.
Pinout
The EP2AGX260FF35I3N is a field-programmable gate array (FPGA) from Intel's Arria II GX series. It features a pin count of 484 pins.
The functions of these pins include various I/O capabilities, power supply inputs, ground connections, and dedicated pins for configuration and clock management. The FPGA supports multiple I/O standards and provides flexibility for high-speed serial communication, parallel data processing, and interfacing with other devices.
In summary, the EP2AGX260FF35I3N has 484 pins, serving multiple functions like general-purpose I/O, configuration, and power connections, suitable for complex applications in digital design and signal processing.
The functions of these pins include various I/O capabilities, power supply inputs, ground connections, and dedicated pins for configuration and clock management. The FPGA supports multiple I/O standards and provides flexibility for high-speed serial communication, parallel data processing, and interfacing with other devices.
In summary, the EP2AGX260FF35I3N has 484 pins, serving multiple functions like general-purpose I/O, configuration, and power connections, suitable for complex applications in digital design and signal processing.
Manufacturer
The EP2AGX260FF35I3N is manufactured by Intel Corporation, specifically under its programmable solutions division, which produces field-programmable gate arrays (FPGAs). Intel is a multinational technology company headquartered in Santa Clara, California, known primarily for its semiconductor products, including microprocessors for computers and other devices. The company also focuses on data-centric technologies, including artificial intelligence, cloud computing, and IoT solutions. The programmable solutions division, which includes the FPGA products, was strengthened by Intel's acquisition of Altera in 2015, integrating advanced FPGA technology into Intel's broader portfolio.
Application
The EP2AGX260FF35I3N is a high-performance FPGA from Intel, suitable for various application areas including digital signal processing, high-speed communications, video processing, embedded systems, and network management. Its capabilities make it ideal for use in medical imaging, industrial automation, aerospace and defense, and automotive systems, where flexibility and performance are crucial.
Equivalent
The EP2AGX260FF35I3N is an Altera (now Intel) FPGA from the Arria II GX family. Equivalent products include:
1. Xilinx Artix-7 series (e.g., XC7A200T)
2. Lattice ECP5 series (e.g., LFE5U-85F)
3. Microsemi SmartFusion2 series (e.g., M2S050)
These alternatives vary in specifications, so ensure compatibility with your specific application requirements.
1. Xilinx Artix-7 series (e.g., XC7A200T)
2. Lattice ECP5 series (e.g., LFE5U-85F)
3. Microsemi SmartFusion2 series (e.g., M2S050)
These alternatives vary in specifications, so ensure compatibility with your specific application requirements.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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