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BM6104FV-CE2

Name: BM6104FV-CE2
Rating: 4.7 (12 reviews)

DGTL ISO 2.5KV 1CH GT DVR 20SSOP

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Mfr。パート #BM6104FV-CE2
パッケージ
データシート
在庫中13536

+BOM RFQについて

100% オリジナル &新しい

出荷の準備ができている24時間

365日の保証

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仕様

Part Status	Active
Technology	Magnetic Coupling
Number of Channels	1
Voltage - Isolation	2500Vrms
Common Mode Transient Immunity (Min)	100kV/µs
Propagation Delay tpLH / tpHL (Max)	150ns, 150ns
Rise / Fall Time (Typ)	50ns, 50ns
Current - Peak Output	5A, 1A
Voltage - Output Supply	10V ~ 24V
Grade	Automotive
Operating Temperature	-40°C ~ 125°C
Mounting Type	Surface Mount
Package / Case	20-SSOP (0.240", 6.10mm Width)
Supplier Device Package	20-SSOP-BW
Approval Agency	UR
Base Product Number	BM6104
Qualification	AEC-Q100

概要

Description

BM6104FV-CE2 is a high-performance, low-power, integrated circuit designed primarily for battery management applications. It features advanced functions such as cell balancing, overvoltage protection, undervoltage protection, and temperature monitoring, making it suitable for lithium-ion and lithium-polymer battery systems. The device supports multiple cell configurations, enabling use in various applications including electric vehicles, portable electronics, and renewable energy storage systems.
Its compact design and efficiency contribute to extended battery life and enhanced safety. Additionally, the BM6104FV-CE2 is equipped with internal diagnostics, providing real-time feedback on battery health and status. This IC is essential for optimizing battery performance and ensuring reliable operation in dynamic energy environments.

Features

The BM6104FV-CE2 is a highly integrated, low-power Bluetooth module designed for various wireless applications. Key features include:
1. Bluetooth Version: Supports Bluetooth 5.0, offering improved data rates and extended range.
2. Low Power Consumption: Optimized for battery-operated devices, it features a low-power sleep mode.
3. Compact Size: Small form factor makes it suitable for space-constrained applications.
4. Built-in Antenna: Integrated antenna design simplifies the implementation and reduces component count.
5. Multiple Interface Options: Supports UART, SPI, and I2C interfaces for easy integration with microcontrollers.
6. Data Rate: Capable of achieving high data rates (up to 2 Mbps).
7. Secure Connections: Incorporates advanced security features like AES encryption for secure communication.
8. Firmware Upgradeable: Supports Over-the-Air (OTA) firmware updates for easy feature enhancements.
This module is ideal for IoT devices, wearables, and industrial applications, providing reliable wireless connectivity.

Package

The BM6104FV-CE2 is packaged in a QFN (Quad Flat No-leads) format, specifically a 32-pin QFN package. This type of packaging offers a compact design suitable for space-constrained applications and provides efficient thermal and electrical performance.

Pinout

The BM6104FV-CE2 is a 48-pin QFN (Quad Flat No-lead) package. It is primarily designed for audio applications, particularly in Bluetooth audio systems. The device features multiple pins for powering the device, ground connections, input and output for audio signals, and various control interfaces.
Key functions include:
- Audio processing: Supports digital signal processing (DSP) for audio enhancement.
- I2C/SPI interfaces: For communication with microcontrollers or other devices.
- Power management: Includes pins for power supply and ground to ensure proper operation.
- Audio input/output: Dedicated pins for connecting microphones, speakers, or other audio inputs/outputs.
For complete details on pin assignments and specific functions, refer to the manufacturer's datasheet.

Manufacturer

The BM6104FV-CE2 is manufactured by Bourns, Inc. Bourns is a global company specializing in electronic components, particularly in the fields of sensor technologies, circuit protection, and communication equipment. Established in 1947, Bourns focuses on innovation and quality in the electronic components industry, providing products such as potentiometers, encoders, and other passive components. The company serves a wide range of markets, including automotive, telecommunications, medical devices, and consumer electronics, making it a key player in the electronics manufacturing sector.

Application

The BM6104FV-CE2 is a versatile microcontroller primarily used in embedded systems for applications such as motor control, robotics, consumer electronics, and industrial automation. It is suitable for tasks requiring efficient processing, real-time control, and communication capabilities in compact designs.

Equivalent

The BM6104FV-CE2 chip is a Bluetooth audio SoC. Equivalent products include the CSR8670, Nordic Semiconductor nRF52840, and the Realtek RTL8763B. These alternatives also support Bluetooth audio functionality and may offer similar features for audio processing and connectivity. Always verify specific requirements and compatibility when selecting alternatives.