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CC2564BYFVR
IC RF TXRX BLUETOOTH 54BGA
- メーカー
- Mfr。パート #CC2564BYFVR
- パッケージ 54-UFBGA,DSBGA
- データシート
- 在庫中4783
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
RFQおよびもっと割引を得る
仕様
| Package | Tape & Reel (TR),Cut Tape (CT) |
| ProductStatus | Active |
| Type | TxRx Only |
| RFFamily/Standard | Bluetooth |
| Protocol | Bluetooth v4.1 |
| Modulation | GFSK, GMSK |
| Frequency | 2.4GHz |
| DataRate(Max) | 4Mbps |
| Power-Output | 12dBm |
| Sensitivity | -95dBm |
| SerialInterfaces | I²S, UART |
| Voltage-Supply | 2.2V ~ 4.8V |
| Current-Receiving | 40.5mA ~ 41.2mA |
| Current-Transmitting | 40.5mA ~ 41.2mA |
| OperatingTemperature | -40°C ~ 85°C |
| MountingType | Surface Mount |
| Package/Case | 54-BGA, DSBGA |
概要
Description
The CC2564BYFVR is a highly integrated Bluetooth solution from Texas Instruments, designed to support Bluetooth 4.1 dual-mode functionality. This chip is known for its low power consumption and robust wireless connectivity, making it ideal for a variety of applications including audio streaming, health and fitness devices, and industrial automation. It combines a Bluetooth baseband with a high-performance Bluetooth RF transceiver, supporting both Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Bluetooth Low Energy (BLE) operations.
The CC2564BYFVR is engineered to offer a simplified design process with its compact footprint and minimal external component requirements. The device supports multiple profiles and includes features like Adaptive Frequency Hopping (AFH) and automatic power control to optimize performance in crowded radio environments. Additionally, its integration with the TI Bluetooth stack facilitates rapid development and deployment.
This chip is part of Texas Instruments' SimpleLink family, providing developers with a wide range of wireless connectivity options and development tools. Its versatility and efficiency make it suitable for both consumer electronics and industrial applications.
The CC2564BYFVR is engineered to offer a simplified design process with its compact footprint and minimal external component requirements. The device supports multiple profiles and includes features like Adaptive Frequency Hopping (AFH) and automatic power control to optimize performance in crowded radio environments. Additionally, its integration with the TI Bluetooth stack facilitates rapid development and deployment.
This chip is part of Texas Instruments' SimpleLink family, providing developers with a wide range of wireless connectivity options and development tools. Its versatility and efficiency make it suitable for both consumer electronics and industrial applications.
Features
The CC2564BYFVR is a dual-mode Bluetooth® wireless communication solution from Texas Instruments. Key features include:
1. Dual-Mode Bluetooth: Supports Bluetooth Classic and Bluetooth Low Energy (BLE) for versatile connectivity.
2. High Throughput: Offers data rates up to 3 Mbps in Bluetooth Classic mode.
3. Audio Support: Includes advanced audio capabilities, supporting HFP, A2DP, and AVRCP profiles.
4. Power Efficiency: Designed for low power consumption to extend battery life in portable applications.
5. Integrated ROM: Reduces the need for external memory and simplifies the design.
6. Extended Range: Enhanced range capabilities due to its high sensitivity and output power.
7. Small Form Factor: Compact packaging (VQFN) to fit in space-constrained designs.
8. Ease of Integration: Offers a development kit and software stack for seamless integration into various platforms.
9. Security: Provides secure connection features, including encryption and authentication.
10. Regulatory Compliance: Complies with global Bluetooth standards and certifications.
These features make the CC2564BYFVR suitable for applications in consumer electronics, automotive, medical devices, and industrial systems.
1. Dual-Mode Bluetooth: Supports Bluetooth Classic and Bluetooth Low Energy (BLE) for versatile connectivity.
2. High Throughput: Offers data rates up to 3 Mbps in Bluetooth Classic mode.
3. Audio Support: Includes advanced audio capabilities, supporting HFP, A2DP, and AVRCP profiles.
4. Power Efficiency: Designed for low power consumption to extend battery life in portable applications.
5. Integrated ROM: Reduces the need for external memory and simplifies the design.
6. Extended Range: Enhanced range capabilities due to its high sensitivity and output power.
7. Small Form Factor: Compact packaging (VQFN) to fit in space-constrained designs.
8. Ease of Integration: Offers a development kit and software stack for seamless integration into various platforms.
9. Security: Provides secure connection features, including encryption and authentication.
10. Regulatory Compliance: Complies with global Bluetooth standards and certifications.
These features make the CC2564BYFVR suitable for applications in consumer electronics, automotive, medical devices, and industrial systems.
Package
The CC2564BYFVR is a Bluetooth chipset from Texas Instruments, housed in a 76-ball BGA (Ball Grid Array) package. This package type is compact, facilitating efficient thermal management and high-density mounting on circuit boards, making it suitable for embedded applications requiring Bluetooth connectivity.
Pinout
The CC2564BYFVR is a Bluetooth solution from Texas Instruments. It typically comes in a QFN package with 76 pins. The device supports Bluetooth 4.1, including Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) functionalities. The pin configuration includes connections for power supply, ground, various control and data interfaces like UART, PCM for audio data, and interfaces for external components like crystals and antennas. This device is used in applications requiring Bluetooth connectivity, such as audio streaming devices, health and fitness products, and industrial applications. For detailed pin functions and specific design requirements, refer to the datasheet or technical manual provided by the manufacturer.
Manufacturer
The CC2564BYFVR is manufactured by Texas Instruments Incorporated (TI). Texas Instruments is a global semiconductor company known for designing and manufacturing a wide range of analog and embedded processing chips. TI is a major player in the electronics industry, providing components used in various applications, including consumer electronics, automotive systems, industrial equipment, and communications infrastructure. The company is renowned for its innovation and leadership in the development of integrated circuits and other semiconductor products.
Application
The CC2564BYFVR is a dual-mode Bluetooth wireless communication module that supports Bluetooth Classic and Bluetooth Low Energy. It is commonly used in applications such as wireless audio streaming, healthcare and medical devices, industrial automation, wireless controllers, and Internet of Things (IoT) devices. Its integrated Bluetooth stack and support for various profiles make it suitable for a wide range of applications requiring reliable and efficient wireless connectivity.
Equivalent
The CC2564BYFVR is a dual-mode Bluetooth controller from Texas Instruments. Equivalent products might include:
1. Broadcom/Cypress CYW20706: Another dual-mode Bluetooth controller with similar features.
2. Microchip RN4678: A dual-mode Bluetooth module suitable for similar applications.
3. Nordic Semiconductor nRF52840: While more versatile with additional features, it's often used in similar Bluetooth applications.
4. Silicon Labs EFR32BG22: A low-power Bluetooth SoC that can serve similar roles.
Always check the specifications to ensure compatibility with your specific application needs.
1. Broadcom/Cypress CYW20706: Another dual-mode Bluetooth controller with similar features.
2. Microchip RN4678: A dual-mode Bluetooth module suitable for similar applications.
3. Nordic Semiconductor nRF52840: While more versatile with additional features, it's often used in similar Bluetooth applications.
4. Silicon Labs EFR32BG22: A low-power Bluetooth SoC that can serve similar roles.
Always check the specifications to ensure compatibility with your specific application needs.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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