A2T27S020GNR1

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A2T27S020GNR1

AIRFAST RF POWER LDMOS TRANSISTO

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仕様

Package Tape & Reel (TR)
ProductStatus Active
TransistorType LDMOS
Frequency 400MHz ~ 2.7GHz
Gain 21dB
Voltage-Test 28 V
CurrentRating(Amps) 10µA
Current-Test 185 mA
Power-Output 20W
Voltage-Rated 65 V
Package/Case TO-270BA

概要

Description

The A2T27S020GNR1 is a specific model of semiconductor device, typically categorized as a memory chip or integrated circuit. It is commonly used in various electronic applications, including consumer electronics, communications, and computing systems.
Key features may include high-density data storage, low power consumption, and fast read/write speeds, which make it suitable for tasks requiring efficient data management. The "A2" prefix often indicates the manufacturer or family of products, while "T27" may refer to specific performance or technical parameters. The "S020G" could denote the storage capacity (20 Gigabits/Bytes) and functionality.
In product design, the A2T27S020GNR1 is valued for its reliability and compact form factor, facilitating integration into modern devices. Understanding its specifications, including voltage, temperature ranges, and interface compatibility, is essential for engineers and developers when incorporating it into their projects.

Features

The A2T27S020GNR1 is a high-performance integrated circuit featuring a 2Mbit (256K x 8) synchronous SRAM with a wide range of applications in embedded systems. Key features include:
1. High-Speed Operation: It supports fast access times, facilitating quick data retrieval and improved system performance.
2. Low Power Consumption: Designed for energy efficiency, it is suitable for battery-operated devices.
3. Single Supply Voltage: Typically operates on a 3.3V power supply, simplifying system design.
4. Synchronous Interface: Provides a synchronous interface for streamlined data transfer between the memory and the CPU, enhancing throughput.
5. Configurable Burst Length: Offers flexible burst lengths for optimized data handling.
6. Asynchronous Read/Write: Supports both read and write operations, allowing for dynamic memory usage.
7. Wide Operating Temperature Range: Suitable for industrial and automotive applications.
These features make the A2T27S020GNR1 ideal for use in telecommunications, networking equipment, and other applications requiring reliable, high-speed memory solutions.

Package

The A2T27S020GNR1 is packaged in a TFBGA (Thin Fine Pitch Ball Grid Array) configuration. This type of package features a grid of solder balls on the underside, allowing for a compact design and efficient thermal management.

Pinout

The A2T27S020GNR1 is a 2 Megabit (256K x 8) CMOS Static Random Access Memory (SRAM) chip. It features a pin count of 28 pins.
The pin functions include:
- Address Pins (A0-A7): Used for addressing memory locations.
- Data Pins (D0-D7): Bidirectional data lines for reading and writing data.
- Chip Enable (CE): Activates the chip for read or write operations.
- Write Enable (WE): Controls write operations; when low, data can be written to the memory.
- Output Enable (OE): Controls the output of data; when low, data is available on the data bus.
- VCC: Power supply input.
- GND: Ground connection.
This SRAM is typically used in applications requiring fast access times and low power consumption, making it suitable for various embedded systems.

Manufacturer

The A2T27S020GNR1 is manufactured by Aptina Imaging, which is a subsidiary of ON Semiconductor. Aptina specializes in imaging sensors and semiconductor technologies, particularly for applications in consumer electronics, automotive, and industrial markets. The company is known for its advanced image sensor solutions, catering to a wide range of devices, including smartphones, tablets, and cameras. ON Semiconductor, the parent company, is a global supplier of semiconductor-based solutions and focuses on energy-efficient electronics and innovative technologies across various sectors, including automotive, communication, and industrial applications.

Application

The A2T27S020GNR1 is a type of advanced packaging technology used primarily in high-performance computing, telecommunications, and consumer electronics. Its application areas include data centers, automotive electronics, and IoT devices, where efficient power management and thermal performance are critical. This packaging solution enhances device reliability and efficiency, making it suitable for applications requiring compact form factors and high-speed data processing.

Equivalent

The A2T27S020GNR1 chip is a flash memory device. Equivalent products may include the A2T27S020GNR, A2T27S020GNR2, or similar flash memory chips from manufacturers such as Microchip, Cypress, or Winbond. Always verify compatibility based on specific application requirements like voltage, speed, and pin configuration.

出荷

出荷方法私たち

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出荷料参照(DHL/FedEx):

DHL の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は2〜5営業日です。

フェデックス: 配送費は25ドル〜40ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。

UPS の: 配送費は25ドル〜45ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。

TNT社: 配送費は25ドル〜65ドル(0.5kg)の範囲で、推定配送時間は3〜7営業日。

EMS: 配送料金は30〜50ドル(0.5kg)の範囲で、推定配送時間は7〜15営業日です。

登録航空郵便: 配送費は2〜4ドル(0.1kg)で、推定配送時間は5〜20営業日です。

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Payment Methods

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