AP6275PR3

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AP6275PR3

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100% オリジナル &新しい

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仕様

Manufacturer AMPAK Tech
Voltage - Supply 3.3V
Operating Temperature -30℃~+65℃
Frequency 2.4GHz
Output Power 14dBm
Sensitivity -87dBm

概要

Description

The AP6275PR3 is a high-performance, dual-band Wi-Fi and Bluetooth module designed for seamless wireless connectivity in various electronic devices. It integrates advanced IEEE 802.11 a/b/g/n/ac/ax standards, supporting both 2.4 GHz and 5 GHz frequencies, which allows for versatile applications in consumer electronics, IoT devices, and smart home products.
The module features a compact design, making it suitable for space-constrained applications, and offers excellent connectivity with improved power efficiency, which is essential for battery-operated devices. The AP6275PR3 also supports Bluetooth 5.0, which ensures fast data transfer rates with low energy consumption, making it ideal for applications that require simultaneous use of Wi-Fi and Bluetooth functionalities.
Additionally, the module is equipped with robust security protocols and supports WPA3 encryption, ensuring secure data transmission. It is designed for easy integration into various systems, with a range of interfaces available for developers to work with. Overall, the AP6275PR3 is well-suited for future-proofing wireless communications in an increasingly connected world.

Features

The AP6275P is a wireless module featuring advanced connectivity capabilities. Key features include:
1. Wi-Fi Support: It supports dual-band Wi-Fi (2.4 GHz and 5 GHz) with the 802.11ax (Wi-Fi 6) standard, providing high-speed wireless connectivity and improved network efficiency.

2. Bluetooth Integration: The module includes Bluetooth 5.2, offering enhanced data rates and extended range for IoT and personal area network applications.
3. Security: It incorporates WPA3 security protocols, offering better protection for data transmission over Wi-Fi networks.
4. Power Efficiency: Designed with power-saving technologies, it is suitable for battery-powered and portable devices.
5. High Throughput: Capable of supporting high data throughput with features like OFDMA and MU-MIMO, which enhance performance in dense environments.
6. Compact Form Factor: Its small size makes it ideal for integration into a wide range of devices, including IoT gadgets, consumer electronics, and industrial equipment.
7. Roaming and Stability: Offers seamless roaming capabilities and stable connectivity, which are critical for applications requiring consistent network performance.
The AP6275P is suitable for a variety of applications requiring robust and efficient wireless communication.

Package

The AP6275PR3 typically comes in a compact surface-mount package suitable for integration into electronic devices. It is often used in applications requiring wireless communication, such as Wi-Fi and Bluetooth connectivity. For specific information regarding dimensions and specifications, consult the datasheet provided by the manufacturer, such as Ampak or the relevant supplier.

Pinout

The AP6275P is a wireless module often used for Wi-Fi and Bluetooth connectivity, specifically supporting Wi-Fi 6 (802.11ax) and Bluetooth 5.1. However, detailed specifications such as the pin count can vary based on the manufacturer's design and packaging options, so this information should be verified in the specific technical documentation or datasheet provided by the manufacturer of the module.
In general, wireless modules like the AP6275P typically have numerous pins that serve various functions, including power supply, ground, digital interfaces (such as UART, SPI, SDIO), and RF connectors. These pins facilitate communication with a host processor and enable the module's wireless functionalities.
For precise and detailed information, including the exact pin count and specific pin functions, it is recommended to consult the datasheet or technical manual of the AP6275P module from the manufacturer or distributor.

Manufacturer

The AP6275PR3 is manufactured by AMPAK Technology Inc. AMPAK is a company that specializes in wireless communication modules. They provide a range of solutions incorporating WiFi, Bluetooth, and other wireless technologies. AMPAK's products are often used in applications such as Internet of Things (IoT) devices, consumer electronics, and industrial automation, reflecting their focus on enabling connectivity across various platforms and devices.

Application

The AP6275PR3 is typically used in wireless communication applications due to its integrated Wi-Fi and Bluetooth capabilities. It is suitable for IoT devices, smart home applications, industrial automation, and consumer electronics, providing reliable wireless connectivity and low power consumption. Its compact design and efficient performance make it ideal for embedding in various devices requiring robust wireless network integration.

Equivalent

The AP6275P is a Wi-Fi 6 + Bluetooth 5.2 module. Equivalent products include the Broadcom BCM43752, Qualcomm QCA6391, and Intel AX200 or AX210. These chips offer similar functionalities, such as supporting dual-band Wi-Fi 6 and Bluetooth 5.x, making them potential alternatives for applications requiring similar wireless connectivity features.

出荷

出荷方法私たち

DHL、FedEx、TNT、UPS、またはあなたの選択の他の運送業者を通じてグローバルな出荷サービスを提供します。


出荷料参照(DHL/FedEx):

DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。

フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。

UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。

TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。

EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。

登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。

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