画像は参照用のみです。

B0322J5050AHF

Name: B0322J5050AHF
Rating: 4.7 (12 reviews)

BALUN 300MHZ-2.2GHZ 50/50 0805

メーカー
Mfr。パート #B0322J5050AHF
パッケージ 0805 (2012 Metric)
データシート
在庫中5115

+BOM RFQについて

100% オリジナル &新しい

出荷の準備ができている24時間

365日の保証

RFQおよびもっと割引を得る

仕様

Supplier	TTM Technologies, Inc.
Package	Tape & Reel (TR),Cut Tape (CT)
Series	Xinger®
ProductStatus	Active
FrequencyRange	300MHz ~ 2.2GHz
Impedance-Unbalanced/Balanced	50 / 50Ohm
PhaseDifference	17°
InsertionLoss(Max)	1.6dB
ReturnLoss(Min)	12.2dB
Package/Case	0805 (2012 Metric)

概要

Description

B0322J5050AHF is a manufacturer part number for a surface-mount ceramic capacitor (MLCC). The code typically encodes: footprint 0322 (about 3.2×2.2 mm), tolerance J (±5%), voltage rating 50 V, with the AHF suffix indicating a specific dielectric/grade per the maker.
Important caveat:
- The actual capacitance value and dielectric type (e.g., X7R, C0G) aren’t deduced from the number alone. You need the datasheet or BOM to confirm.
How to confirm quickly:
- Search the exact part number on distributors (Digi-Key, Mouser, Arrow) or the manufacturer site.
- Open the datasheet to read capacitance, dielectric, voltage, size, and recommended applications.
If you share the manufacturer or a link, I can pull the precise specs (capacitance, dielectric, tolerance, and recommended uses) for you.

Features

I’m missing the exact part type and manufacturer. B0322J5050AHF could refer to different families (MLCC capacitor, inductor, ferrite bead, PTC, etc.), and the features vary by device.
Please provide:
- Manufacturer or a datasheet/link
- Component type (capacitor, inductor, etc.)
Once you share that, I’ll list exact features (value/capacitance or inductance, voltage rating, tolerance, size, temperature coefficient, ESR, current rating, package, and any safety approvals).

Package

3222-size SMD package (3.2 × 2.2 mm). The 'J' denotes ±5% tolerance.

Application

Commonly used as an SMD high-capacitance ceramic capacitor. Applications: decoupling and bulk energy storage in switching regulators and VRMs; input/output filtering and EMI suppression in power, automotive, industrial, and consumer electronics; smoothing in motor drives and power stages; general PCB decoupling in servers, PCs, and telecom equipment.