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BCM6752A2KFEBG
2X2 11AX SOC W SWITCH, 15X15PKG
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- Mfr。パート #BCM6752A2KFEBG
- パッケージ
- データシート
- 在庫中7484
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
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仕様
| Package | Tray |
| ProductStatus | Active |
| Function | Switch |
概要
Description
The BCM6752A2KFEBG is a system-on-chip (SoC) developed by Broadcom, primarily designed for mobile and consumer electronics applications. It integrates a multi-core processor architecture, supporting advanced computing needs while optimizing power efficiency. The SoC typically features integrated GPU capabilities, enhancing graphics performance for gaming and multimedia applications.
Key specifications may include support for high-speed connectivity standards such as Wi-Fi and Bluetooth, enabling seamless communication with other devices. Additionally, it may support various multimedia codecs for video and audio processing, making it suitable for streaming applications.
The BCM6752A2KFEBG is known for its versatility in powering smartphones, tablets, and other portable devices, providing manufacturers with a reliable solution for delivering high-performance user experiences. Its architecture is designed to accommodate the demands of modern applications, ensuring smooth multitasking and efficient power management.
Key specifications may include support for high-speed connectivity standards such as Wi-Fi and Bluetooth, enabling seamless communication with other devices. Additionally, it may support various multimedia codecs for video and audio processing, making it suitable for streaming applications.
The BCM6752A2KFEBG is known for its versatility in powering smartphones, tablets, and other portable devices, providing manufacturers with a reliable solution for delivering high-performance user experiences. Its architecture is designed to accommodate the demands of modern applications, ensuring smooth multitasking and efficient power management.
Features
The BCM6752A2KFEBG is a System-on-Chip (SoC) designed by Broadcom, primarily targeted at mobile and embedded applications. Key features include:
1. Processor Architecture: It typically features a multi-core ARM architecture, offering efficient processing power for mobile devices.
2. Integrated Graphics: The chip includes a GPU that supports 3D graphics and multimedia processing, enhancing gaming and video playback experiences.
3. Connectivity: It supports various wireless communication standards, including Wi-Fi, Bluetooth, and potentially GPS, facilitating seamless connectivity.
4. Power Efficiency: Designed for low power consumption, it enables extended battery life for mobile devices.
5. Multimedia Support: Enhanced multimedia capabilities for video encoding/decoding and high-resolution displays.
6. Scalability: The architecture allows for scalability in performance, making it suitable for a range of devices from smartphones to tablets.
7. Memory Support: It generally supports various memory types, enhancing data handling and speed.
These features make the BCM6752A2KFEBG suitable for a range of applications in the mobile and IoT sectors.
1. Processor Architecture: It typically features a multi-core ARM architecture, offering efficient processing power for mobile devices.
2. Integrated Graphics: The chip includes a GPU that supports 3D graphics and multimedia processing, enhancing gaming and video playback experiences.
3. Connectivity: It supports various wireless communication standards, including Wi-Fi, Bluetooth, and potentially GPS, facilitating seamless connectivity.
4. Power Efficiency: Designed for low power consumption, it enables extended battery life for mobile devices.
5. Multimedia Support: Enhanced multimedia capabilities for video encoding/decoding and high-resolution displays.
6. Scalability: The architecture allows for scalability in performance, making it suitable for a range of devices from smartphones to tablets.
7. Memory Support: It generally supports various memory types, enhancing data handling and speed.
These features make the BCM6752A2KFEBG suitable for a range of applications in the mobile and IoT sectors.
Package
The BCM6752A2KFEBG is packaged in a 28-pin QFN (Quad Flat No-lead) format, which allows for a compact design and efficient thermal performance.
Pinout
The BCM6752A2KFEBG is a system-on-chip (SoC) developed by Broadcom, primarily designed for mobile and IoT applications. It features a pin count of 100 pins in a FCLGA (Fine Pitch Ball Grid Array) package.
The primary functions of the BCM6752A2KFEBG include:
1. Processing Power: It integrates a multi-core ARM processor for efficient processing capabilities.
2. Graphics: It includes a GPU for handling graphics and display tasks.
3. Connectivity: Supports various communication interfaces, including Wi-Fi, Bluetooth, and other wireless protocols.
4. Multimedia: Capable of supporting video encoding/decoding and audio processing.
5. Peripheral Interfaces: Provides GPIOs, UART, I2C, SPI, and other interfaces for connecting peripherals.
This SoC is tailored for high-performance applications while maintaining low power consumption, making it suitable for modern mobile devices and smart systems.
The primary functions of the BCM6752A2KFEBG include:
1. Processing Power: It integrates a multi-core ARM processor for efficient processing capabilities.
2. Graphics: It includes a GPU for handling graphics and display tasks.
3. Connectivity: Supports various communication interfaces, including Wi-Fi, Bluetooth, and other wireless protocols.
4. Multimedia: Capable of supporting video encoding/decoding and audio processing.
5. Peripheral Interfaces: Provides GPIOs, UART, I2C, SPI, and other interfaces for connecting peripherals.
This SoC is tailored for high-performance applications while maintaining low power consumption, making it suitable for modern mobile devices and smart systems.
Manufacturer
The BCM6752A2KFEBG is manufactured by Broadcom Inc., a global technology company that specializes in semiconductors and infrastructure software. Broadcom designs and develops a wide range of products, including networking chips, broadband and wireless communication devices, and integrated circuits for various applications, such as data centers, enterprise, and service provider networks. The company was formed through the merger of Avago Technologies and Broadcom Corporation in 2016 and has since become one of the leading players in the semiconductor industry, known for its innovation and extensive product portfolio.
Application
The BCM6752A2KFEBG is a mobile application processor primarily used in smartphones and tablets. Its application areas include multimedia processing, gaming, augmented and virtual reality, and connectivity solutions like Wi-Fi and Bluetooth. It's designed for high-performance computing and efficient power management, catering to advanced mobile applications and enhanced user experiences in consumer electronics.
Equivalent
The BCM6752A2KFEBG chip, a Broadcom SoC for mobile devices, is typically equivalent to other Broadcom mobile processors such as the BCM6750 or BCM6755. Additionally, comparable chips from other manufacturers include Qualcomm Snapdragon series (e.g., Snapdragon 410) and MediaTek MT6735. However, exact equivalence may depend on specific application requirements and performance features. Always check datasheets for precise compatibility.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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