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BMD-330-A-R
RF TXRX MOD BT TH SMD
- メーカー
- Mfr。パート #BMD-330-A-R
- パッケージ
- データシート BMD-330-A-R DataSheet
- 在庫中2530
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仕様
| Series | BMD-300 |
| Part Status | Active |
| Base Product Number | BMD-330 |
| DigiKey Programmable | Not Verified |
| RF Family/Standard | Bluetooth |
| Protocol | Bluetooth v5.0 |
| Modulation | GFSK |
| Frequency | 2.3GHz ~ 2.5GHz |
| Data Rate | 2Mbps |
| Power - Output | 4dBm |
| Sensitivity | -96dBm |
| Serial Interfaces | I2C, I2S, SPI, UART |
| Antenna Type | Integrated, Trace |
| Utilized IC / Part | nRF52810 |
| Memory Size | 192kB Flash, 24kB RAM |
| Voltage - Supply | 1.7V ~ 3.6V |
| Current - Receiving | 11.2mA |
| Current - Transmitting | 15mA |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C |
| Package / Case | 47-SMD Module |
概要
Description
BMD-330-A-R is a specific designation that typically refers to a type of advanced material or component used in engineering or manufacturing. The "BMD" prefix may indicate a particular series or category, while "330" could denote its model number or a specific characteristic, such as size or capacity. The "A-R" suffix might represent a variant or revision of the base model.
Such designations are commonly utilized in sectors like aerospace, automotive, or other technical fields to classify parts with particular performance attributes or specifications. Understanding the context in which BMD-330-A-R is used is essential for its application, whether it pertains to mechanical properties, thermal resistance, or other critical factors.
For precise details, consulting technical documentation or manufacturer's guidelines related to BMD-330-A-R is recommended, as this will provide in-depth information about its application, compatibility, and performance metrics.
Such designations are commonly utilized in sectors like aerospace, automotive, or other technical fields to classify parts with particular performance attributes or specifications. Understanding the context in which BMD-330-A-R is used is essential for its application, whether it pertains to mechanical properties, thermal resistance, or other critical factors.
For precise details, consulting technical documentation or manufacturer's guidelines related to BMD-330-A-R is recommended, as this will provide in-depth information about its application, compatibility, and performance metrics.
Features
The BMD-330-A-R is a compact, high-performance device designed for various applications, primarily in automation and control systems. Key features include:
1. Robust Construction: Built with durable materials to withstand harsh environments.
2. Versatile Connectivity: Supports multiple communication protocols, including Ethernet, RS-232, and RS-485 for seamless integration.
3. High Processing Power: Equipped with a powerful microcontroller for efficient data processing and fast response times.
4. User-Friendly Interface: Features intuitive controls and a clear display for easy operation and monitoring.
5. Expanded I/O Options: Multiple input/output ports for connecting various sensors and actuators.
6. Energy Efficiency: Designed for low power consumption, promoting sustainability in operations.
7. Scalability: Easily adaptable for different project requirements, making it suitable for both small and large-scale implementations.
8. Safety Features: Incorporates built-in safety mechanisms to protect against overloads and short circuits.
These features make the BMD-330-A-R an ideal choice for industrial automation, robotics, and smart control applications.
1. Robust Construction: Built with durable materials to withstand harsh environments.
2. Versatile Connectivity: Supports multiple communication protocols, including Ethernet, RS-232, and RS-485 for seamless integration.
3. High Processing Power: Equipped with a powerful microcontroller for efficient data processing and fast response times.
4. User-Friendly Interface: Features intuitive controls and a clear display for easy operation and monitoring.
5. Expanded I/O Options: Multiple input/output ports for connecting various sensors and actuators.
6. Energy Efficiency: Designed for low power consumption, promoting sustainability in operations.
7. Scalability: Easily adaptable for different project requirements, making it suitable for both small and large-scale implementations.
8. Safety Features: Incorporates built-in safety mechanisms to protect against overloads and short circuits.
These features make the BMD-330-A-R an ideal choice for industrial automation, robotics, and smart control applications.
Package
The BMD-330-A-R is typically available in a compact, surface-mount package type, designed for efficient integration into electronic circuits. Its small form factor facilitates space-saving designs in various applications.
Pinout
The BMD-330-A-R is a Bluetooth Low Energy (BLE) module developed by BMD. It features a pin count of 20 pins. The primary functions of these pins include power supply, ground, UART communication, GPIOs, and additional functionalities such as I2C and SPI interfaces.
Key pins include:
- VCC: Power supply input.
- GND: Ground connection.
- TX/RX: UART interface for serial communication.
- GPIO: General-purpose input/output pins for various application needs.
- I2C/SPI: For connecting sensors and other peripherals.
This module is designed for seamless integration into various applications requiring wireless connectivity while maintaining low power consumption.
Key pins include:
- VCC: Power supply input.
- GND: Ground connection.
- TX/RX: UART interface for serial communication.
- GPIO: General-purpose input/output pins for various application needs.
- I2C/SPI: For connecting sensors and other peripherals.
This module is designed for seamless integration into various applications requiring wireless connectivity while maintaining low power consumption.
Manufacturer
The BMD-330-A-R is manufactured by BMD (Bharat Electronics Limited), an Indian state-owned aerospace and defense company. Bharat Electronics is primarily involved in the design, development, and manufacturing of advanced electronic products for various defense applications, including radar systems, communication equipment, and missile systems. The company plays a significant role in India's defense sector and is recognized for its contributions to national security through innovation in technology.
Application
The BMD-330-A-R is commonly used in various application areas including military communications, tactical data links, drone operations, and remote sensing. Its robust design enables reliable performance in challenging environments, making it suitable for defense and aerospace sectors. Additionally, it may be utilized in research and development for advanced communication systems and in commercial applications requiring secure data transmission.
Equivalent
The BMD-330-A-R chip is a Bluetooth Low Energy module from Rigado. Equivalent products include the Nordic Semiconductor nRF52840, Texas Instruments CC2640R2F, and Cypress CYBLE-022001-00. These alternatives offer similar Bluetooth capabilities and functionality suitable for IoT applications.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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