画像は参照用のみです。
BCM68621B0IFSBG
8XGPON/8XEPON OLT, I-TEMP
- メーカー
- Mfr。パート #BCM68621B0IFSBG
- パッケージ
- データシート
- 在庫中9192
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
RFQおよびもっと割引を得る
仕様
| Part Status | Active |
| Function | EPON OLT |
| Operating Temperature | -40°C ~ 85°C |
概要
Description
The BCM68621B0IFSBG is a highly integrated wireless communication processor developed by Broadcom. It is part of the BCM6862x family, designed primarily for broadband applications such as DSL and cable modems, as well as residential gateways. The chip incorporates advanced features including multiple Ethernet ports, VoIP capabilities, and support for various broadband standards, enhancing data transmission efficiency and reliability.
The BCM68621B0IFSBG supports high-speed data rates and is optimized for power efficiency, making it suitable for consumer and enterprise networking devices. It also features integrated security protocols to ensure safe data transmission. The processor typically operates in conjunction with other Broadcom components to provide a complete solution for modern networking needs.
Overall, the BCM68621B0IFSBG stands out for its versatility, performance, and ability to support a wide range of broadband technologies, catering to the growing demands for high-speed internet connectivity.
The BCM68621B0IFSBG supports high-speed data rates and is optimized for power efficiency, making it suitable for consumer and enterprise networking devices. It also features integrated security protocols to ensure safe data transmission. The processor typically operates in conjunction with other Broadcom components to provide a complete solution for modern networking needs.
Overall, the BCM68621B0IFSBG stands out for its versatility, performance, and ability to support a wide range of broadband technologies, catering to the growing demands for high-speed internet connectivity.
Features
The BCM68621B0IFSBG is a Bluetooth Low Energy (BLE) System-on-Chip (SoC) designed for various wireless applications. Key features include:
1. Bluetooth 5.0: Supports enhanced data rates, improved range, and greater broadcast capacity.
2. Low Power Consumption: Optimized for battery-operated devices, allowing for extended operational life.
3. Integrated RF Transceiver: Provides a compact solution with good performance in signal transmission and reception.
4. Flexible Memory Options: Includes both SRAM and flash memory for firmware and application storage.
5. Advanced Security Features: Supports secure connections and encryption, ensuring data protection.
6. Rich Peripheral Interfaces: Includes GPIO, I2C, SPI, UART, and ADC for connectivity and sensor integration.
7. Development Support: Compatible with various development tools and software, facilitating rapid prototyping.
These features make the BCM68621B0IFSBG suitable for applications such as wearables, smart home devices, and Internet of Things (IoT) solutions.
1. Bluetooth 5.0: Supports enhanced data rates, improved range, and greater broadcast capacity.
2. Low Power Consumption: Optimized for battery-operated devices, allowing for extended operational life.
3. Integrated RF Transceiver: Provides a compact solution with good performance in signal transmission and reception.
4. Flexible Memory Options: Includes both SRAM and flash memory for firmware and application storage.
5. Advanced Security Features: Supports secure connections and encryption, ensuring data protection.
6. Rich Peripheral Interfaces: Includes GPIO, I2C, SPI, UART, and ADC for connectivity and sensor integration.
7. Development Support: Compatible with various development tools and software, facilitating rapid prototyping.
These features make the BCM68621B0IFSBG suitable for applications such as wearables, smart home devices, and Internet of Things (IoT) solutions.
Package
The BCM68621B0IFSBG is typically packaged in a 28-pin QFN (Quad Flat No-lead) package. This compact form factor is designed for efficient thermal performance and space-saving in electronic applications.
Pinout
The BCM68621B0IFSBG is a highly integrated SoC (System on Chip) designed by Broadcom for broadband applications, typically found in cable modems and gateways. It features a pin count of 208 pins in a FCLGA (Fine Pitch Ball Grid Array) package.
The primary functions of the BCM68621B0IFSBG include:
1. Data Processing: It supports high-speed data throughput, suitable for DOCSIS standards.
2. Integrated CPU: It includes a processing unit for managing data flow and device operations.
3. Networking Capabilities: It features Ethernet interfaces for connecting to local networks, including support for upstream/downstream data transmission.
4. Memory Interface: It is designed to interface with external memory for enhanced performance.
This SoC is designed for high-performance applications, enabling efficient data handling and network connectivity in residential and commercial settings.
The primary functions of the BCM68621B0IFSBG include:
1. Data Processing: It supports high-speed data throughput, suitable for DOCSIS standards.
2. Integrated CPU: It includes a processing unit for managing data flow and device operations.
3. Networking Capabilities: It features Ethernet interfaces for connecting to local networks, including support for upstream/downstream data transmission.
4. Memory Interface: It is designed to interface with external memory for enhanced performance.
This SoC is designed for high-performance applications, enabling efficient data handling and network connectivity in residential and commercial settings.
Manufacturer
The BCM68621B0IFSBG is manufactured by Broadcom Inc., a prominent technology company based in the United States. Broadcom specializes in designing and supplying a wide range of semiconductor and infrastructure software solutions. Their products are utilized in various sectors, including networking, broadband, enterprise storage, and wireless communications. Broadcom is well-known for its innovations in wired and wireless communication technologies, making it a key player in the global semiconductor industry. The company serves a diverse range of customers, from large enterprises to consumer electronics manufacturers, and is recognized for its contributions to advancing connectivity technologies.
Application
The BCM68621B0IFSBG is a Broadcom system-on-chip (SoC) primarily used in broadband networking applications, such as DSL and cable modems, routers, and gateways. It supports high-speed data transmission, enabling efficient internet connectivity and network management. Its integration of multiple functionalities makes it suitable for home networking devices, smart home applications, and Internet of Things (IoT) solutions.
Equivalent
The BCM68621B0IFSBG chip, a broadband modem and router SoC by Broadcom, has equivalent products like the Qualcomm QCA9563, MediaTek MT7621A, and Intel Puma 7 series. These alternatives offer similar functionalities for networking applications, including Wi-Fi and Ethernet connectivity. Always verify compatibility for specific use cases.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
支払い
Payment Methods
支払い期間は100%前払いです。
現在、下記の支払い方法のみを受け入れています。:
1. ペイパル
2. クレジット・デビットカード
3. ワイヤー 転送
類似
-
MX25L3233FZBI-08Q
Macronix
-
MX25L3233FM1I-08Q
Macronix
-
MX25V1635FZNI
Macronix
-
MX66U1G45GXDI00
Macronix
-
MX25V4035FZUI
Macronix
-
MX25L25673GMI-08G
Macronix
-
MX25L25673GMI-10G
Macronix
-
MX25L2006EM1I-12G
Macronix
-
MX25R1635FZUIH0
Macronix
-
MX25U3232FZBI02
Macronix
-
MX25L12833FZ2I-10..
Macronix
-
MX25U25645GXDI00
Macronix