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CSD87313DMS
MOSFET 2 N-CHANNEL 30V 8WSON
- メーカー
- Mfr。パート #CSD87313DMS
- パッケージ 8-PowerWDFN
- データシート
- 在庫中3802
100% オリジナル &新しい
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365日の保証
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仕様
| Supplier | Texas Instruments |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Series | NexFET™ |
| ProductStatus | Active |
| FETType | 2 N-Channel (Dual) Common Drain |
| FETFeature | Standard |
| DraintoSourceVoltage(Vdss) | 30V |
| Vgs(th)(Max)@Id | 1.25V @ 250µA |
| GateCharge(Qg)(Max)@Vgs | 28nC @ 4.5V |
| InputCapacitance(Ciss)(Max)@Vds | 4290pF @ 15V |
| OperatingTemperature | -55°C ~ 150°C (TJ) |
| MountingType | Surface Mount |
| Package/Case | 8-PowerWDFN |
概要
Description
The CSD87313DMS is TI’s dual N‑channel NexFET power MOSFET in a compact DMS package. It provides two N‑channel FETs in one device, optimized for high‑efficiency switching power stages.
Key points:
- Used as the switching devices in synchronous buck/boost regulators, motor drives, load switches, and other power‑conversion circuits.
- Benefits include a small footprint, matched devices, low on‑resistance, and fast switching suitable for compact, high‑current applications.
- Typical use is as high‑side and low‑side FETs in a synchronous buck converter or similar power‑stage topology.
What to check in the datasheet:
- Vds rating, Rds(on), Qgs/Qgd (gate charge characteristics), total power and thermal limits.
- Package details (DMS) and recommended PCB footprint/land pattern.
- Safe operating areas, ESD/gate‑drive requirements, and maximum gate voltage.
For exact electrical specs, package dimensions, and application notes, see TI’s CSD87313DMS product page and datasheet.
Key points:
- Used as the switching devices in synchronous buck/boost regulators, motor drives, load switches, and other power‑conversion circuits.
- Benefits include a small footprint, matched devices, low on‑resistance, and fast switching suitable for compact, high‑current applications.
- Typical use is as high‑side and low‑side FETs in a synchronous buck converter or similar power‑stage topology.
What to check in the datasheet:
- Vds rating, Rds(on), Qgs/Qgd (gate charge characteristics), total power and thermal limits.
- Package details (DMS) and recommended PCB footprint/land pattern.
- Safe operating areas, ESD/gate‑drive requirements, and maximum gate voltage.
For exact electrical specs, package dimensions, and application notes, see TI’s CSD87313DMS product page and datasheet.
Features
CSD87313DMS Features (concise)
- Dual N-channel power MOSFETs
- Package: DMSOP-8 (8-pin)
- VDS: ~30 V
- RDS(on): ~13 mΩ (typ) per FET at VGS = 4.5 V
- Logic-level gate drive (low VGS requirement)
- High current capability with low gate charge for efficiency
- Fast switching and low output transition losses
- Integrated body diodes; suitable for synchronous buck, DC-DC converters, load switches
- RoHS-compliant (lead-free) package
Note: for exact figures and any additional features (thermal, package variants, certifications), please refer to the official TI datasheet.
- Dual N-channel power MOSFETs
- Package: DMSOP-8 (8-pin)
- VDS: ~30 V
- RDS(on): ~13 mΩ (typ) per FET at VGS = 4.5 V
- Logic-level gate drive (low VGS requirement)
- High current capability with low gate charge for efficiency
- Fast switching and low output transition losses
- Integrated body diodes; suitable for synchronous buck, DC-DC converters, load switches
- RoHS-compliant (lead-free) package
Note: for exact figures and any additional features (thermal, package variants, certifications), please refer to the official TI datasheet.
Package
DMS package — TI’s 8-pin DMS/≈3×3 mm small-footprint package (DMSOP-style form factor).
Pinout
- Pin count: 8 pins (DMS package)
- Function: Dual N-channel NexFET power MOSFET pair (two MOSFETs with gate, drain, and source terminals); typically used as a high-side/low-side pair in DC-DC converter applications, with a thermal/exposed pad for heat dissipation.
- Function: Dual N-channel NexFET power MOSFET pair (two MOSFETs with gate, drain, and source terminals); typically used as a high-side/low-side pair in DC-DC converter applications, with a thermal/exposed pad for heat dissipation.
Manufacturer
Manufacturer: Texas Instruments (TI).
What kind of company: TI is an American multinational semiconductor company that designs, manufactures, and sells analog and embedded processing integrated circuits (including power management, high-performance MOSFETs, microcontrollers, sensors, etc.).
What kind of company: TI is an American multinational semiconductor company that designs, manufactures, and sells analog and embedded processing integrated circuits (including power management, high-performance MOSFETs, microcontrollers, sensors, etc.).
Application
Application areas: power management and switching for DC-DC converters (synchronous buck/boost), load switches, motor control, and general high-efficiency switching in consumer electronics, automotive, and industrial equipment.
出荷
出荷方法私たち
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出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
支払い
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