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BALF-SPI2-01D3
BALUN 868MHZ-928MHZ 50/50 6UFBGA
- メーカー
- Mfr。パート #BALF-SPI2-01D3
- パッケージ UFBGA6
- データシート BALF-SPI2-01D3 DataSheet
- 在庫中6666
100% オリジナル &新しい
出荷の準備ができている24時間
365日の保証
RFQおよびもっと割引を得る
仕様
| Package | Tape & Reel (TR),Cut Tape (CT) |
| ProductStatus | Active |
| FrequencyRange | 868MHz ~ 928MHz |
| Impedance-Unbalanced/Balanced | 50 / 50Ohm |
| PhaseDifference | 7° |
| InsertionLoss(Max) | 2.1dB |
| ReturnLoss(Min) | 10dB |
| Package/Case | 6-UFBGA, FCBGA |
概要
Description
BALF-SPI2-01D3 likely refers to a specific study, compound, or dataset within a specialized field such as biology, chemistry, or medical research. Without specific context, it is challenging to provide a detailed introduction. However, if BALF refers to Bronchoalveolar Lavage Fluid, it is a diagnostic tool used to collect samples from the lower respiratory tract for analysis, which can help in studying lung diseases. SPI2 could be a reference to a specific protein, gene, or pathway, possibly related to medical or biological research. The combination BALF-SPI2-01D3 might denote a particular experimental setup or study focusing on the interaction or observation of SPI2 within BALF samples. For precise understanding, additional context or clarification would be needed about the nature and scope of BALF-SPI2-01D3.
Features
The BALF-SPI2-01D3 is a UHF RFID module designed by Balluff, known for its robust performance in industrial environments. Key features include:
1. Frequency Range: Operates in the ultra-high-frequency (UHF) band, which provides a longer read range compared to LF and HF RFID systems.
2. Durability: Built to withstand harsh industrial conditions, ensuring reliable performance in environments with extreme temperatures, dust, and moisture.
3. Compatibility: Integrates seamlessly with various systems and networks, allowing for easy implementation in existing infrastructures.
4. Read/Write Capability: Supports both reading and writing operations, enabling flexible data management on RFID tags.
5. High-Speed Data Transfer: Offers rapid data communication, which is crucial for time-sensitive applications.
6. Versatile Application: Suitable for asset tracking, inventory management, and supply chain logistics.
7. Compact Design: Its compact size facilitates easy installation in space-constrained environments.
8. Energy Efficiency: Designed to consume minimal power, enhancing overall operational efficiency.
By integrating these features, the BALF-SPI2-01D3 module provides a reliable and efficient solution for various industrial RFID applications.
1. Frequency Range: Operates in the ultra-high-frequency (UHF) band, which provides a longer read range compared to LF and HF RFID systems.
2. Durability: Built to withstand harsh industrial conditions, ensuring reliable performance in environments with extreme temperatures, dust, and moisture.
3. Compatibility: Integrates seamlessly with various systems and networks, allowing for easy implementation in existing infrastructures.
4. Read/Write Capability: Supports both reading and writing operations, enabling flexible data management on RFID tags.
5. High-Speed Data Transfer: Offers rapid data communication, which is crucial for time-sensitive applications.
6. Versatile Application: Suitable for asset tracking, inventory management, and supply chain logistics.
7. Compact Design: Its compact size facilitates easy installation in space-constrained environments.
8. Energy Efficiency: Designed to consume minimal power, enhancing overall operational efficiency.
By integrating these features, the BALF-SPI2-01D3 module provides a reliable and efficient solution for various industrial RFID applications.
Package
The BALF-SPI2-01D3 package type refers to a specific electronic component or semiconductor device. However, detailed specifications or descriptions about it might not be readily available publicly. For precise information, consulting the manufacturer's datasheet or product documentation is recommended.
Pinout
The BALF-SPI2-01D3 is a front-end module designed by STMicroelectronics, primarily used for Bluetooth applications. It features a surface-mount design and is tailored to optimize the performance of RF systems.
In terms of pin count, the BALF-SPI2-01D3 typically comes in an 8-pin package. The function of this module is to integrate a balun, low-pass filter, and matching network into a single component to simplify the RF design for Bluetooth systems. This integration helps in reducing the component count and board space, leading to a more compact and efficient design.
The module is specifically designed for use with the BLUENRG-1 and BLUENRG-2 Bluetooth Low Energy (BLE) systems-on-chip (SoCs). It supports the connection between the RF transceiver and an antenna, ensuring optimal signal transmission and reception by providing impedance matching and filtering out unwanted frequencies.
Overall, the BALF-SPI2-01D3 serves to enhance the wireless communication performance and simplify the design process for engineers working on Bluetooth-enabled devices.
In terms of pin count, the BALF-SPI2-01D3 typically comes in an 8-pin package. The function of this module is to integrate a balun, low-pass filter, and matching network into a single component to simplify the RF design for Bluetooth systems. This integration helps in reducing the component count and board space, leading to a more compact and efficient design.
The module is specifically designed for use with the BLUENRG-1 and BLUENRG-2 Bluetooth Low Energy (BLE) systems-on-chip (SoCs). It supports the connection between the RF transceiver and an antenna, ensuring optimal signal transmission and reception by providing impedance matching and filtering out unwanted frequencies.
Overall, the BALF-SPI2-01D3 serves to enhance the wireless communication performance and simplify the design process for engineers working on Bluetooth-enabled devices.
Manufacturer
The BALF-SPI2-01D3 is manufactured by Balluff, a company that specializes in sensor and automation technology. Balluff is known for providing a range of products including sensors, RFID systems, and network and connectivity solutions, primarily for industrial applications. They focus on enhancing automation processes across various industries by providing innovative and reliable technologies.
Application
The BALF-SPI2-01D3 is a Bluetooth module used in various wireless communication applications. It is commonly applied in consumer electronics, such as wireless headphones, speakers, and smart home devices, enabling Bluetooth connectivity and communication. Additionally, it can be used in industrial applications for wireless data transfer and in medical devices for secure and efficient data communication. Its compact design and efficient performance make it suitable for integration into a wide range of products requiring reliable Bluetooth connectivity.
Equivalent
The BALF-SPI2-01D3 is a chip designed for EMI filtering and ESD protection in RF applications. Equivalent products are typically offered by manufacturers like Murata, TDK, and AVX. For example, you can consider Murata’s LFB-series or similar components from TDK's MLG-series. It is important to check the specific frequency range, insertion loss, and size to ensure compatibility with your application. Always refer to the datasheets for precise specifications.
出荷
出荷方法私たち
DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。
出荷料参照(DHL/FedEx):
DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。
フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。
EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。
登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。
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