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BGM123A256V2
RF TXRX MOD BLUETOOTH CHIP SMD
- メーカー
- Mfr。パート #BGM123A256V2
- パッケージ
- データシート BGM123A256V2 DataSheet
- 在庫中26249
100% オリジナル &新しい
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365日の保証
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仕様
| Part Status | Active |
| RF Family/Standard | Bluetooth |
| Protocol | Bluetooth v4.2 |
| Modulation | GFSK |
| Frequency | 2.4GHz |
| Data Rate | 1Mbps |
| Power - Output | 8dBm |
| Sensitivity | -90dBm |
| Serial Interfaces | I2C, I2S, SPI, UART |
| Antenna Type | Integrated, Chip |
| Utilized IC / Part | EFR32BG |
| Memory Size | 256kB Flash, 32kB RAM |
| Voltage - Supply | 1.85V ~ 3.8V |
| Current - Receiving | 9mA |
| Current - Transmitting | 8.2mA |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C |
| Package / Case | 56-SMD Module |
| Base Product Number | BGM123 |
| DigiKey Programmable | Not Verified |
概要
Description
BGM123A256V2 is a versatile Bluetooth 5.1 module designed for IoT applications, developed by Silicon Labs. It features an ultra-low-power ARM Cortex-M33 processor, enabling efficient operation in battery-powered devices. With integrated Bluetooth Low Energy (BLE) support, it facilitates seamless wireless communication for smart home devices, wearables, and industrial applications.
This module includes 256 kB of flash memory and 32 kB of RAM, providing ample storage for applications and firmware updates. Its compact design makes it suitable for space-constrained environments, while its robust performance ensures reliable connectivity over extended ranges.
The BGM123A256V2 also supports various development tools and software environments, enabling developers to quickly prototype and deploy applications. Its combination of low energy consumption, high performance, and ease of integration makes it an ideal choice for modern connected devices.
This module includes 256 kB of flash memory and 32 kB of RAM, providing ample storage for applications and firmware updates. Its compact design makes it suitable for space-constrained environments, while its robust performance ensures reliable connectivity over extended ranges.
The BGM123A256V2 also supports various development tools and software environments, enabling developers to quickly prototype and deploy applications. Its combination of low energy consumption, high performance, and ease of integration makes it an ideal choice for modern connected devices.
Features
The BGM123A256V2 is a Bluetooth system-on-chip (SoC) designed for low-power applications, primarily in the Internet of Things (IoT) space. Key features include:
1. Bluetooth 5.2 Support: Enables long-range communication and enhanced data transfer rates.
2. Low Energy Consumption: Optimized for battery-powered devices, ensuring extended operational life.
3. Integrated Antenna: Simplifies design and reduces the need for external components.
4. 256 kB RAM and 1 MB Flash Memory: Provides ample storage for applications and firmware.
5. Multiple I/O Options: Supports various interfaces such as GPIO, SPI, I2C, and UART for versatile connectivity.
6. Flexible Power Management: Multiple sleep modes to optimize power consumption based on application needs.
7. Development Ecosystem: Compatible with Simplicity Studio for easy development and debugging.
8. Secure Firmware Updates: Supports over-the-air updates to ensure device security and functionality.
These features make the BGM123A256V2 ideal for smart home devices, wearables, and other connected applications.
1. Bluetooth 5.2 Support: Enables long-range communication and enhanced data transfer rates.
2. Low Energy Consumption: Optimized for battery-powered devices, ensuring extended operational life.
3. Integrated Antenna: Simplifies design and reduces the need for external components.
4. 256 kB RAM and 1 MB Flash Memory: Provides ample storage for applications and firmware.
5. Multiple I/O Options: Supports various interfaces such as GPIO, SPI, I2C, and UART for versatile connectivity.
6. Flexible Power Management: Multiple sleep modes to optimize power consumption based on application needs.
7. Development Ecosystem: Compatible with Simplicity Studio for easy development and debugging.
8. Secure Firmware Updates: Supports over-the-air updates to ensure device security and functionality.
These features make the BGM123A256V2 ideal for smart home devices, wearables, and other connected applications.
Package
The BGM123A256V2 is typically available in a QFN (Quad Flat No-lead) package type. This package style is compact and suitable for surface mounting, making it ideal for space-constrained applications in IoT devices and other electronics.
Pinout
The BGM123A256V2 is a Bluetooth SoC (System-on-Chip) from Silicon Labs, featuring a total of 32 pins. This device is part of the Blue Gecko family and is designed for low-power Bluetooth applications, specifically Bluetooth 5.0.
The pin functions include:
- Power Supply: VDD and GND pins for power.
- GPIOs: General-purpose input/output pins for interfacing with other components.
- UART/I2C/SPI: Communication interfaces for serial data transmission.
- Reset: Pin for resetting the device.
- Analog Inputs: ADC pins for reading analog signals.
- RF Ports: Antenna connection for wireless communication.
The BGM123A256V2 is optimized for low energy consumption and includes integrated features like a power amplifier and various peripherals, making it suitable for IoT applications.
The pin functions include:
- Power Supply: VDD and GND pins for power.
- GPIOs: General-purpose input/output pins for interfacing with other components.
- UART/I2C/SPI: Communication interfaces for serial data transmission.
- Reset: Pin for resetting the device.
- Analog Inputs: ADC pins for reading analog signals.
- RF Ports: Antenna connection for wireless communication.
The BGM123A256V2 is optimized for low energy consumption and includes integrated features like a power amplifier and various peripherals, making it suitable for IoT applications.
Manufacturer
The BGM123A256V2 is manufactured by Silicon Labs, a company known for its focus on the Internet of Things (IoT), automotive, and industrial automation sectors. Silicon Labs specializes in designing and developing semiconductors, software, and solutions for a wide range of applications, particularly in wireless communication, microcontrollers, and sensors. Established in 1996 and headquartered in Austin, Texas, Silicon Labs is recognized for its innovation in low-power, high-performance technologies that enable connected devices and smart systems.
Application
BGM123A256V2 is a wireless SoC (System-on-Chip) used primarily in Internet of Things (IoT) applications. Key application areas include smart home devices, industrial automation, health monitoring systems, and wearable technology. It is suitable for low-power, long-range communication, enabling connectivity in smart grids, asset tracking, and environmental monitoring systems.
Equivalent
The BGM123A256V2 chip is commonly equivalent to other Bluetooth Low Energy (BLE) and radio frequency (RF) modules, like the Silicon Labs BGM123 series, Nordic Semiconductor nRF52832, and nRF52840. For precise equivalency, consider specifications, protocols, and intended applications. Always check manufacturer documentation for compatibility.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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