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BCM56870A0IFSBG
Broadcom Limited
- メーカー
- Mfr。パート #BCM56870A0IFSBG
- パッケージ
- データシート
- 在庫中29434
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
RFQおよびもっと割引を得る
仕様
概要
Description
The BCM56870A0IFSBG is a high-performance Ethernet switch chip developed by Broadcom, designed primarily for data center and enterprise networking applications. It supports advanced features such as Multi-Rate Ethernet, allowing for flexible configurations of 1G, 10G, 25G, and 100G interfaces. This switch is ideal for environments requiring high throughput and low latency, making it suitable for applications such as cloud computing, virtualized data centers, and network aggregation.
Key features include support for Layer 2/Layer 3 switching, deep packet buffering, and extensive Quality of Service (QoS) capabilities, which ensure efficient traffic management. The BCM56870 also offers robust security features and programmability, enabling customization to meet specific network requirements.
Its integration into various platforms enhances scalability and performance, making the BCM56870A0IFSBG a critical component for modern networking solutions that demand reliability and speed.
Key features include support for Layer 2/Layer 3 switching, deep packet buffering, and extensive Quality of Service (QoS) capabilities, which ensure efficient traffic management. The BCM56870 also offers robust security features and programmability, enabling customization to meet specific network requirements.
Its integration into various platforms enhances scalability and performance, making the BCM56870A0IFSBG a critical component for modern networking solutions that demand reliability and speed.
Features
The BCM56870A0IFSBG is a high-performance Ethernet switch chip from Broadcom, designed for data center and enterprise networking applications. Key features include:
1. Ports: Supports up to 48 10/25G Ethernet ports with additional options for 40/100G uplinks.
2. Architecture: Utilizes a non-blocking, multi-stage switching architecture for high throughput and low latency.
3. Scalability: Designed to handle large-scale deployments with support for advanced routing protocols.
4. Flexibility: Compatible with various network topologies and can be integrated into different networking architectures.
5. Management: Equipped with comprehensive management and monitoring capabilities, facilitating easy integration and operation.
6. Power Efficiency: Optimized for low power consumption while maintaining high performance, which is essential for energy-efficient data centers.
7. Quality of Service (QoS): Supports advanced QoS features to prioritize traffic and ensure reliable performance for mission-critical applications.
8. Security: Provides robust security features to protect against unauthorized access and other network threats.
These features make the BCM56870A0IFSBG suitable for high-capacity and high-efficiency networking environments.
1. Ports: Supports up to 48 10/25G Ethernet ports with additional options for 40/100G uplinks.
2. Architecture: Utilizes a non-blocking, multi-stage switching architecture for high throughput and low latency.
3. Scalability: Designed to handle large-scale deployments with support for advanced routing protocols.
4. Flexibility: Compatible with various network topologies and can be integrated into different networking architectures.
5. Management: Equipped with comprehensive management and monitoring capabilities, facilitating easy integration and operation.
6. Power Efficiency: Optimized for low power consumption while maintaining high performance, which is essential for energy-efficient data centers.
7. Quality of Service (QoS): Supports advanced QoS features to prioritize traffic and ensure reliable performance for mission-critical applications.
8. Security: Provides robust security features to protect against unauthorized access and other network threats.
These features make the BCM56870A0IFSBG suitable for high-capacity and high-efficiency networking environments.
Package
The BCM56870A0IFSBG is packaged in a FCLGA (Flip-Chip Land Grid Array) format. This compact package type is designed for high-performance networking applications, providing efficient thermal management and signal integrity.
Pinout
The BCM56870A0IFSBG is a high-performance network switch chip from Broadcom, specifically designed for data center applications. It features a total of 240 pins.
The primary functions of the BCM56870A0 include:
1. Layer 2 and Layer 3 Switching: It supports advanced switching capabilities for both Ethernet and IP traffic.
2. High Bandwidth: The device offers high throughput with support for up to 100G Ethernet interfaces.
3. Multi-Protocol Support: It can handle various network protocols and features like VLANs, QoS, and multicast.
4. Scalability: Designed for large-scale deployments, it facilitates scalability in data centers and enterprise networks.
5. Management Features: Integrated management and monitoring capabilities for efficient operation and troubleshooting.
This chip is often utilized in high-capacity network switches and routers to meet demanding data center requirements.
The primary functions of the BCM56870A0 include:
1. Layer 2 and Layer 3 Switching: It supports advanced switching capabilities for both Ethernet and IP traffic.
2. High Bandwidth: The device offers high throughput with support for up to 100G Ethernet interfaces.
3. Multi-Protocol Support: It can handle various network protocols and features like VLANs, QoS, and multicast.
4. Scalability: Designed for large-scale deployments, it facilitates scalability in data centers and enterprise networks.
5. Management Features: Integrated management and monitoring capabilities for efficient operation and troubleshooting.
This chip is often utilized in high-capacity network switches and routers to meet demanding data center requirements.
Manufacturer
The BCM56870A0IFSBG is manufactured by Broadcom Inc., a global technology company known for designing and developing a wide range of semiconductor and infrastructure software solutions. Broadcom specializes in various sectors, including networking, broadband, enterprise storage, and wireless communication. The BCM56870 series specifically refers to a family of Ethernet switch chips that are often used in data centers and high-performance networking applications. Broadcom is recognized for its innovation in the semiconductor industry and plays a significant role in enabling advanced communication technologies.
Application
The BCM56870A0IFSBG is a high-performance Ethernet switch designed for data center and enterprise networking applications. It supports advanced features like deep packet buffering, high-density 10/25/40/100 Gbps interfaces, and enhanced power efficiency. Key application areas include data center interconnects, cloud computing, enterprise networking, and service provider infrastructure, enabling scalable and efficient network management and high-speed data transfer.
Equivalent
The BCM56870A0IFSBG chip is a Broadcom Ethernet switch product. Equivalent products include the BCM56870A1IFSBG and BCM56870A2IFSBG, which may offer similar features and performance but could differ in specific configurations or capabilities. Additionally, other Broadcom chips in the same family, like the BCM56960 series, could serve as alternatives, depending on application requirements. Always consult product datasheets for detailed specifications and compatibility.
出荷
出荷方法私たち
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出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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