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BCM4554IFSBG
RF System on a Chip - SoC
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- Mfr。パート #BCM4554IFSBG
- パッケージ
- データシート
- 在庫中19384
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
RFQおよびもっと割引を得る
仕様
| Standard Pack Qty | 1176 |
概要
Description
BCM4554IFSBG is a part of Broadcom's family of integrated circuits, often used in telecommunications and networking applications. This specific component is typically a highly integrated mixed-signal chip that supports various wireless communication standards, including Wi-Fi and Bluetooth. It is designed for efficient power management and high performance, making it suitable for mobile devices, IoT applications, and smart home technologies. The "I" in the name may indicate an industrial grade, while "FSB" often refers to features like frequency stability or specific functionalities. Broadcom's BCM series chips are known for their versatility and reliability in delivering connectivity solutions across a range of devices.
Features
The BCM4554IFSBG is a highly integrated wireless communication chip from Broadcom, primarily designed for mobile and IoT applications. Key features include:
1. Multi-Protocol Support: It supports various wireless protocols, enabling flexibility in application development.
2. High Performance: Offers advanced processing capabilities and optimized power consumption for efficient operation.
3. Integrated RF Functionality: Combines RF front-end capabilities to simplify design and reduce component count.
4. Low Power Consumption: Designed for battery-operated devices, ensuring extended operational life.
5. Security Features: Enhanced security protocols for secure data transmission and protection against vulnerabilities.
6. Compact Form Factor: Small package size allows for easy integration into space-constrained designs.
7. Scalability: Suitable for a range of applications, from consumer electronics to industrial IoT.
Overall, the BCM4554IFSBG is intended to facilitate robust connectivity solutions while ensuring efficient performance and low energy usage.
1. Multi-Protocol Support: It supports various wireless protocols, enabling flexibility in application development.
2. High Performance: Offers advanced processing capabilities and optimized power consumption for efficient operation.
3. Integrated RF Functionality: Combines RF front-end capabilities to simplify design and reduce component count.
4. Low Power Consumption: Designed for battery-operated devices, ensuring extended operational life.
5. Security Features: Enhanced security protocols for secure data transmission and protection against vulnerabilities.
6. Compact Form Factor: Small package size allows for easy integration into space-constrained designs.
7. Scalability: Suitable for a range of applications, from consumer electronics to industrial IoT.
Overall, the BCM4554IFSBG is intended to facilitate robust connectivity solutions while ensuring efficient performance and low energy usage.
Package
The BCM4554IFSBG is packaged in a 32-pin LQFP (Low Profile Quad Flat Package). This type of package is designed for surface mounting and offers a compact footprint suitable for various electronic applications.
Pinout
The BCM4554IFSBG is a Broadcom chip with a pin count of 56. It is designed primarily for high-performance wireless networking applications, such as broadband gateways and routers. The chip integrates multiple functions, including a dual-core CPU, support for various wireless standards, and advanced security features. It typically facilitates tasks like data processing, signal transmission, and management of network protocols, thereby enhancing the efficiency and performance of networking devices. For specific pin functions, refer to the official datasheet for detailed information on I/O ports, power supply pins, and other functionalities.
Manufacturer
The BCM4554IFSBG is manufactured by Broadcom Inc., a global technology company headquartered in San Jose, California. Broadcom specializes in designing and developing a wide range of semiconductors and infrastructure software solutions. Their products are used in various applications, including networking, broadband, enterprise storage, wireless communications, and industrial sectors. Broadcom is known for its innovation in high-performance connectivity solutions and is a key player in the semiconductor industry, serving both consumer and enterprise markets.
Application
The BCM4554IFSBG is a Bluetooth System-on-Chip (SoC) used in various application areas, including wireless audio solutions, smart home devices, wearables, and IoT applications. It supports advanced audio processing, low-power operation, and robust connectivity, making it suitable for products like headphones, smart speakers, and home automation systems. Additionally, it can be utilized in automotive and industrial applications for seamless wireless communication.
Equivalent
The BCM4554IFSBG chip is a Broadcom device primarily used for 5G applications. Equivalent products may include Qualcomm's QCA6390, MediaTek's MT7921, and Intel's AX200, which also support advanced wireless communication standards. However, specific equivalency can depend on particular use cases and capabilities, so it's essential to check compatibility and specifications based on your application needs.
出荷
出荷方法私たち
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出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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