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CYW20733A3KFB1G
IC RF TXRX+MCU BLE 81FBGA
- メーカー
- Mfr。パート #CYW20733A3KFB1G
- パッケージ
- データシート CYW20733A3KFB1G DataSheet
- 在庫中16851
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
RFQおよびもっと割引を得る
仕様
| Part Status | Active |
| Type | TxRx + MCU |
| RF Family/Standard | Bluetooth |
| Protocol | Bluetooth v3.0 +EDR |
| Modulation | 4DQPSK, 8DPSK, GFSK |
| Frequency | 2.4GHz |
| Data Rate (Max) | 3Mbps |
| Power - Output | 10dBm |
| Sensitivity | -85dBm |
| Serial Interfaces | I2C, SPI, UART |
| Voltage - Supply | 3V |
| Current - Receiving | 28mA |
| Current - Transmitting | 63mA |
| Operating Temperature | 0°C ~ 70°C |
| Mounting Type | Surface Mount |
| Package / Case | 81-TFBGA |
| Supplier Device Package | 81-FBGA (8x8) |
| Base Product Number | CYW20733 |
| DigiKey Programmable | Not Verified |
| GPIO | 40 |
概要
Description
The CYW20733A3KFB1G is a Bluetooth and Wi-Fi combo chip from Cypress Semiconductor, designed for low-power and high-performance applications. It supports Bluetooth 5.0, enabling faster data rates, longer range, and improved coexistence with other wireless technologies. The chip integrates a robust Wi-Fi subsystem, supporting 802.11 b/g/n standards, making it suitable for various IoT applications.
Key features include a built-in microcontroller, various peripheral interfaces (such as SPI, I2C, and UART), and extensive power management capabilities, allowing for energy-efficient operation. This makes it ideal for battery-operated devices. The CYW20733 also supports advanced security features for secure connectivity.
Applications range from smart home devices to industrial automation and wearable technology, providing manufacturers with a versatile solution for modern wireless communication needs. Overall, the CYW20733A3KFB1G is an excellent choice for developers seeking to integrate reliable wireless functionality into their products.
Key features include a built-in microcontroller, various peripheral interfaces (such as SPI, I2C, and UART), and extensive power management capabilities, allowing for energy-efficient operation. This makes it ideal for battery-operated devices. The CYW20733 also supports advanced security features for secure connectivity.
Applications range from smart home devices to industrial automation and wearable technology, providing manufacturers with a versatile solution for modern wireless communication needs. Overall, the CYW20733A3KFB1G is an excellent choice for developers seeking to integrate reliable wireless functionality into their products.
Features
The CYW20733A3KFB1G is a highly integrated Bluetooth SoC (System on Chip) designed for low-power wireless applications. Key features include:
1. Bluetooth 5.0: Supports LE (Low Energy) and classic Bluetooth for efficient data transmission.
2. Dual Mode Capability: Enables concurrent Bluetooth and other wireless protocols.
3. Integrated RF Transceiver: Built-in RF allows for compact designs without external components.
4. Low Power Consumption: Optimized for battery-operated devices, ensuring extended operation times.
5. High Processing Power: Features a 32-bit ARM Cortex-M4 processor for robust application performance.
6. Memory Options: Includes both RAM and Flash memory for application storage.
7. Flexible GPIO: Offers multiple general-purpose input/output pins for interfacing with various peripherals.
8. Development Support: Compatible with development kits and software tools for easy application development.
These features make the CYW20733A3KFB1G suitable for various applications, including wearables, smart home devices, and IoT products.
1. Bluetooth 5.0: Supports LE (Low Energy) and classic Bluetooth for efficient data transmission.
2. Dual Mode Capability: Enables concurrent Bluetooth and other wireless protocols.
3. Integrated RF Transceiver: Built-in RF allows for compact designs without external components.
4. Low Power Consumption: Optimized for battery-operated devices, ensuring extended operation times.
5. High Processing Power: Features a 32-bit ARM Cortex-M4 processor for robust application performance.
6. Memory Options: Includes both RAM and Flash memory for application storage.
7. Flexible GPIO: Offers multiple general-purpose input/output pins for interfacing with various peripherals.
8. Development Support: Compatible with development kits and software tools for easy application development.
These features make the CYW20733A3KFB1G suitable for various applications, including wearables, smart home devices, and IoT products.
Package
The CYW20733A3KFB1G is packaged in a 32-pin QFN (Quad Flat No-lead) package, specifically in a 5mm x 5mm size, designed for compact applications requiring Bluetooth and other wireless connectivity solutions.
Pinout
The CYW20733A3KFB1G is a Bluetooth and Wi-Fi integrated chip manufactured by Cypress Semiconductor (now part of Infineon Technologies). It features a pin count of 32 pins.
The primary functions of the CYW20733A3KFB1G include enabling wireless connectivity through Bluetooth 5.0 and Wi-Fi (802.11 b/g/n) protocols, making it suitable for applications in IoT devices, wearables, and smart home products. It supports various interfaces such as SPI, I2C, and UART, facilitating communication with microcontrollers and other external devices. Additionally, the chip incorporates integrated power management features, enhancing energy efficiency and performance in battery-operated applications. Overall, the CYW20733A3KFB1G is designed for compact and power-sensitive devices requiring reliable wireless communication.
The primary functions of the CYW20733A3KFB1G include enabling wireless connectivity through Bluetooth 5.0 and Wi-Fi (802.11 b/g/n) protocols, making it suitable for applications in IoT devices, wearables, and smart home products. It supports various interfaces such as SPI, I2C, and UART, facilitating communication with microcontrollers and other external devices. Additionally, the chip incorporates integrated power management features, enhancing energy efficiency and performance in battery-operated applications. Overall, the CYW20733A3KFB1G is designed for compact and power-sensitive devices requiring reliable wireless communication.
Manufacturer
The CYW20733A3KFB1G is manufactured by Cypress Semiconductor, which is a part of Infineon Technologies AG. Cypress Semiconductor specializes in providing advanced embedded system solutions, including microcontrollers, memories, and connectivity solutions. The company is known for its focus on high-performance, reliable products in various applications, including automotive, industrial, and consumer electronics. Cypress is particularly recognized for its Bluetooth and wireless connectivity solutions, making it a key player in the Internet of Things (IoT) space. In 2020, Cypress was acquired by Infineon Technologies, further expanding its reach and capabilities in the semiconductor industry.
Application
The CYW20733A3KFB1G is a Bluetooth and Wi-Fi combo chip designed for Internet of Things (IoT) applications. Its primary application areas include smart home devices, wearables, health monitoring systems, industrial automation, and consumer electronics. It enables low-power wireless connectivity, making it ideal for battery-operated devices requiring efficient communication and data transfer.
Equivalent
The CYW20733A3KFB1G chip, a Bluetooth and Wi-Fi combo solution from Cypress, has equivalent or similar products such as the Nordic Semiconductor nRF52840, ESP32 from Espressif, and the Texas Instruments CC2640R2F. Each of these alternatives offers Bluetooth and/or Wi-Fi capabilities suitable for various IoT applications. Always verify specific features and compatibility based on your project requirements.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
支払い
Payment Methods
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